摘要:
A method of manufacturing a semiconductor device, in which the depth of a divot in a shallow trench isolation can be decreased. The method comprises forming a trench in a semiconductor substrate, for isolating elements, forming a nitride film on a surface of the trench, depositing mask material on an entire surface of the semiconductor substrate, filling the trench with the mask material, etching the mask material until a surface level of the mask material in the trench falls below the surface of the semiconductor substrate, removing an exposed upper portion of the nitride film on the surface of the trench, removing the mask material from the trench, filling the trench with element-isolating material, thereby forming an element-isolating region, and forming a transistor in an element region isolated from another element region by the element-isolating region.
摘要:
According to an aspect of the present invention, there is provided a semiconductor device including an insulated gate field effect transistor including a gate electrode film formed, via a gate insulating film, on a semiconductor film formed on a support substrate via an insulating film, and a source region and drain region formed in the semiconductor film to sandwich the gate electrode film in a gate length direction, a support substrate contact including a polysilicon film formed on a first opening via a silicon oxide film, the first opening extending through the semiconductor film and the insulating film and reaching the support substrate, an interlayer dielectric film formed on the semiconductor film and the support substrate contact, and an interconnection connected to the polysilicon film via a conductive material, the conductive material filling a second opening, which extends through the interlayer dielectric film and reaches the support substrate contact.
摘要:
A nonvolatile semiconductor device and method having a plurality of series-connected memory cells with floating and control gate electrodes, and a first insulating layer formed between the gate electrodes. One of the memory cells has the floating gate formed to contact the control gate electrode through an aperture in the insulating layer. The insulating layer is removed to form spaces between the gate electrodes. A second insulating film is formed in the spaces between the gate electrodes. The dummy electrode supports the series of gate electrodes to maintain the spaces between the electrodes. The second insulating layer is formed to be continuous in the spaces and on side surfaces of the gate electrodes. The second insulating layer may have a stacked structure with n layers in the spaces and (n−1)/2 layers on the side surfaces.
摘要:
A semiconductor storage device including a memory cell. In the memory cell a buried electrode is formed on a semiconductor substrate. A semiconductor layer is formed on the buried electrode via a buried insulating film. A surface electrode is formed on the semiconductor layer via an insulating film. A source region and drain region are formed in the semiconductor layer on both sides of the surface electrode with a predetermined spacing therebetween. A floating body is formed between the source region and drain region, which stores data in accordance with whether holes are stored in the floating body. The buried electrode serves as a gate electrode, and the surface electrode serves as a plate electrode.
摘要:
A semiconductor device includes second to fourth semiconductor layers, a gate electrode, and an insulating film. The second semiconductor layer is formed on a first semiconductor layer and has a projecting shape. The third and fourth semiconductor layers are formed on the first semiconductor layer to be in contact with the second semiconductor layer and oppose each other via the second semiconductor layer. The gate electrode is in contact with the second semiconductor layer with a gate insulating film interposed therebetween and forms a channel in the second semiconductor layer. The insulating film is formed in the first semiconductor layer located immediately under the third and fourth semiconductor layers.
摘要:
According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other.
摘要:
A nonvolatile semiconductor device and method having a plurality of series-connected memory cells with floating and control gate electrodes, and a first insulating layer formed between the gate electrodes. One of the memory cells has the floating gate formed to contact the control gate electrode through an aperture in the insulating layer. The insulating layer is removed to form spaces between the gate electrodes. A second insulating film is formed in the spaces between the gate electrodes. The dummy electrode supports the series of gate electrodes to maintain the spaces between the electrodes. The second insulating layer is formed to be continuous in the spaces and on side surfaces of the gate electrodes. The second insulating layer may have a stacked structure with n layers in the spaces and (n−1)/2 layers on the side surfaces.
摘要:
A nonvolatile semiconductor memory device according to one embodiment includes: a memory cell array; word lines each connected to nonvolatile memory cells; and a control circuit. When executing the data reading operation, the control circuit applies to a selected word line connected to a selected memory cell a first voltage obtained by adding a first adjusting voltage to an intermediate voltage between adjoining two of the threshold voltage distributions; applies to first non-selected word lines adjoining the selected word line a second voltage obtained by subtracting a second adjusting voltage from a reading pass voltage; applies to second non-selected word lines adjoining the first non-selected word lines a third voltage obtained by adding the second adjusting voltage to the reading pass voltage; and applies to third non-selected word lines, the third non-selected word lines being non-selected word lines except the first and second non-selected word lines, the reading pass voltage.
摘要:
A non-volatile memory of a semiconductor device has a tunnel insulation film provided on the active area; a floating gate electrode provided on the tunnel insulation film; a control gate electrode provided over the floating gate electrode; and an inter-electrode insulation film provided between the floating gate electrode and the control gate electrode, wherein, in a section of the non-volatile memory cell in a channel width direction, a dimension of a top face of the active area in the channel width direction is equal to or less than a dimension of a top face of the tunnel insulation film in the channel width direction, and the dimension of the top face of the tunnel insulation film in the channel width direction is less than a dimension of a bottom face of the floating gate electrode in the channel width direction.
摘要:
A nonvolatile semiconductor memory includes a memory cell string having a plurality of memory cell transistors connected in series, a selection gate transistor connected in series with one end of the memory cell string, and having a gate electrode provided on a gate insulating film on a semiconductor substrate, and an element isolation insulating layer which is provided in the semiconductor substrate. The gate electrode includes a first gate electrode provided on the gate insulating film, a first and second insulating films provided on the first gate electrode, and a second gate electrode provided on the second insulating film and the element isolation insulating layer, and electrically connected to the first gate electrode. An first upper surface portion of the element isolation insulating layer below the second gate electrode is leveled with an upper surface of the first gate electrode.