摘要:
An AC-coupling phase interpolator and a DLL using the same are provided. The AC-coupling phase interpolator includes a coupling capacitor generating and outputting a coupling signal by AC-coupling to an interpolation signal obtained by phase-interpolating an input signal. Thereby, it is possible to correct duty of an input signal and adjust the level of an output signal.
摘要:
An AC-coupling phase interpolator and a DLL using the same are provided. The AC-coupling phase interpolator includes a coupling capacitor generating and outputting a coupling signal by AC-coupling to an interpolation signal obtained by phase-interpolating an input signal. Thereby, it is possible to correct duty of an input signal and adjust the level of an output signal.
摘要:
A stacked semiconductor memory device according to the inventive concepts may include a plurality of memory chips stacked above a processor chip, a plurality of TSVs, and I/O buffers. The TSVs may pass through the memory chips and are connected to the processor chip. I/O buffers may be coupled between all or part of the memory chips and the TSVs and may be selectively activated on the basis of defective states of the TSVs.
摘要翻译:根据本发明构思的叠层半导体存储器件可以包括堆叠在处理器芯片上方的多个存储器芯片,多个TSV和I / O缓冲器。 TSV可以通过存储器芯片并且连接到处理器芯片。 I / O缓冲器可以耦合在所有或部分存储器芯片和TSV之间,并且可以基于TSV的故障状态来选择性地激活。
摘要:
A data output buffer includes a driving unit and a control unit. The driving unit selectively performs a termination operation that provides a termination impedance to a transmission line coupled to an external pin, and a driving operation that provides a drive impedance to the transmission line while outputting read data. The control unit adjusts a value of the termination impedance and a value of the drive impedance based on an output voltage at the external pin during a termination mode, and controls the driving unit to selectively perform one of the termination operation and the driving operation during a driving mode.
摘要:
A stacked semiconductor memory device according to the inventive concepts may include a plurality of memory chips stacked above a processor chip, a plurality of TSVs, and I/O buffers. The TSVs may pass through the memory chips and are connected to the processor chip. I/O buffers may be coupled between all or part of the memory chips and the TSVs and may be selectively activated on the basis of defective states of the TSVs.
摘要翻译:根据本发明构思的叠层半导体存储器件可以包括堆叠在处理器芯片上方的多个存储器芯片,多个TSV和I / O缓冲器。 TSV可以通过存储器芯片并且连接到处理器芯片。 I / O缓冲器可以耦合在所有或部分存储器芯片和TSV之间,并且可以基于TSV的故障状态来选择性地激活。
摘要:
A data output buffer includes a driving unit and a control unit. The driving unit selectively performs a termination operation that provides a termination impedance to a transmission line coupled to an external pin, and a driving operation that provides a drive impedance to the transmission line while outputting read data. The control unit adjusts a value of the termination impedance and a value of the drive impedance based on an output voltage at the external pin during a termination mode, and controls the driving unit to selectively perform one of the termination operation and the driving operation during a driving mode.
摘要:
An apparatus for controlling a latency in a synchronous semiconductor device. The apparatus includes a first counting block for counting a cycle of a first clock signal to thereby generate a first binary code; a second counting block for counting a cycle of a second clock signal to thereby generate a second binary code. The second clock signal is obtained by delaying the first clock signal by a predetermined delay amount, A code comparison block stores the second binary code in response to a command and compares the first binary code with the second binary code to thereby generate a latency control signal.
摘要:
A semiconductor device has a DLL circuit for generating an internal clock signal by receiving an external clock signal, wherein the DLL circuit includes a delay model for modeling delay time of an intern clock signal delayed from an external clock signal and a power supply for adjusting a core voltage by an input output voltage and supplying the adjusted voltage to the delay model.
摘要:
A semiconductor device includes a plurality of pads, where an external reference resistor is connected to a first one of the pads, an impedance calibrating unit configured to generate an impedance calibration code corresponding to an impedance of the reference resistor and output the impedance calibration code to a code transmitting line during a normal operating mode, and an impedance matching unit configured to perform an impedance matching operation in response to the impedance calibration code during the normal operating mode. The impedance calibrating unit is configured to output a test code to the code transmitting line in response to a test signal during a test operating mode. The impedance matching unit is configured to serialize the test code to output the serialized test code to each of the other pads in response to the test signal during the test operating mode.
摘要:
An apparatus for controlling a latency in a synchronous semiconductor device. The apparatus includes a first counting block for counting a cycle of a first clock signal to thereby generate a first binary code; a second counting block for counting a cycle of a second clock signal to thereby generate a second binary code. The second clock signal is obtained by delaying the first clock signal by a predetermined delay amount, A code comparison block stores the second binary code in response to a command and compares the first binary code with the second binary code to thereby generate a latency control signal.