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公开(公告)号：US20230088168A1
公开(公告)日：2023-03-23
申请号：US17483789
申请日：2021-09-23
发明人： Brandon R. Christenson , Phillip V. Mann , Christopher Lee Tuma , George Russell Zettles, IV , Matthew A. Walther , Ray Clement Laning
IPC分类号： H05K7/14
摘要： An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.
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公开(公告)号：US20220201859A1
公开(公告)日：2022-06-23
申请号：US17131897
申请日：2020-12-23
摘要： An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.
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公开(公告)号：US20200296863A1
公开(公告)日：2020-09-17
申请号：US16354642
申请日：2019-03-15
IPC分类号： H05K7/20
摘要： An apparatus for cooling warm air, including a rack containing one or more ventilation slots; a reservoir connected to the rack that contains a cooling solution; and a plurality of components, located within the rack, that receive and distribute the cooling solution from the reservoir. The plurality of components consist of at least one of the following structures: one or more hollow vertical louvers, one or more hollow horizontal louvers, one or more hollow diagonal louvers, and one or more hollow cylindrical louvers. Additionally, the plurality of components may comprise a flexible material that descends from a top portion of the rack, directly below the reservoir, at the same time that an activation component causes the cooling solution to flow from the reservoir into the flexible material.
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公开(公告)号：US10750623B2
公开(公告)日：2020-08-18
申请号：US15593610
申请日：2017-05-12
摘要： A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.
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公开(公告)号：US10331911B2
公开(公告)日：2019-06-25
申请号：US15197309
申请日：2016-06-29
摘要： An electromagnetic radiation (EMR) receiver is located upon a printed circuit board (PCB) glass security layer. EMR flux is transmitted by the glass security layer and received by the EMR receiver. When the PCB is subject to a tamper event the EMR transmitted by glass security layer is increased. A monitoring device that monitors the flux or interference pattern of the EMR received by the EMR receiver detects a change in flux or interference pattern and passes a tamper signal to one or more computer system devices to respond to the tamper event. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.
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公开(公告)号：US10295270B2
公开(公告)日：2019-05-21
申请号：US15044375
申请日：2016-02-16
摘要： A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.
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公开(公告)号：US20180259381A1
公开(公告)日：2018-09-13
申请号：US15979453
申请日：2018-05-14
IPC分类号： G01F1/688 , H01L23/467 , H01L23/34
CPC分类号： G01F1/6888 , H01L23/34 , H01L23/467
摘要： An airflow sensor for a heat sink has a substantially flat base portion and a deformable upper portion electrically coupled to the base portion that contacts a conductive strip. As airflow increases, the deformable upper portion deforms and moves away from the source of airflow, which moves the point of contact between the deformable upper portion and the conductive strip farther away from the source of the airflow. The difference in the point of contact is measured, and is used to characterize the airflow sensor for different airflows. Data from the airflow sensor can then be logged during system operation. When needed, the data from the airflow sensor can be read from the log and converted to airflow using the airflow sensor characterization data. In this manner the airflow through a heat sink may be dynamically measured, allowing analysis and correlation between system events and airflow through the heat sink.
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公开(公告)号：US09954338B2
公开(公告)日：2018-04-24
申请号：US14277961
申请日：2014-05-15
IPC分类号： H01R43/26 , H01R13/64 , H01R13/66 , H01R13/447
CPC分类号： H01R43/26 , H01R13/447 , H01R13/64 , H01R13/665 , Y10T29/49117
摘要： A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.
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公开(公告)号：US20180098438A1
公开(公告)日：2018-04-05
申请号：US15821042
申请日：2017-11-22
摘要： A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
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公开(公告)号：US20180073824A1
公开(公告)日：2018-03-15
申请号：US15813435
申请日：2017-11-15
CPC分类号： F28F27/00 , F28D2021/0029 , F28F3/02 , F28F2200/00 , G01F1/383 , G01F1/56 , G01F1/69
摘要： An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.
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