公开(公告)号：US08480302B2

公开(公告)日：2013-07-09

申请号：US12892406

申请日：2010-09-28

申请人： Jason P. Gill ,  David L. Harmon ,  Timothy D. Sullivan

发明人： Jason P. Gill ,  David L. Harmon ,  Timothy D. Sullivan

IPC分类号： G01K5/00 ,  G01K7/00

CPC分类号： G01K5/52

摘要： The present invention provides a micro-electro-mechanical-system (MEMS) temperature sensor that employs a suspended spiral comprising a material with a positive coefficient of thermal expansion. The thermal expansion of the suspended spiral is guided to by a set of guideposts to provide a linear movement of the free end of the suspended spiral, which is converted to an electrical signal by a set of conductive rotor azimuthal fins that are interdigitated with a set of conductive stator azimuthal fins by measuring the amount of capacitive coupling therebetween. Real time temperature may thus be measured through the in-situ measurement of the capacitive coupling. Optionally, the MEMS temperature sensor may have a ratchet and a pawl to enable ex-situ measurement.

摘要翻译： 本发明提供了一种微电子机械系统（MEMS）温度传感器，其采用悬浮螺旋，其包括具有正的热膨胀系数的材料。 悬挂螺旋的热膨胀由一组导轨引导以提供悬挂螺旋的自由端的线性运动，其被一组导电转子方位角翅片转换成电信号，所述导电转子方位角翅片与组相互指向 通过测量导电定子方位翅片之间的电容耦合量。 因此可以通过电容耦合的原位测量来测量实时温度。 可选地，MEMS温度传感器可以具有棘轮和棘爪以使得能够进行非原位测量。

公开(公告)号：US07096450B2

公开(公告)日：2006-08-22

申请号：US10604165

申请日：2003-06-28

申请人： Jason P. Gill ,  David L. Harmon ,  Deborah M. Massey ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Junichi Furukawa

发明人： Jason P. Gill ,  David L. Harmon ,  Deborah M. Massey ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Junichi Furukawa

IPC分类号： G06F17/50

CPC分类号： G06F17/5077 ,  H01L23/3677 ,  H01L23/522 ,  H01L23/5226 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/0005 ,  H01L2924/00

摘要： An electronic structure having wiring, and an associated method of designing the structure, for limiting a temperature gradient in the wiring. The electronic structure includes a substrate having a layer that includes a first and second wire which do not physically touch each other. The first and second wires are adapted to be at an elevated temperature due to Joule heating in relation to electrical current density in the first and second wires. The first wire is electrically and thermally coupled to the second wire by an electrically and thermally conductive structure that exists outside of the layer. The width of the second wire is tailored so as to limit a temperature gradient in the first wire to be below a threshold value that is predetermined to be sufficiently small so as to substantially mitigate adverse effects of electromigration in the first wire.

公开(公告)号：US20120076172A1

公开(公告)日：2012-03-29

申请号：US12892406

申请日：2010-09-28

申请人： Jason P. Gill ,  David L. Harmon ,  Timothy D. Sullivan

发明人： Jason P. Gill ,  David L. Harmon ,  Timothy D. Sullivan

IPC分类号： G01K5/52

CPC分类号： G01K5/52

摘要： The present invention provides a micro-electro-mechanical-system (MEMS) temperature sensor that employs a suspended spiral comprising a material with a positive coefficient of thermal expansion. The thermal expansion of the suspended spiral is guided to by a set of guideposts to provide a linear movement of the free end of the suspended spiral, which is converted to an electrical signal by a set of conductive rotor azimuthal fins that are interdigitated with a set of conductive stator azimuthal fins by measuring the amount of capacitive coupling therebetween. Real time temperature may thus be measured through the in-situ measurement of the capacitive coupling. Optionally, the MEMS temperature sensor may have a ratchet and a pawl to enable ex-situ measurement.

摘要翻译： 本发明提供了一种微电子机械系统（MEMS）温度传感器，其采用悬浮螺旋，其包括具有正的热膨胀系数的材料。 悬挂螺旋的热膨胀由一组导轨引导以提供悬挂螺旋的自由端的线性运动，其被一组导电转子方位角翅片转换成电信号，所述导电转子方位角翅片与组相互指向 通过测量导电定子方位翅片之间的电容耦合量。 因此可以通过电容耦合的原位测量来测量实时温度。 可选地，MEMS温度传感器可以具有棘轮和棘爪以使得能够进行非原位测量。

公开(公告)号：US07511378B2

公开(公告)日：2009-03-31

申请号：US11442911

申请日：2006-05-30

申请人： Jason P. Gill ,  David L. Harmon ,  Deborah M. Massey ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Junichi Furukawa

发明人： Jason P. Gill ,  David L. Harmon ,  Deborah M. Massey ,  Alvin W. Strong ,  Timothy D. Sullivan ,  Junichi Furukawa

IPC分类号： H01L23/48

CPC分类号： G06F17/5077 ,  H01L23/3677 ,  H01L23/522 ,  H01L23/5226 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/0005 ,  H01L2924/00

摘要： An electronic structure having wiring, and an associated method of designing the structure, for limiting a temperature gradient in the wiring. The electronic structure includes a substrate having a layer that includes a first and second wire which do not physically touch each other. The first and second wires are adapted to be at an elevated temperature due to Joule heating in relation to electrical current density in the first and second wires. The first wire is electrically and thermally coupled to the second wire by an electrically and thermally conductive structure that exists outside of the layer. The width of the second wire is tailored so as to limit a temperature gradient in the first wire to be below a threshold value that is predetermined to be sufficiently small so as to substantially mitigate adverse effects of electromigration in the first wire.

