公开(公告)号：US09769562B2

公开(公告)日：2017-09-19

申请号：US14957054

申请日：2015-12-02

申请人： Invensense, Inc.

发明人： Aleksey S. Khenkin ,  Vikram Venkatadri ,  David Bolognia

IPC分类号： H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02 ,  H04R1/32 ,  H04R1/04 ,  H04R1/08 ,  H04R1/00

CPC分类号： H04R1/326 ,  H01L2224/48091 ,  H04R1/00 ,  H04R1/04 ,  H04R1/083 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R21/02 ,  H04R2201/003 ,  H01L2924/00014

摘要： A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

公开(公告)号：US20140205127A1

公开(公告)日：2014-07-24

申请号：US13746488

申请日：2013-01-22

申请人： Invensense, Inc.

发明人： Aleksey S. Khenkin ,  Vikram Venkatadri ,  David Bolognia

IPC分类号： H04R1/00

CPC分类号： H04R1/326 ,  H01L2224/48091 ,  H04R1/00 ,  H04R1/04 ,  H04R1/083 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R21/02 ,  H04R2201/003 ,  H01L2924/00014

摘要： A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

摘要翻译： 麦克风系统具有与基座结合以形成具有内部腔室的包装的盖子。 封装具有顶部，底部和多个侧面，并且这些侧面中的至少一个具有形成用于接收声学信号的开口的基本平坦的表面的部分。 麦克风系统还具有位于内部腔室内的麦克风管芯。 麦克风相对于至少一侧的开口位于非正交非零角度。

公开(公告)号：US20160088389A1

公开(公告)日：2016-03-24

申请号：US14957054

申请日：2015-12-02

申请人： Invensense, Inc.

发明人： Aleksey S. Khenkin ,  Vikram Venkatadri ,  David Bolognia

IPC分类号： H04R1/32 ,  H04R1/04

CPC分类号： H04R1/326 ,  H01L2224/48091 ,  H04R1/00 ,  H04R1/04 ,  H04R1/083 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R21/02 ,  H04R2201/003 ,  H01L2924/00014

摘要： A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

摘要翻译： 麦克风系统具有与基座结合以形成具有内部腔室的包装的盖子。 封装具有顶部，底部和多个侧面，并且这些侧面中的至少一个具有形成用于接收声学信号的开口的基本平坦的表面的部分。 麦克风系统还具有位于内部腔室内的麦克风管芯。 麦克风相对于至少一侧的开口位于非正交非零角度。

公开(公告)号：US09226052B2

公开(公告)日：2015-12-29

申请号：US13746488

申请日：2013-01-22

申请人： Invensense, Inc.

发明人： Aleksey S. Khenkin ,  Vikram Venkatadri ,  David Bolognia

IPC分类号： H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02 ,  H04R1/00 ,  H04R1/04 ,  H04R1/08

CPC分类号： H04R1/326 ,  H01L2224/48091 ,  H04R1/00 ,  H04R1/04 ,  H04R1/083 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R21/02 ,  H04R2201/003 ,  H01L2924/00014

摘要： A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

摘要翻译： 麦克风系统具有与基座结合以形成具有内部腔室的包装的盖子。 封装具有顶部，底部和多个侧面，并且这些侧面中的至少一个具有形成用于接收声学信号的开口的基本平坦的表面的部分。 麦克风系统还具有位于内部腔室内的麦克风管芯。 麦克风相对于至少一侧的开口位于非正交非零角度。