Solid oxide fuel cell
    2.
    发明授权
    Solid oxide fuel cell 失效
    固体氧化物燃料电池

    公开(公告)号:US07326484B2

    公开(公告)日:2008-02-05

    申请号:US11088892

    申请日:2005-03-25

    IPC分类号: H01M8/10 H01M8/24 H01M4/86

    摘要: A single cell for a fuel cell in which an air electrode or a fuel electrode includes at least two layers. The air electrode includes an adhering cathode layer formed on one surface of the solid electrolyte layer and configured to show a function to allow the air electrode and the solid electrolyte layer to adhere electrically and mechanically to each other, and an electricity collecting cathode layer formed on the adhering cathode layer and configured to show an electricity collecting function of the air electrode. Alternatively, the fuel electrode includes an adhering anode layer formed on the other surface of the solid electrolyte layer and configured to show a function to allow the fuel electrode and the solid electrolyte layer to adhere electrically and mechanically to each other, and an electricity collecting anode layer formed on the adhering anode layer and configured to show an electricity collecting function.

    摘要翻译: 用于燃料电池的单电池,其中空气电极或燃料电极包括至少两层。 空气电极包括形成在固体电解质层的一个表面上的粘附阴极层,并且被配置为显示使空气电极和固体电解质层彼此电和机械地粘附的功能,以及形成在 粘附阴极层并且被配置为显示空气电极的集电功能。 或者,燃料电极包括形成在固体电解质层的另一个表面上的粘附阳极层,并且被配置为具有允许燃料电极和固体电解质层彼此电和机械粘合的功能,并且集电阳极 层,其形成在粘附阳极层上并且被配置为显示集电功能。

    Method for measuring temperature, annealing method and method for fabricating semiconductor device
    4.
    发明授权
    Method for measuring temperature, annealing method and method for fabricating semiconductor device 有权
    测量温度的方法,退火方法和制造半导体器件的方法

    公开(公告)号:US07037733B2

    公开(公告)日:2006-05-02

    申请号:US10343762

    申请日:2002-07-01

    IPC分类号: H01L21/66 G01N25/00 G01J5/00

    CPC分类号: G01J5/0003

    摘要: When the emissivity ε on the reverse face of a substrate 10 is measured during annealing processing for the substrate 10, films made from a material that varies the emissivity ε, such as a first DPS film 15 used for forming a plug 15A, a second DPS film 17 used for forming a capacitor lower electrode 17A and a third DPS film 20 used for forming a capacitor upper electrode 20A, are formed on the top face of the substrate 10. On the other hand, no film made from a material that varies the emissivity ε, such as a DPS film, is formed on the reverse face of the substrate 10.

    摘要翻译: 当在衬底10的退火处理期间测量衬底10的反面上的发射率ε时,由用于形成插头15A的第一DPS膜15,例如用于形成插头15A的第一DPS膜15的材料制成的膜,第二 用于形成用于形成电容器上电极20A的电容器下电极17A和第三DPS膜20的DPS膜17形成在基板10的顶面上。另一方面,没有由材料制成的膜 在基板10的背面上形成改变发射率ε(例如DPS膜)。

    Semiconductor device and method of manufacturing the same
    5.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US5696008A

    公开(公告)日:1997-12-09

    申请号:US668180

    申请日:1996-06-21

    摘要: On a semiconductor substrate made of p-type silicon, there are formed, in a successively layered fashion, a first p-type silicon semiconductor layer, laterally paired first n-type silicon semiconductor layers, laterally paired second p-type silicon semiconductor layers, and laterally paired n-type silicon semiconductor layers, by an epitaxial growth method. On the second n-type silicon semiconductor layer on the right side, there are successively formed a third p-type silicon semiconductor layer, a third n-type silicon semiconductor layer and a fourth p-type silicon semiconductor layer. The left first n-type silicon semiconductor layer, left second p-type silicon semiconductor layer and left second n-type silicon semiconductor layer form a first insular multilayered portion forming an n-channel MOSFET. The third p-type silicon semiconductor layer, third n-type silicon semiconductor layer and fourth p-type silicon semiconductor layer form a second insular portion forming a p-channel MOSFET. A first gate electrode is formed on a side surface of the left second p-type silicon semiconductor layer with a gate insulating film therebetween, and a second gate electrode is formed on a side surface of the right third n-type silicon semiconductor layer with a gate insulating film therebetween.

