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    ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS
    1.
    发明申请
    ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS 审中-公开
    为裸机和热水枪启动裸机液体冷却

    公开(公告)号：US20090084931A1

    公开(公告)日：2009-04-02

    申请号：US11862444

    申请日：2007-09-27

    申请人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi Mahajan

    发明人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi Mahajan

    IPC分类号： B22D27/04

    CPC分类号： B22D27/04 ,  B22D17/2218

    摘要： A liquid cooling device for a die including a support block supporting a plurality of substantially vertical channels transporting fluid to and from a bare die surface for heat removal. The device is mounted on top of a bare die using a frame or spring. In another embodiment, the device allows thermoelectric cooling of a dedicated fluid line.

    摘要翻译： 一种用于模具的液体冷却装置，其包括支撑块，所述支撑块支撑多个基本上垂直的通道，以将流体输送到裸露模具表面并从裸模表面传出流体以进行散热。 该装置使用框架或弹簧安装在裸露模具的顶部。 在另一个实施例中，该装置允许专用流体管线的热电冷却。

    Localized microelectronic cooling apparatuses and associated methods and systems
    2.
    发明授权
    Localized microelectronic cooling apparatuses and associated methods and systems 有权
    本地化微电子冷却装置及相关方法和系统

    公开(公告)号：US07779638B2

    公开(公告)日：2010-08-24

    申请号：US11319297

    申请日：2005-12-27

    申请人： Ioan Sauciuc ,  Gregory M. Chrysler

    发明人： Ioan Sauciuc ,  Gregory M. Chrysler

    IPC分类号： F25B21/02

    CPC分类号： F25B21/02 ,  F25D19/006 ,  H01L23/3677 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/12044

    摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.

    摘要翻译： 通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。 在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。

    Computer system having controlled cooling
    6.
    发明授权
    Computer system having controlled cooling 有权
    具有控制冷却的计算机系统

    公开(公告)号：US07508671B2

    公开(公告)日：2009-03-24

    申请号：US10683924

    申请日：2003-10-10

    申请人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi V. Mahajan

    发明人： Ioan Sauciuc ,  Gregory M. Chrysler ,  Ravi V. Mahajan

    IPC分类号： H05K7/20 ,  G05B9/02

    CPC分类号： G06F1/20 ,  G06F1/206 ,  G06F2200/201

    摘要： A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

    摘要翻译： 提供了一种计算机系统及其冷却方法。 蒸气室用作来自微电子管芯的热量的散热器。 热电模块用于冷却蒸气室并保持蒸气室的适当功能，从而保持微电子模具的冷却。 控制器从五个温度传感器接收输入，并利用输入来控制热电模块的电流和驱动风扇的电机的电压/电流，并提供额外的冷却。 电流传感器允许控制器监测和限制提供给热电模块的功率。

    Method and apparatus for dissipating heat from an electronic device
    7.
    发明授权
    Method and apparatus for dissipating heat from an electronic device 有权
    从电子设备散热的方法和装置

    公开(公告)号：US07499278B2

    公开(公告)日：2009-03-03

    申请号：US11229227

    申请日：2005-09-16

    申请人： Ioan Sauciuc ,  Ward Scott ,  Gregory M. Chrysler

    发明人： Ioan Sauciuc ,  Ward Scott ,  Gregory M. Chrysler

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/427 ,  F28D15/0241 ,  F28D15/0266 ,  F28D15/06 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.

    摘要翻译： 本发明的方法和装置从电子装置散发热量，为高发热电子器件提供有效且普遍应用的热解决方案。 该装置包括蒸发器，冷凝器，加热器和导管。 蒸发器，冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。 蒸发器热连接到诸如处理器的电子设备，并且通过蒸发液体冷却剂来从处理器去除热能。 当设备被定向成使得没有液体冷却剂与蒸发器接触时，加热器向冷却剂施加热能直到冷却剂开始沸腾。 沸腾液体冷却剂会在液体冷却剂内形成气泡。 通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平，直到液体冷却剂与蒸发器接触。 蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。

    Method and system to cool memory
    8.
    发明授权
    Method and system to cool memory 有权
    方法和系统来冷却内存

    公开(公告)号：US07457116B2

    公开(公告)日：2008-11-25

    申请号：US11646065

    申请日：2006-12-27

    申请人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

    发明人： Hakan Erturk ,  Gregory M. Chrysler ,  Ioan Sauciuc

    IPC分类号： H05K7/20 ,  H01L23/36

    CPC分类号： G06F1/20 ,  G06F2200/201

    摘要： A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

    摘要翻译： 与热管理相关的方法，设备和系统。 该方法包括通过制冷装置的吸热部件降低至少一个存储器模块上游的空气流的温度，使空气流与至少一个存储器模块的至少一个表面接触并传递热量 由所述至少一个存储器模块提供，以及所述制冷装置的散热部件到所述至少一个存储器模块的下游位置。

    Application and removal of thermal interface material
    9.
    发明授权
    Application and removal of thermal interface material 有权
    热界面材料的应用和去除

    公开(公告)号：US07367195B2

    公开(公告)日：2008-05-06

    申请号：US11599671

    申请日：2006-11-14

    申请人： Ioan Sauciuc ,  Gregory M. Chrysler

    发明人： Ioan Sauciuc ,  Gregory M. Chrysler

    IPC分类号： F25B21/02

    CPC分类号： F28D15/02 ,  H01L23/38 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00

    摘要： A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

    摘要翻译： 描述了一种方法，系统和装置。 该装置包括用于调节与热电（TEC）模块相关联的极性的第一装置。 调整是为了控制热量的流动。 热流导向热界面材料（TIM），以便将TIM熔化到可接受的熔体水平。 该装置还包括第二装置，用于确定TIM已经熔化到可接受的熔融水平。 该装置包括一个施加装置，用于将TIM施加到散热器上，如果TIM熔化已熔化到可接受的熔融水平。

    Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same
    10.
    发明授权
    Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same 有权
    压电式风扇，包含该压电风扇的冷却装置以及使用该微型电子装置的冷却方法

    公开(公告)号：US07550901B2

    公开(公告)日：2009-06-23

    申请号：US11862194

    申请日：2007-09-27

    申请人： Gregory M. Chrysler ,  Ioan Sauciuc

    发明人： Gregory M. Chrysler ,  Ioan Sauciuc

    IPC分类号： H01L41/08 ,  F04D33/00

    CPC分类号： F04D33/00

    摘要： A piezoelectric fan includes a piezoelectric actuator patch (110, 210, 310) and a blade (120, 220, 320) attached to the piezoelectric actuator patch. The blade has a hole (121, 127, 221) in it, and a door (122, 128, 222) is adjacent to the hole and attached to the blade (as with a hinge (123, 129, 223)) such that the door is capable of opening and closing.

    摘要翻译： 压电风扇包括压电致动器贴片（110,210,310）和附接到压电致动器贴片的刀片（120,220,320）。 叶片在其中具有孔（121,127,221），并且门（122,128,222）邻近孔并附接到叶片（如同铰链（123,129,223）），使得 门能打开和关闭。