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    Stacked structure of an image sensor and method for manufacturing the same
    3.
    发明授权
    Stacked structure of an image sensor and method for manufacturing the same 有权
    图像传感器的堆叠结构及其制造方法

    公开(公告)号：US06521881B2

    公开(公告)日：2003-02-18

    申请号：US09836160

    申请日：2001-04-16

    申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    IPC分类号： H01L2700

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

    摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

    Package structure for a photosensitive chip
    6.
    发明授权
    Package structure for a photosensitive chip 有权
    感光芯片的封装结构

    公开(公告)号：US06590269B1

    公开(公告)日：2003-07-08

    申请号：US10114201

    申请日：2002-04-01

    申请人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    发明人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    IPC分类号： H01L310203

    CPC分类号： H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

    摘要翻译： 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

    STACKED SMALL MEMORY CARD
    8.
    发明申请
    STACKED SMALL MEMORY CARD 失效
    堆叠的小存储卡

    公开(公告)号：US20050077362A1

    公开(公告)日：2005-04-14

    申请号：US10683838

    申请日：2003-10-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    IPC分类号： G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

    CPC分类号： G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

    摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

    摘要翻译： 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

    Image sensor module
    9.
    发明授权
    Image sensor module 失效
    图像传感器模块

    公开(公告)号：US06870208B1

    公开(公告)日：2005-03-22

    申请号：US10671038

    申请日：2003-09-24

    申请人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

    发明人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

    IPC分类号： H01L21/336 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/062

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.

    摘要翻译： 图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。 基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。 框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。 感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。 透明层被覆盖在基板的上表面上以覆盖开口。 镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹 被拧在腔室的内螺纹上。

    Stacked structure of an image sensor
    10.
    发明授权
    Stacked structure of an image sensor 失效
    图像传感器的堆叠结构

    公开(公告)号：US06680525B1

    公开(公告)日：2004-01-20

    申请号：US10340251

    申请日：2003-01-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

    IPC分类号： H01L2302

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

    摘要翻译： 要安装到印刷电路板的图像传感器。 该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。 基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。 每个金属片具有连接到印刷电路板的第一板和第二板。 在基底下方形成槽。 集成电路布置在槽内并与衬底电连接。 芯片放在中间板上。 电线将第一板电连接到芯片。 透明层被放置在框架层上以覆盖芯片。