摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.
摘要:
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.
摘要:
An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a first module attached to the substrate; a conductive connection built on the first module and conductively connected thereto; an adhesive spacer on the first module with the conductive connection exposed; and a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.
摘要:
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.
摘要:
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.
摘要:
An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the support structure; connecting the substrate and the first integrated circuit device; and encapsulating the first integrated circuit device and the support structure.
摘要:
A hybrid stacking package system is provided including providing a board-on-chip substrate, having an opening, attaching a first integrated circuit on the board-on-chip substrate, attaching bond wires, between the first integrated circuit and the board-on-chip substrate, through the opening, and mounting a second integrated circuit over the bond wires.
摘要:
A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.