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公开(公告)号:US5051313A
公开(公告)日:1991-09-24
申请号:US561494
申请日:1990-07-31
CPC分类号: C08G65/48 , C08L71/00 , G03G15/2057 , Y10T428/24174 , Y10T428/31504 , Y10T428/31721 , Y10T428/31855
摘要: Hot roll fusers are made with a matrix resin which is an elastomer having a glass transition between 90.degree. C. and 160.degree. C. and a structure represented by the formula X--Ar--Y--Ar--X wherein Ar is an aromatic ring structure, Y is O, S, C.dbd.O, SO.sub.2, C(CH.sub.3).sub.2, C(CF.sub.3).sub.2, CH.sub.2 or (CF.sub.2).sub.n and X is --O--C.tbd.N, --C.tbd.CH or ##STR1##
摘要翻译: 热辊轧机由具有玻璃化转变温度在90℃至160℃的弹性体和由式X-Ar-Y-Ar-X表示的结构的基质树脂制成,其中Ar是芳环结构 ,Y是O,S,C = O,SO 2,C(CH 3)2,C(CF 3)2,CH 2或(CF 2)n,X是-OC 3 N N,-C 3 CH或CH 3,
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公开(公告)号:US5516874A
公开(公告)日:1996-05-14
申请号:US319392
申请日:1994-10-06
申请人: Kie Y. Ahn , James L. Hedrick, Jr. , Jeffrey W. Labadie , Kang-Wook Lee , Robert J. Twieg , Alfred Viehbeck , George F. Walker
发明人: Kie Y. Ahn , James L. Hedrick, Jr. , Jeffrey W. Labadie , Kang-Wook Lee , Robert J. Twieg , Alfred Viehbeck , George F. Walker
IPC分类号: C08G73/18 , C08L71/00 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K1/03 , C08G8/02 , C08G65/00
CPC分类号: H01L23/5329 , C08G73/18 , C08L71/00 , H01L23/293 , H01L23/49894 , H01L2924/0002 , H05K1/0346 , H05K3/4676 , Y10S428/901 , Y10T29/49155 , Y10T29/49171 , Y10T428/24917 , Y10T428/31605 , Y10T428/31721
摘要: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
摘要翻译: 包括至少两个级别的多级电子封装,每个级别包括聚(芳基醚苯并咪唑),聚酰亚胺和铜。 公开了制备该包装的过程。 还介绍了可用于制备该包装的几种新颖的聚(芳基醚苯并咪唑)。
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公开(公告)号:US5045608A
公开(公告)日:1991-09-03
申请号:US413361
申请日:1989-09-27
申请人: James L. Hedrick, Jr. , Donald C. Hofer , Jeffrey W. Labadie , Sally A. Swanson , Willi Volksen
发明人: James L. Hedrick, Jr. , Donald C. Hofer , Jeffrey W. Labadie , Sally A. Swanson , Willi Volksen
CPC分类号: C08G73/1042 , C08G73/0694 , C08G73/1085
摘要: Block copolymers of polyimide and poly (phenylquinoxaline) have been synthesized. They are useful, particularly as dielectric layers in thin film multilayer structures. The most preferred embodiments are formed from polyimides which are those from pyromellitic dianhydride and oxydianiline. The most preferred poly (phenylquinoxaline) is a monofunctional oligomer, which yields the best microstructure.