摘要翻译： 具有布线的电子结构以及用于限制布线中的温度梯度的结构设计的相关方法。 该电子结构包括具有包括不物理接触的第一和第二线的层的衬底。 由于焦耳加热相对于第一和第二导线中的电流密度，第一和第二导线适于处于升高的温度。 第一导线通过存在于层之外的导电和导热结构电耦合到第二导线。 第二导线的宽度被调整为将第一导线中的温度梯度限制在低于预定足够小的阈值，以便基本上减轻第一线中的电迁移的不利影响。

公开(公告)号：US07639032B2

公开(公告)日：2009-12-29

申请号：US12004011

申请日：2007-12-19

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

IPC分类号： G01R31/02 ,  H01L23/58 ,  G01N25/20

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (μm).

摘要翻译： 提供了诸如芯片或微电子布线基板的微电子元件，其包括用于改善耐热应力的多个导电互连。 至少一些导电互连件包括金属板，金属连接线和上金属通孔。 所述金属连接线具有与所述金属板的上表面至少基本平齐的上表面，在所述周边边缘中的一个处连接到所述金属板的内端和从所述一个周边边缘水平移位的外端。 金属连接线的宽度远小于金属板的一个周边边缘的宽度，并且其长度大于一个周边边缘的宽度。 上金属通孔在与一个外围边缘水平位移至少约3微米（mum）的位置处具有与金属连接线接触的底端。

公开(公告)号：US07692439B2

公开(公告)日：2010-04-06

申请号：US12154304

申请日：2008-05-22

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

IPC分类号： G01R31/02 ,  H01L23/58 ,  G01N25/20

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure representative of a conductive interconnect of a microelectronic element is provided, which may include a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between the upper and lower surfaces, the upper surface defining a horizontally extending plane. The structure may also include a lower via having a top end in conductive communication with the metallic plate and a bottom end vertically displaced from the top end. A lower conductive or semiconductive element can be in contact with the bottom end of the lower via. An upper metallic via can lie in at least substantial vertical alignment with the lower conductive via, the upper metallic via having a bottom end in conductive communication with the metallic plate and a top end vertically displaced from the bottom end. The upper metallic via may have a width at least about ten times than the length of the metallic plate and about ten times smaller than the width of the metallic plate. The structure may further include an upper metallic line element in contact with the top end of the upper metallic via.

摘要翻译： 提供了表示微电子元件的导电互连的结构，其可以包括具有上表面，下表面和在上表面和下表面之间延伸的多个周边边缘的导电金属板，上表面限定水平 延伸平面 该结构还可以包括具有与金属板导电连通的顶端和从顶端垂直移位的底端的下通孔。 下导电或半导体元件可以与下通孔的底端接触。 上金属通孔可以与下导电通孔至少基本垂直对准，上金属通孔具有与金属板导电连通的底端和从底端垂直移位的顶端。 上部金属通孔的宽度可以比金属板的长度至少大约十倍，并且比金属板的宽度小约十倍。 该结构还可以包括与上金属通孔的顶端接触的上金属线元件。

公开(公告)号：US07231617B2

公开(公告)日：2007-06-12

申请号：US10711418

申请日：2004-09-17

申请人： Fen Chen ,  Jeffrey P. Gambino ,  Jason P. Gill ,  Baozhen Li ,  Timothy D. Sullivan

发明人： Fen Chen ,  Jeffrey P. Gambino ,  Jason P. Gill ,  Baozhen Li ,  Timothy D. Sullivan

IPC分类号： G06F17/50

CPC分类号： H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： Novel structures and methods for evaluating lines in semiconductor integrated circuits. A first plurality of lines can be formed on a wafer each of which comprises multiple line sections. All the line sections are of the same length. The electrical resistances of the line sections are measured. Then, a first line geometry adjustment is determined based on the electrical resistances of all the sections of all the lines. The first line geometry adjustment represents an effective reduction of cross-section size of the lines due to grain boundary electrical resistance. A second plurality of lines of same length and thickness can be formed on the same wafer. Then, second and third line geometry adjustments can be determined based on the electrical resistances of these lines measured at different temperatures. The second and third line geometry adjustments represent an effective reduction of cross-section size of the lines due to grain boundary electrical resistance and line surface roughness.

