MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES
    1.
    发明申请
    MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES 有权
    多层相变存储器件

    公开(公告)号:US20100019216A1

    公开(公告)日:2010-01-28

    申请号:US12568402

    申请日:2009-09-28

    IPC分类号: H01L47/00

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    METHODS OF FABRICATING MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES
    2.
    发明申请
    METHODS OF FABRICATING MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES 有权
    制造多层相变记忆体装置的方法

    公开(公告)号:US20090004773A1

    公开(公告)日:2009-01-01

    申请号:US12189477

    申请日:2008-08-11

    IPC分类号: H01L45/00

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    Methods of fabricating multi-layer phase-changeable memory devices
    3.
    发明授权
    Methods of fabricating multi-layer phase-changeable memory devices 有权
    制造多层可相变存储器件的方法

    公开(公告)号:US07615401B2

    公开(公告)日:2009-11-10

    申请号:US12189477

    申请日:2008-08-11

    IPC分类号: H01L21/00

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    Multi-layer phase-changeable memory devices
    4.
    发明授权
    Multi-layer phase-changeable memory devices 有权
    多层可相变存储器件

    公开(公告)号:US07425735B2

    公开(公告)日:2008-09-16

    申请号:US11627775

    申请日:2007-01-26

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
    5.
    发明申请
    MULTI-LAYER PHASE-CHANGEABLE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME 有权
    多层相变记忆体装置及其制造方法

    公开(公告)号:US20070215853A1

    公开(公告)日:2007-09-20

    申请号:US11627775

    申请日:2007-01-26

    IPC分类号: H01L47/00 H01L21/44

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二相变材料层可以具有比第一相变材料层更大的电阻率。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    Multi-layer phase-changeable memory devices
    6.
    发明授权
    Multi-layer phase-changeable memory devices 有权
    多层可相变存储器件

    公开(公告)号:US07943918B2

    公开(公告)日:2011-05-17

    申请号:US12568402

    申请日:2009-09-28

    IPC分类号: H01L45/00

    摘要: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

    摘要翻译: 可变相存储器件包括相变材料图案,以及电连接到相变材料图案的第一和第二电极。 第一和第二电极被配置为向相变材料图案提供电信号。 相变材料图案包括第一相变材料层和第二相变材料层。 第一和第二可相变材料图案具有不同的化学,物理和/或电特性。 例如,第二可相变材料层的电阻率可以比第一相变材料层更大。 例如,第一相变材料层可以包括第一浓度的氮,第二相变材料层可以包括大于第一浓度的第二浓度的氮。 还讨论了相关设备和制造方法。

    Phase Change Memory Cell Employing a GeBiTe Layer as a Phase Change Material Layer, Phase Change Memory Device Including the Same, Electronic System Including the Same and Method of Fabricating the Same
    7.
    发明申请
    Phase Change Memory Cell Employing a GeBiTe Layer as a Phase Change Material Layer, Phase Change Memory Device Including the Same, Electronic System Including the Same and Method of Fabricating the Same 有权
    使用GeBiTe层作为相变材料层的相变存储单元,包括其的相变存储器件,包括其的电子系统及其制造方法

    公开(公告)号:US20070267721A1

    公开(公告)日:2007-11-22

    申请号:US11747395

    申请日:2007-05-11

    IPC分类号: H01L31/117 H01L29/12

    摘要: A phase change memory cell includes an interlayer insulating layer formed on a semiconductor substrate, and a first electrode and a second electrode disposed in the interlayer insulating layer. A phase change material layer is disposed between the first and second electrodes. The phase change material layer may be an undoped GeBiTe layer, a doped GeBiTe layer containing an impurity or a doped GeTe layer containing an impurity. The undoped GeBiTe layer has a composition ratio within a range surrounded by four points (A1(Ge21.43, Bi16.67, Te61.9), A2(Ge44.51, Bi0.35, Te55.14), A3(Ge59.33, Bi0.5, Te40.17) and A4(Ge38.71, Bi16.13, Te45.16)) represented by coordinates on a triangular composition diagram having vertices of germanium (Ge), bismuth (Bi) and tellurium (Te). The doped GeBiTe layer contains an impurity and has a composition ratio within a range surrounded by four points (D1(Ge10, Bi20, Te70), D2(Ge30, Bi0, Te70), D3(Ge70, Bi0, Te30) and D4(Ge50, Bi20, Te30)) represented by coordinates on the triangular composition diagram.