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公开(公告)号:US5593720A
公开(公告)日:1997-01-14
申请号:US447564
申请日:1995-05-23
申请人: Kie Y. Ahn , James L. Hedrick, Jr. , Jeffrey W. Labadie , Kang-Wook Lee , Robert J. Twieg , Alfred Viehbeck , George F. Walker
发明人: Kie Y. Ahn , James L. Hedrick, Jr. , Jeffrey W. Labadie , Kang-Wook Lee , Robert J. Twieg , Alfred Viehbeck , George F. Walker
IPC分类号: C08G73/18 , C08L71/00 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K1/03 , B05D5/12
CPC分类号: H01L23/5329 , C08G73/18 , C08L71/00 , H01L23/293 , H01L23/49894 , H01L2924/0002 , H05K1/0346 , H05K3/4676 , Y10S428/901 , Y10T29/49155 , Y10T29/49171 , Y10T428/24917 , Y10T428/31605 , Y10T428/31721
摘要: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
摘要翻译: 包括至少两个级别的多级电子封装,每个级别包括聚(芳基醚苯并咪唑),聚酰亚胺和铜。 公开了制备该包装的过程。 还介绍了可用于制备该包装的几种新颖的聚(芳基醚苯并咪唑)。
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公开(公告)号:US4970098A
公开(公告)日:1990-11-13
申请号:US510481
申请日:1990-04-18
申请人: Juan Ayala-Esquilin , William H. Dickstein , James L. Hedrick, Jr. , John C. Scott , Arnold C. Yang
发明人: Juan Ayala-Esquilin , William H. Dickstein , James L. Hedrick, Jr. , John C. Scott , Arnold C. Yang
CPC分类号: G03G15/2057 , C08K3/0008 , Y10T428/1372 , Y10T428/139 , Y10T428/2982 , Y10T428/31663
摘要: A roll for hot fusing having a coating comprising a cross-linked elastomeric random copolymer of dimethylsiloxane and diphenylsiloxane and three additives, (1) from 40 to 55% by weight of small zinc oxide particles, (2) from 5 to 10% by weight of small graphite particles and (3) from 1 to 5% by weight of ceric dioxide particles.
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公开(公告)号:US5591285A
公开(公告)日:1997-01-07
申请号:US475670
申请日:1995-07-24
申请人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号: C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , B32B31/28 , B32B27/16
CPC分类号: H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.
摘要翻译: 公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构,氟化碳的存在量足以降低组合物的介电常数,该结构还包括电导体图案。 可以通过用UV准分子激光器照射该复合材料来导电。
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公开(公告)号:US5397863A
公开(公告)日:1995-03-14
申请号:US929313
申请日:1992-08-13
申请人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
CPC分类号: H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.
摘要翻译: 公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构,氟化碳的存在量足以降低组合物的介电常数,该结构还包括电导体图案。 可以通过用UV准分子激光器照射该复合材料来导电。
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公开(公告)号:US5371654A
公开(公告)日:1994-12-06
申请号:US963346
申请日:1992-10-19
申请人: Brian S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
发明人: Brian S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
IPC分类号: H01L23/52 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H05K7/00
CPC分类号: G01R1/07371 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , G01R1/06711 , G01R1/0675 , G01R1/07378 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174
摘要: The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.
摘要翻译: 本发明涉及用于将三维结构中的诸如半导体芯片的电子器件封装在一起的结构,其允许电信号水平和垂直地传播。 该结构由多个组件形成。 每个组件由在多个电子装置的至少一个表面上设置的基板形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连,每个组件电连接。 由具有延伸穿过其中的多个孔的弹性体插入件形成的电互连。 孔阵列对应于基片上的电子器件阵列。 孔和电互连布置在电子器件阵列上,使得相邻电子器件之间的电互连。 组合堆叠被压缩,从而压缩相邻组件之间的电互连。 描述了用于制造作为独立弹性片的电互连的方法。
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公开(公告)号:US5556899A
公开(公告)日:1996-09-17
申请号:US346766
申请日:1994-11-30
申请人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人: Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
CPC分类号: H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.
摘要翻译: 公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。 %的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体,并将分散体在65℃-200℃/秒加热至约400℃。
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公开(公告)号:US5531022A
公开(公告)日:1996-07-02
申请号:US300620
申请日:1994-09-02
申请人: Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
发明人: Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
IPC分类号: H01L23/52 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/40 , H01R9/09
CPC分类号: G01R1/07371 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , G01R1/06711 , G01R1/0675 , G01R1/07378 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174
摘要: The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.
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