摘要:
Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.
摘要:
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要:
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要:
Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.
摘要:
Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.
摘要:
An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.
摘要:
An apparatus and method for allowing a user to dynamically enjoy a video. A difference between image data is computed at every preset unit of time and a vibration corresponding to the computed difference is generated so that the user can sense a motion change of an object within the video. Upon video reproduction, scenes are displayed by applying the lighting effect of a strobe light or the like between the scenes to be reproduced. Upon video reproduction, more enjoyment and various haptic effects can be provided to the user.
摘要:
A watch phone and a method for handling an incoming call using the watch phone are provided. In the watch phone, a display device includes a touch screen panel and a display, turns off the touch screen panel in a watch mode, turns on the touch screen panel in an idle mode or upon receipt of an incoming call, and displays at least two areas for call connection and call rejection, upon receipt of the incoming call. A single mode selection key selects one of the watch mode and the idle mode. A controller performs control operations so that the touch screen panel is turned off in the watch mode and is turned on in the idle mode or upon receipt of the incoming call, and connects or rejects the incoming call, when the at least two areas for call connection or call rejection, which are displayed upon receipt of the incoming call, are pointed to or dragged to.
摘要:
Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.
摘要:
Disclosed is a semiconductor package adapted to be light, slim, compact, and suitable for high-density mounting and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a plurality of active/passive devices; a first PCB acting as a main board, the semiconductor chip and devices selected from the plurality of active/passive devices being mounted on the first PCB, the devices including a highest device; and at least one sub-PCB, remaining devices of the plurality of active/passive devices being mounted on the sub-PCB, the sub-PCB having a through-hole, at least the highest device on the first PCB extending through the through-hole, so that the sub-PCB is connected to the first PCB and positioned in a space above the first PCB while overlapping the first PCB.