公开(公告)号：US10096564B2

公开(公告)日：2018-10-09

申请号：US15481848

申请日：2017-04-07

Applicant: J-DEVICES CORPORATION

Inventor： Toshiyuki Inaoka ,  Atsuhiro Uratsuji

IPC: H01L21/44 ,  H01L23/00

Abstract: A manufacturing method of a semiconductor package includes locating, on a substrate, a semiconductor device having an external terminal provided on a top surface thereof, forming a resin insulating layer covering the semiconductor device, forming an opening, exposing the external terminal, in the resin insulating layer, performing plasma treatment on a bottom surface of the opening, performing chemical treatment on the bottom surface of the opening after the plasma treatment, and forming a conductive body to be connected with the external terminal exposed in the opening.

公开(公告)号：US10079161B2

公开(公告)日：2018-09-18

申请号：US15884979

申请日：2018-01-31

Applicant: J-Devices Corporation

Inventor： Toshiyuki Inaoka ,  Yuichiro Yoshikawa ,  Atsuhiro Uratsuji ,  Katsushi Yoshimitsu

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L23/367

CPC classification number: H01L21/4871 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/15747

Abstract: An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.