公开(公告)号：US11431146B2

公开(公告)日：2022-08-30

申请号：US14920490

申请日：2015-10-22

申请人： Jabil Inc.

发明人： Lorito E. Victoria ,  Lars Runge

IPC分类号： H01S5/02315 ,  H01S5/023 ,  H01S5/02345 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02355 ,  H01S5/14 ,  H01S5/024 ,  H01S5/02216 ,  H01S5/00 ,  H01S5/0231 ,  H01S5/0234 ,  H01S5/02253

摘要： A chip on submodule includes a submount having a top surface, bottom surface and side surfaces. A positive electrode plate is affixed to a first portion of one side surface, the top surface and a first portion of the bottom surface. The positive electrode plated first portion of the one side surface and the top surface are interconnected. A connector electrically connects the positive electrode plated top surface to the first portion of the bottom surface. A negative electrode plate is affixed to a second portion of the one side surface and a second portion of the bottom surface. The negative electrode plated second portion of the one side surface and second portion of the bottom surface are interconnected. A laser diode is affixed to the positive electrode plated first portion of the one side surface and connected to the negative electrode plated second portion of the one side surface.