摘要:
A method of testing an integrated circuit (IC) chip and a related test structure are disclosed. A test structure includes a monitor chain proximate to at least one solder bump pad, the monitor chain including at least one metal via stack, each metal via stack extending from a lower metal layer in the IC chip to an upper metal layer in the IC chip, such that the monitor chain forms a continuous circuit proximate to the at least one solder bump pad, and where each metal via stack is positioned substantially under the solder bump. A method for testing to detect boundaries of safe effective modulus includes performing a stress test on an IC chip containing the test structure joined to a semiconductor package.
摘要:
A method of testing an integrated circuit (IC) chip and a related test structure are disclosed. A test structure includes a monitor chain proximate to at least one solder bump pad, the monitor chain including at least one metal via stack, each metal via stack extending from a lower metal layer in the IC chip to an upper metal layer in the IC chip, such that the monitor chain forms a continuous circuit proximate to the at least one solder bump pad, and where each metal via stack is positioned substantially under the solder bump. A method for testing to detect boundaries of safe effective modulus includes performing a stress test on an IC chip containing the test structure joined to a semiconductor package.
摘要:
A method of reducing white bump formation and dielectric cracking under controlled collapse chip connections (C4s). The method comprises fabricating a substrate having a plurality of metallization layers, one or more of the layers is of low k dielectric material. The substrate includes a plurality of attachment pads for the C4s. The fabricating comprises selectively forming at least a portion of the substrate with metal fill having a higher Young's modulus of elasticity than any of the one or more layers of low k dielectric material in portions of the substrate located beneath at least some of the attachment pads.
摘要:
An integrated circuit wire structure. The structure includes a set of interconnect levels over a semiconductor substrate, each interconnect level of the set of interconnect levels comprising operational wires embedded in an interlevel dielectric layer; a dielectric barrier layer on an uppermost interconnect level of the set of interconnect levels and a bonding pad on the passivation layer; a stress reduction zone surrounding a perimeter of the bonding pad and extending into the set of interconnect levels; elongated fill wires in each of the interconnect levels in the stress reduction zone, the elongated fill wires not connected to any of the non-ground operational wires; and the elongated fill wires of each interconnect level of each set of interconnect levels physically connected to elongated fill wires of immediately upper and lower interconnect levels of the set of fill levels.
摘要:
Methods and structures are provided for packaging identically processed chips in a stacked structure. A latch chain includes a first latch chain, having a single or multiple latches, associated with a first chip. The first latch chain is structured to read data information from the first chip. The latch chain includes a second latch chain, having a single or multiple latches, associated with a second chip. The second latch chain is structured to read data information from the second chip. The first latch chain and the second latch chain are connected to one another such that form a single latch chain that crosses chip boundaries. The first latch chain and the second latch chain are structured to provide identification information for identifying the first chip and the second chip, respectively.
摘要:
An integrated circuit structure comprises a plurality of insulator layers (connected to each other) that form a laminated structure. Further included are via openings within each of the insulator layers, and conductive via material within the via openings. The conductive via material within corresponding via openings of adjacent insulator layers are electrically connected to form continuous electrical via paths through the insulator layers between the top surface and the bottom surface of the laminated structure. Within each of the continuous electrical via paths, the via openings are positioned relative to each other to form a diagonal structural path of the conductive via material through the laminated structure. The corresponding via openings of the adjacent insulator layers partially overlap each other. The diagonal structural paths are non-perpendicular to the top surface and the bottom surface.
摘要:
Methods and structures are provided for packaging identically processed chips in a stacked structure. A latch chain includes a first latch chain, having a single or multiple latches, associated with a first chip. The first latch chain is structured to read data information from the first chip. The latch chain includes a second latch chain, having a single or multiple latches, associated with a second chip. The second latch chain is structured to read data information from the second chip. The first latch chain and the second latch chain are connected to one another such that form a single latch chain that crosses chip boundaries. The first latch chain and the second latch chain are structured to provide identification information for identifying the first chip and the second chip, respectively.
摘要:
An integrated circuit wire structure. The structure includes a set of interconnect levels over a semiconductor substrate, each interconnect level of the set of interconnect levels comprising operational wires embedded in an interlevel dielectric layer; a dielectric barrier layer on an uppermost interconnect level of the set of interconnect levels and a bonding pad on the passivation layer; a stress reduction zone surrounding a perimeter of the bonding pad and extending into the set of interconnect levels; elongated fill wires in each of the interconnect levels in the stress reduction zone, the elongated fill wires not connected to any of the non-ground operational wires; and the elongated fill wires of each interconnect level of each set of interconnect levels physically connected to elongated fill wires of immediately upper and lower interconnect levels of the set of fill levels.
摘要:
An integrated circuit structure includes a plurality of insulator layers (connected to each other) that form a laminated structure. Further included are via openings within each of the insulator layers, and conductive via material within the via openings. The conductive via material within corresponding via openings of adjacent insulator layers are electrically connected to form continuous electrical via paths through the insulator layers between the top surface and the bottom surface of the laminated structure. Within each of the continuous electrical via paths, the via openings are positioned relative to each other to form a diagonal structural path of the conductive via material through the laminated structure. The corresponding via openings of the adjacent insulator layers partially overlap each other. The diagonal structural paths are non-perpendicular to the top surface and the bottom surface.
摘要:
Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.