    摘要翻译: 相变存储单元包括形成在半导体衬底上的层间绝缘层和设置在层间绝缘层中的第一电极和第二电极。 相变材料层设置在第一和第二电极之间。 相变材料层可以是未掺杂的GeBiTe层,包含杂质的掺杂GeBiTe层或含有杂质的掺杂GeTe层。 未掺杂的GeBiTe层的组成比在四个点(A 1(Ge 21.43,Bi 16.67,Te 61.9), A 2(Ge 44.51,Bi 0.35,Te 55.14),A 3(Ge 59.33,Bi 40 ,Te <40.17 和A 4(Ge 38.71,Bi 16.13,Te 45.16) ))由具有锗(Ge),铋(Bi)和碲(Te)的顶点的三角形组成图上的坐标表示。 掺杂的GeBiTe层含有杂质,其组成比在四个点(D 1(Ge 10 O 12,Bi 20 O,Te 70) (3),D 2(Ge 30 30,Bi 0,Te 70),D 3(Ge 70) ,Bi 2 O 3,Te 30 N)和D 4(Ge 50,Bi 20,Te 30 ))由三角形组成图上的坐标表示。

    Phase change memory cell employing a GeBiTe layer as a phase change material layer, phase change memory device including the same, electronic system including the same and method of fabricating the same
    8.
    发明授权
    Phase change memory cell employing a GeBiTe layer as a phase change material layer, phase change memory device including the same, electronic system including the same and method of fabricating the same 有权
    使用GeBiTe层作为相变材料层的相变存储单元,包括该相变材料层的相变存储器件,包括该GeBiTe层的相变材料层的电子系统及其制造方法

    公开(公告)号:US07817464B2

    公开(公告)日:2010-10-19

    申请号:US11747395

    申请日:2007-05-11

    IPC分类号: G11C11/00

    摘要: A phase change memory cell includes an interlayer insulating layer formed on a semiconductor substrate, and a first electrode and a second electrode disposed in the interlayer insulating layer. A phase change material layer is disposed between the first and second electrodes. The phase change material layer may be an undoped GeBiTe layer, a doped GeBiTe layer containing an impurity or a doped GeTe layer containing an impurity. The undoped GeBiTe layer has a composition ratio within a range surrounded by four points (A1(Ge21.43, Bi16.67, Te61.9), A2(Ge44.51, Bi0.35, Te55.14), A3(Ge59.33, Bi0.5, Te40.17) and A4(Ge38.71, Bi16.13, Te45.16)) represented by coordinates on a triangular composition diagram having vertices of germanium (Ge), bismuth (Bi) and tellurium (Te). The doped GeBiTe layer contains an impurity and has a composition ratio within a range surrounded by four points (D1(Ge10, Bi20, Te70), D2(Ge30, Bi0, Te70), D3(Ge70, Bi0, Te30) and D4(Ge50, Bi20, Te30)) represented by coordinates on the triangular composition diagram.

    摘要翻译: 相变存储单元包括形成在半导体衬底上的层间绝缘层和设置在层间绝缘层中的第一电极和第二电极。 相变材料层设置在第一和第二电极之间。 相变材料层可以是未掺杂的GeBiTe层,包含杂质的掺杂GeBiTe层或含有杂质的掺杂GeTe层。 未掺杂的GeBiTe层的组成比在四个点(A1(Ge21.43,Bi16.67,Te61.9),A2(Ge44.51,Bi0.35,Te55.14),A3(Ge59), 33,Bi0.5,Te40.17)和A4(Ge38.71,Bi16.13,Te45.16)),由具有锗(Ge),铋(Bi)和碲(Te )。 掺杂的GeBiTe层包含杂质,其组成比在四个点(D1(Ge10,Bi20,Te70),D2(Ge30,Bi0,Te70),D3(Ge70,Bi0,Te30)和D4(Ge50 ,Bi20,Te30))。