中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

32 records (took 0.03 seconds)

    TRACE ANYWHERE INTERCONNECT
    1.
    发明申请
    TRACE ANYWHERE INTERCONNECT 审中-公开

    公开(公告)号：US20190053374A1

    公开(公告)日：2019-02-14

    申请号：US16108527

    申请日：2018-08-22

    Applicant: Thomas P. Warwick ,  Dhananjaya Turpuseema ,  James V. Russell

    Inventor： Thomas P. Warwick ,  Dhananjaya Turpuseema ,  James V. Russell

    IPC: H05K1/11 ,  H05K3/32 ,  H05K1/09 ,  H05K3/40 ,  H05K1/02 ,  H05K3/10 ,  H05K1/18

    Abstract: The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.

    Embedded isolation filter
    2.
    发明授权
    Embedded isolation filter 有权
    嵌入式隔离滤波器

    公开(公告)号：US08848385B2

    公开(公告)日：2014-09-30

    申请号：US13200672

    申请日：2011-09-28

    Applicant: Thomas P. Warwick ,  James V. Russell

    Inventor： Thomas P. Warwick ,  James V. Russell

    IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0233 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

    Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

    Abstract translation: 本公开涉及减少包含RF设备的印刷电路板（PCB）中的不期望的RF噪声。 隔离滤波器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器放置在尽可能靠近RF器件的位置，以便显着减少不必要的RF噪声，这是由于通孔和PCB结构中的平面之间的不可避免的耦合。

    Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
    4.
    发明申请
    Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration 有权
    插入板中的嵌入式组件，用于提高互连配置中的功率增益（分配）和功耗（耗散）

    公开(公告)号：US20120285011A1

    公开(公告)日：2012-11-15

    申请号：US13507380

    申请日：2012-06-22

    Applicant: James V. Russell

    Inventor： James V. Russell

    IPC: H05K3/30

    CPC classification number: H05K1/185 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K3/4046 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/53174

    Abstract: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.

    Abstract translation: 将诸如电容内部的功率改进组件嵌入到位于主电路板的通孔之上延伸超过主电路板的通孔的电容器内，使得包含嵌入电容的插入板的部分位于通孔或百叶窗所在的位置之外。 这允许via通过开放。 以这种方式，电容和电阻将具有与电气部件更接近的接触点。 电阻也可以嵌入到适配器板的开口中并且在开口内垂直对准以与适配器板的顶部上的焊盘接触并且在适配器板的底部具有焊盘，使得电通过嵌入部件 。

    Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
    8.
    发明申请
    Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration 有权
    嵌入式组件用于改善互连配置中的功率增益（分配）和功率损耗（耗散）

    公开(公告)号：US20100277881A1

    公开(公告)日：2010-11-04

    申请号：US12655834

    申请日：2010-01-08

    Applicant: James V. Russell

    Inventor： James V. Russell

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: H05K1/185 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K3/4046 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/53174

    Abstract: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.

    Abstract translation: 将诸如电容内部的功率改进组件嵌入到位于主电路板的通孔之上延伸超过主电路板的通孔的电容器内，使得包含嵌入电容的插入板的部分位于通孔或百叶窗所在的位置之外。 这允许via通过开放。 以这种方式，电容和电阻将具有与电气部件更接近的接触点。 电阻也可以嵌入到适配器板的开口中并且在开口内垂直对准以与适配器板的顶部上的焊盘接触并且在适配器板的底部具有焊盘，使得电通过嵌入部件 。

    TRACE ANYWHERE INTERCONNECT
    10.
    发明申请
    TRACE ANYWHERE INTERCONNECT 审中-公开

    公开(公告)号：US20190053375A1

    公开(公告)日：2019-02-14

    申请号：US16108557

    申请日：2018-08-22

    Applicant: Thomas P. Warwick ,  Dhanajaya Turpuseoma ,  James V. Russell

    Inventor： Thomas P. Warwick ,  Dhanajaya Turpuseoma ,  James V. Russell

    IPC: H05K1/11 ,  H05K3/32 ,  H05K1/09 ,  H05K3/40 ,  H05K1/02 ,  H05K3/10 ,  H05K1/18

    Abstract: The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.

Patent Agency Ranking