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19 条记录 (耗时 0.018 秒)

    Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
    5.
    发明申请
    Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same 审中-公开
    用于电子电路的轧制铜箔或电解铜箔，以及使用其形成电子电路的方法

    公开(公告)号：US20130270218A1

    公开(公告)日：2013-10-17

    申请号：US13912406

    申请日：2013-06-07

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Keisuke Yamanishi ,  Kengo Kaminaga ,  Ryo Fukuchi

    IPC分类号： H05K1/09 ,  H05K3/00

    CPC分类号： H05K1/09 ,  B32B15/018 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/025 ,  C23C30/00 ,  C23F1/18 ,  H05K3/0073 ,  H05K3/06 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T428/12438

    摘要： A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. The following can be achieved upon forming a circuit by etching a copper foil of a copper clad laminate: sagging caused by the etching is prevented; a uniform circuit of the intended circuit width is formed; the time required to form a circuit by etching is reduced; etching properties in pattern etching are improved; and the occurrence of short circuits and defects in the circuit width are prevented.

    摘要翻译： 一种用于通过蚀刻形成电路的电子电路用的卷绕铜箔或电解铜箔，其特征在于，在铂族金，金和银中含有一种或多种类型的金属，其蚀刻速率低于 形成在轧制铜箔或电解铜箔的蚀刻表面侧上的铜，或者可选地包括具有上述金属作为其主要成分的合金层。 通过蚀刻覆铜层压板的铜箔形成电路可以实现以下目的：防止由蚀刻引起的下垂; 形成预期电路宽度的均匀电路; 减少了通过蚀刻形成电路所需的时间; 图案蚀刻中的蚀刻性能得到改善; 并且防止电路宽度的短路和缺陷的发生。

    Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
    7.
    发明授权
    Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device 有权

    公开(公告)号：US10820414B2

    公开(公告)日：2020-10-27

    申请号：US15827056

    申请日：2017-11-30

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Hideta Arai ,  Ryo Fukuchi ,  Atsushi Miki

    IPC分类号： B21C37/00 ,  H05K1/09 ,  H05K3/06 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42

    摘要： Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 μg/dm2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 μg/dm2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 μg/dm2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

    Surface-treated copper foil
    8.
    发明授权
    Surface-treated copper foil 有权

    公开(公告)号：US10070521B2

    公开(公告)日：2018-09-04

    申请号：US14388838

    申请日：2013-03-29

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Ryo Fukuchi

    IPC分类号： H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  C23C28/00 ,  C23C30/00 ,  B32B15/04 ,  C23C22/24 ,  C23C22/83 ,  H05K3/38

    摘要： This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.

    Surface-treated copper foil
    9.
    发明授权
    Surface-treated copper foil 有权

    公开(公告)号：US10383222B2

    公开(公告)日：2019-08-13

    申请号：US15398126

    申请日：2017-01-04

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Atsushi Miki ,  Ryo Fukuchi ,  Hideta Arai

    IPC分类号： H05K1/09 ,  C22C9/00 ,  C22C30/02 ,  C25F1/00 ,  C25D3/38 ,  C25D3/12 ,  C25D11/38 ,  C25D7/06 ,  C22F1/08 ,  H05K3/38 ,  C25D5/12 ,  C25D3/56 ,  C25D3/58

    摘要： To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiO2 conversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.