公开(公告)号：US20160027761A1

公开(公告)日：2016-01-28

申请号：US14871185

申请日：2015-09-30

申请人： Invensas Corporation

发明人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  De Ann Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. Del Rosario ,  John R. Bray

IPC分类号： H01L25/065 ,  H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

摘要： Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

摘要翻译： 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。

公开(公告)号：US20160020188A1

公开(公告)日：2016-01-21

申请号：US14868090

申请日：2015-09-28

申请人： Invensas Corporation

发明人： Jeffrey S. Leal

IPC分类号： H01L23/00 ,  H01L21/324 ,  H01L21/31 ,  H01L21/768 ,  H01L25/00

CPC分类号： H01L24/82 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/31 ,  H01L21/324 ,  H01L21/56 ,  H01L21/76801 ,  H01L21/76828 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/76155 ,  H01L2224/82051 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82355 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14

摘要： Additive processes are employed for electrically insulating selected surface regions on a stack of die; and methods for electrically interconnecting die in a stack of die, include additive processes for electrically insulating selected surface regions of the die. Regions that are not insulated according to the invention are available for electrical connection using electrically conductive material applied in flowable form to make electrically conductive traces.

摘要翻译： 使用添加剂方法来电绝缘模具堆叠上的选定表面区域; 以及用于在管芯堆叠中电互连管芯的方法包括用于电绝缘管芯的选定表面区域的添加工艺。 根据本发明不是绝缘的区域可用于使用以可流动形式施加的导电材料进行电连接以制造导电迹线。

公开(公告)号：US09196588B2

公开(公告)日：2015-11-24

申请号：US13668840

申请日：2012-11-05

申请人： Invensas Corporation

发明人： Jeffrey S. Leal

IPC分类号： H05K9/00 ,  H01L23/552 ,  H01L23/29 ,  H01L21/56 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L23/295 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2924/0002 ,  H01L2924/00

摘要： An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material.

摘要翻译： 通过沉积和固化包括导电颗粒和载体的可固化组合物，EMI屏蔽件可以直接形成在组件，例如未封装或封装的半导体管芯上。 在示例中，屏蔽可以被配置为导电迹线或线的网格或网。 可固化的导电材料可以以可流动的形式施加到部件表面并固化或允许固化以形成导电屏蔽。 屏蔽层可以电耦合到底层电路板或支架上的触点。 耦合材料可以是导电粘合剂，并且可以是或可以包括与屏蔽材料相同或类似的材料。

公开(公告)号：US20150056753A1

公开(公告)日：2015-02-26

申请号：US14480373

申请日：2014-09-08

申请人： Invensas Corporation

发明人： Keith Lake Barrie ,  Suzette K. Pangrle ,  Grant Villavicencio ,  Jeffrey S. Leal

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L23/293 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/038 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1131 ,  H01L2224/11848 ,  H01L2224/13017 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13347 ,  H01L2224/16145 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/24992 ,  H01L2224/24997 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/831 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF4 plasma treatment.

摘要翻译： 裸片在互连端附近在互连边缘附近具有互连焊盘，并且互连面的至少一部分由保形电介质涂层覆盖，其中在电介质涂层上的互连迹线与电介质的表面形成高界面角 涂层。 由于迹线具有较高的界面角度，因此互连材料横向“渗出”的趋势得到缓解，避免了相邻迹线的接触或重叠。 互连迹线包括可固化的导电互连材料; 也就是说，它包括可以以可流动形式施加的材料，然后固化或允许其固化以形成导电迹线。 此外，一种方法包括在形成迹线之前，用CF 4等离子体处理对保形电介质涂层的表面进行处理。

公开(公告)号：US09508689B2

公开(公告)日：2016-11-29

申请号：US14871185

申请日：2015-09-30

申请人： Invensas Corporation

发明人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  De Ann Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. Del Rosario ,  John R. Bray

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

摘要： Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

公开(公告)号：US09490230B2

公开(公告)日：2016-11-08

申请号：US14868090

申请日：2015-09-28

申请人： Invensas Corporation

发明人： Jeffrey S. Leal

IPC分类号： H01L21/31 ,  H01L21/469 ,  H01L23/00 ,  H01L21/02 ,  H01L21/56 ,  H01L25/065 ,  H01L21/324 ,  H01L21/768 ,  H01L25/00

CPC分类号： H01L24/82 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/31 ,  H01L21/324 ,  H01L21/56 ,  H01L21/76801 ,  H01L21/76828 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/76155 ,  H01L2224/82051 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82355 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14

摘要： Additive processes are employed for electrically insulating selected surface regions on a stack of die; and methods for electrically interconnecting die in a stack of die, include additive processes for electrically insulating selected surface regions of the die. Regions that are not insulated according to the invention are available for electrical connection using electrically conductive material applied in flowable form to make electrically conductive traces.

公开(公告)号：US20130114235A1

公开(公告)日：2013-05-09

申请号：US13668840

申请日：2012-11-05

申请人： Invensas Corporation

发明人： Jeffrey S. Leal

IPC分类号： H05K9/00 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L23/295 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2924/0002 ,  H01L2924/00

摘要： An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material.

摘要翻译： 通过沉积和固化包括导电颗粒和载体的可固化组合物，EMI屏蔽件可以直接形成在组件，例如未封装或封装的半导体管芯上。 在示例中，屏蔽可以被配置为导电迹线或线的网格或网。 可固化的导电材料可以以可流动的形式施加到部件表面并固化或允许固化以形成导电屏蔽。 屏蔽层可以电耦合到底层电路板或支架上的触点。 耦合材料可以是导电粘合剂，并且可以是或可以包括与屏蔽材料相同或类似的材料。