    摘要翻译: 在由p型硅制成的半导体衬底上,以连续分层的方式形成第一p型硅半导体层,横向配对的第一n型硅半导体层,横向配对的第二p型硅半导体层, 和横向配对的n型硅半导体层,通过外延生长法。 在右侧的第二n型硅半导体层上,依次形成第三p型硅半导体层,第三n型硅半导体层和第四p型硅半导体层。 左第一n型硅半导体层,左第二p型硅半导体层和左第二n型硅半导体层形成形成n沟道MOSFET的第一岛状多层部分。 第三p型硅半导体层,第三n型硅半导体层和第四p型硅半导体层形成形成p沟道MOSFET的第二岛形部分。 第一栅电极形成在左第二p型硅半导体层的侧表面上,栅极绝缘膜之间,第二栅电极形成在右第三n型硅半导体层的侧表面上, 栅绝缘膜。

    Gallate based complex oxide electrolyte material
    8.
    发明授权
    Gallate based complex oxide electrolyte material 失效
    基于镓酸盐的复合氧化物电解质材料

    公开(公告)号:US06803140B2

    公开(公告)日:2004-10-12

    申请号:US09939577

    申请日:2001-08-28

    IPC分类号: H01M810

    摘要: A solid electrolyte material contains an A site-deficient complex oxide represented by a chemical formula A1-&agr;BO3-&dgr;, in which a B site contains at least Ga. This solid electrolyte material has stability, high oxide-ion conductivity at low temperature and high toughness. A method of manufacturing the solid electrolyte material, comprises: mixing oxide materials of respective constituent elements; baking temporarily the mixed materials at 1100 to 1200° C. for 2 to 10 hours; grinding the temporarily baked materials to powder; molding the powder; and sintering the molded powder. A solid oxide fuel cell, has: the solid electrolyte material; a cathode electrode formed on one surface of the solid electrolyte material; and an anode electrode formed on the other surface of the solid electrolyte material. The solid oxide fuel cell has a stable and long operation at low temperature.

    摘要翻译: 固体电解质材料包含由B位含有至少Ga的化学式A1-αBO3-δ表示的A位缺陷型复合氧化物,该固体电解质材料在低温高温下具有稳定的高氧离子传导性 韧性。 一种制造固体电解质材料的方法,包括:混合各组成元素的氧化物材料; 将混合物料在1100〜1200℃下暂时烘烤2〜10小时; 将暂时烘烤的材料研磨成粉末; 成型粉末; 并烧结成型粉末。 一种固体氧化物燃料电池,具有:固体电解质材料; 形成在固体电解质材料的一个表面上的阴极电极; 以及形成在固体电解质材料的另一个表面上的阳极电极。 固体氧化物燃料电池在低温下具有稳定且长时间的操作。

    Method of manufacturing a semiconductor device
    9.
    发明授权
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US06376373B1

    公开(公告)日:2002-04-23

    申请号:US09523985

    申请日:2000-03-13

    IPC分类号: H01L2144

    CPC分类号: H01L21/28518

    摘要: While conventionally, a Co film is deposited by directional sputtering directly on a source/drain diffusion layer formed on the surface of an Si substrate while the substrate is being heated, a thin oxide film is formed on the source/drain diffusion layer and then, the Co film is deposited by directional sputtering while the substrate is being heated. By doing this, an inner Co—Si layer the composition of which is thermally unstable is formed and a Co—Si—O layer is formed on the Co—Si layer. After the remaining unreacted Co film and the Co—Si—O layer are selectively removed, a high-temperature heat treatment is performed, so that the inner Co—Si layer is transformed into a CoSi2 layer to increase the film thickness. The formation of the oxide film curbs the speed of reaction between Co and Si, so that a Co—Si layer of the same thickness as that in the wide region can be formed in the fine region. As a result, a CoSi2 layer with uniform thickness and sheet resistance can be formed.

    摘要翻译: 通常,在衬底被加热的同时,通过定向溅射将Co膜直接沉积在形成于Si衬底的表面上的源极/漏极扩散层上,在源极/漏极扩散层上形成薄的氧化物膜, 当衬底被加热时,通过定向溅射沉积Co膜。 通过这样做,形成其组成为热不稳定性的内部Co-Si层,并且在Co-Si层上形成Co-Si-O层。 在剩余的未反应的Co膜和Co-Si-O层被选择性地除去之后,进行高温热处理,使得内部Co-Si层转变为CoSi 2层以增加膜厚度。 氧化膜的形成限制了Co和Si之间的反应速度,从而可以在微细区域中形成与宽区域相同厚度的Co-Si层。 结果,可以形成具有均匀厚度和薄层电阻的CoSi 2层。