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公开(公告)号：US11058337B2
公开(公告)日：2021-07-13
申请号：US15424265
申请日：2017-02-03
发明人： Qianwen Chen , Huan Hu , Zheng Xu , Xin Zhang
摘要： A method is presented for forming a nanowire electrode. The method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming solder bumps and electrical interconnections over a second flexible substrate, and integrating nanowire electrode arrays to the second flexible substrate. The plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject to achieve electrical biopotential signals. The plurality of nanowires are formed over the first substrate by metal-assisted chemical etching.
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公开(公告)号：US10833296B2
公开(公告)日：2020-11-10
申请号：US15715722
申请日：2017-09-26
发明人： Qianwen Chen , Bing Dang , John Knickerbocker , Bo Wen
IPC分类号： H01M2/02 , H01M10/0525 , H01M10/0565 , H01M10/0562 , H01M10/04 , H01M6/40 , H01M6/18 , H01M2/10 , H01M2/08
摘要： Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
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公开(公告)号：US20200274113A1
公开(公告)日：2020-08-27
申请号：US16283654
申请日：2019-02-22
发明人： Bing Dang , Qianwen Chen , Yu Luo , John Knickerbocker , Jae-Woong Nah , Kai Liu , Po-wen Cheng , Tung-hsiu Shih , Mengnian Niu , Kai-wei Nieh
IPC分类号： H01M2/06 , H01M10/052 , H01M10/0585 , H01M2/30
摘要： Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.
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公开(公告)号：US20200151553A1
公开(公告)日：2020-05-14
申请号：US16184554
申请日：2018-11-08
发明人： Wang Zhou , Huan Hu , Wei Tan , Qianwen Chen
摘要： Using a set of airflow sensors disposed on an airfoil of an aircraft, first airflow data including an amount of airflow experienced at each airflow sensor at a first time is measured. Using a trained neural network model, the first airflow data is analyzed to determine an airflow state of the aircraft. In response to determining that the aircraft is in the abnormal airflow state, a control surface and a power unit of the aircraft are adjusted. Responsive to the adjusting, the aircraft is returned to the normal airflow state.
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公开(公告)号：US10586875B2
公开(公告)日：2020-03-10
申请号：US16026880
申请日：2018-07-03
发明人： Zheng Xu , Zhenxing Bi , Dexin Kong , Qianwen Chen
IPC分类号： H01L29/788 , H01L27/11521 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/49 , H01L29/786 , H01L21/28
摘要： A method for fabricating a semiconductor device including a gate-all-around based non-volatile memory device includes forming gate-all-around field effect transistor (GAA FET) channels, depositing tunnel dielectric material around the GAA FET channels to isolate the GAA FET channels, forming a floating gate, including depositing first gate material over the isolated GAA FET channels, and forming at least one control gate, including depositing second gate material over the isolated GAA FET channels.
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公开(公告)号：US20190097183A1
公开(公告)日：2019-03-28
申请号：US15841720
申请日：2017-12-14
发明人： Qianwen Chen , Bing Dang , John Knickerbocker , Bo Wen
IPC分类号： H01M2/02 , H01M10/0525
摘要： Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
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公开(公告)号：US20190097182A1
公开(公告)日：2019-03-28
申请号：US15715722
申请日：2017-09-26
发明人： Qianwen Chen , Bing Dang , John Knickerbocker , Bo Wen
IPC分类号： H01M2/02 , H01M10/0525
摘要： Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
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公开(公告)号：US20180323473A1
公开(公告)日：2018-11-08
申请号：US15802109
申请日：2017-11-02
发明人： Qianwen Chen , Bing Dang , John U. Knickerbocker
IPC分类号： H01M10/0585 , A61B5/00 , H01M10/0525
CPC分类号： H01M10/0585 , A61B5/681 , A61B5/6861 , A61B2560/0214 , H01M10/0525 , H01M2220/30
摘要： A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.
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公开(公告)号：US20180098432A1
公开(公告)日：2018-04-05
申请号：US15821432
申请日：2017-11-22
发明人： Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
CPC分类号： H05K1/189 , G01R31/2818 , G01R31/309 , G01R31/44 , H05K1/0268 , H05K1/0274 , H05K1/0393 , H05K1/111 , H05K3/0026 , H05K3/0052 , H05K3/305 , H05K3/341 , H05K3/3494 , H05K13/0069 , H05K2201/09072 , H05K2201/10015 , H05K2201/10037 , H05K2201/1006 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10522 , H05K2203/107 , H05K2203/162
摘要： An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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公开(公告)号：US09735077B1
公开(公告)日：2017-08-15
申请号：US15333832
申请日：2016-10-25
发明人： Qianwen Chen , Li-Wen Hung , Wanki Kim , John U. Knickerbocker , Kenneth P. Rodbell , Robert L. Wisnieff
IPC分类号： H01L23/31 , H01L25/00 , H01L25/07 , H01L25/10 , H01L25/11 , H01L21/312 , H01L23/00 , H01L21/683 , H01L25/065
CPC分类号： G06F17/5027 , G06F15/7803 , G06F15/7807 , G06F15/7857 , G06F15/803 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L24/17 , H01L25/065 , H01L25/0655 , H01L25/071 , H01L25/112 , H01L25/115 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/08225 , H01L2224/11002 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/80006 , H01L2224/81005 , H01L2924/1205 , H01L2924/1206 , H01L2924/13051 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1432 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105
摘要： A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.
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