摘要翻译： 用于评估半导体集成电路中的线路的新型结构和方法。 可以在每个包括多个线段的晶片上形成第一组多条线。 所有线段长度相同。 测量线路段的电阻。 然后，基于所有线的所有部分的电阻来确定第一线几何形状调整。 第一行几何调整表示由于晶界电阻而导致的线的横截面尺寸的有效减小。 相同长度和厚度的第二组多条线可以形成在同一晶片上。 然后，可以基于在不同温度下测量的这些线的电阻来确定第二和第三线几何调整。 第二和第三线几何调整表示由于晶界电阻和线表面粗糙度导致的线的横截面尺寸的有效减小。

公开(公告)号：US07500208B2

公开(公告)日：2009-03-03

申请号：US11673369

申请日：2007-02-09

申请人： Fen Chen ,  Jeffrey P. Gambino ,  Jason P. Gill ,  Baozhen Li ,  Timothy D. Sullivan

发明人： Fen Chen ,  Jeffrey P. Gambino ,  Jason P. Gill ,  Baozhen Li ,  Timothy D. Sullivan

IPC分类号： G06F17/50 ,  G01R31/26

CPC分类号： H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： Novel structures and methods for evaluating lines in semiconductor integrated circuits. A first plurality of lines are formed on a wafer each of which includes multiple line sections. All the line sections are of the same length. The electrical resistances of the line sections are measured. Then, a first line geometry adjustment is determined based on the electrical resistances of all the sections. The first line geometry adjustment represents an effective reduction of cross-section size of the lines due to grain boundary electrical resistance. A second plurality of lines of same length and thickness can be formed on the same wafer. Then, second and third line geometry adjustments are determined based on the electrical resistances of these lines measured at different temperatures. The second and third line geometry adjustments represent an effective reduction of cross-section size of the lines due to grain boundary electrical resistance and line surface roughness.

摘要翻译： 用于评估半导体集成电路中的线路的新型结构和方法。 在每个包括多个线段的晶片上形成第一组多条线。 所有线段长度相同。 测量线路段的电阻。 然后，基于所有部分的电阻来确定第一行几何调整。 第一行几何调整表示由于晶界电阻而导致的线的横截面尺寸的有效减小。 相同长度和厚度的第二组多条线可以形成在同一晶片上。 然后，基于在不同温度下测量的这些线的电阻来确定第二和第三线几何调整。 第二和第三线几何调整表示由于晶界电阻和线表面粗糙度导致的线的横截面尺寸的有效减小。

公开(公告)号：US20080231312A1

公开(公告)日：2008-09-25

申请号：US12154304

申请日：2008-05-22

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

IPC分类号： G01R31/26

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure representative of a conductive interconnect of a microelectronic element is provided, which may include a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between the upper and lower surfaces, the upper surface defining a horizontally extending plane. The structure may also include a lower via having a top end in conductive communication with the metallic plate and a bottom end vertically displaced from the top end. A lower conductive or semiconductive element can be in contact with the bottom end of the lower via. An upper metallic via can lie in at least substantial vertical alignment with the lower conductive via, the upper metallic via having a bottom end in conductive communication with the metallic plate and a top end vertically displaced from the bottom end. The upper metallic via may have a width at least about ten times than the length of the metallic plate and about ten times smaller than the width of the metallic plate. The structure may further include an upper metallic line element in contact with the top end of the upper metallic via.

摘要翻译： 提供了表示微电子元件的导电互连的结构，其可以包括具有上表面，下表面和在上表面和下表面之间延伸的多个周边边缘的导电金属板，上表面限定水平 延伸平面 该结构还可以包括具有与金属板导电连通的顶端和从顶端垂直移位的底端的下通孔。 下导电或半导体元件可以与下通孔的底端接触。 上金属通孔可以与下导电通孔至少基本垂直对准，上金属通孔具有与金属板导电连通的底端和从底端垂直移位的顶端。 上部金属通孔的宽度可以比金属板的长度至少大约十倍，并且比金属板的宽度小约十倍。 该结构还可以包括与上金属通孔的顶端接触的上金属线元件。

公开(公告)号：US07397260B2

公开(公告)日：2008-07-08

申请号：US11163948

申请日：2005-11-04

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence A. Clevenger ,  Andrew P. Cowley ,  Ronald G. Filippi ,  Jason P. Gill ,  Tom C. Lee ,  Baozhen Li ,  Paul S. McLaughlin ,  Du B. Nguyen ,  Hazara S. Rathore ,  Timothy D. Sullivan ,  Chih-Chao Yang

IPC分类号： G01R31/02 ,  H01L23/58 ,  G01N25/20

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (μm).

摘要翻译： 提供了诸如芯片或微电子布线基板的微电子元件，其包括用于改善耐热应力的多个导电互连。 至少一些导电互连件包括金属板，金属连接线和上金属通孔。 所述金属连接线具有与所述金属板的上表面至少基本平齐的上表面，在所述周边边缘中的一个处连接到所述金属板的内端和从所述一个周边边缘水平移位的外端。 金属连接线的宽度远小于金属板的一个周边边缘的宽度，并且其长度大于一个周边边缘的宽度。 上金属通孔在与一个外围边缘水平位移至少约3微米（mum）的位置处具有与金属连接线接触的底端。