公开(公告)号：US08692134B2

公开(公告)日：2014-04-08

申请号：US13210392

申请日：2011-08-16

申请人： Jie Yang ,  Qingchun He ,  Hanmin Zhang

发明人： Jie Yang ,  Qingchun He ,  Hanmin Zhang

IPC分类号： H05K1/11

CPC分类号： H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4811 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48992 ,  H01L2224/85138 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/20753 ,  H01L2224/85399

摘要： An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.

摘要翻译： 电连接包括结合到靠近模具边缘的相邻接合焊盘的第一引线和第二引线，其中一端接合到芯片边缘远离管芯接合焊盘，第二端接合引线框架的引线指 或基板的连接垫。 第二根线穿过并被第一根线支撑。 第一线作为防止第二线接触芯片边缘的支架。 第一根线也防止了第二根线在封装期间过度的横向运动。

公开(公告)号：US20150235969A1

公开(公告)日：2015-08-20

申请号：US14551098

申请日：2014-11-24

申请人： Hanmin Zhang ,  Qingchun He ,  Dehong Ye ,  Fei Zong

发明人： Hanmin Zhang ,  Qingchun He ,  Dehong Ye ,  Fei Zong

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L23/562 ,  H01L21/78 ,  H01L22/12 ,  H01L24/05 ,  H01L24/94 ,  H01L2224/033 ,  H01L2224/034 ,  H01L2224/0345 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor wafer having multiple dies has a partially metallized backside. After wafer dicing, each of the multiple dies has, on its backside, a metallized area surrounded by a peripheral non-metallization ring. The non-metallization ring allows for easier optical inspection of the dies for determining the extent of any backside chipping caused by the wafer dicing. The peripheral non-metallization rings are generated by not metalizing the areas flanking the saw streets of the wafer.

摘要翻译： 具有多个管芯的半导体晶片具有部分金属化的背面。 在晶片切割之后，多个管芯中的每一个在其背面具有被外围非金属化环包围的金属化区域。 非金属化环允许更容易地对模具进行光学检查，以确定由晶片切割引起的任何背面切屑的程度。 周边的非金属化环是通过不使晶片的锯条的两侧的区域金属化而产生的。

公开(公告)号：US20140103096A1

公开(公告)日：2014-04-17

申请号：US13865185

申请日：2013-04-17

申请人： Hanmin Zhang ,  Qingchun He ,  Liqiang Xu ,  Fei Zong

发明人： Hanmin Zhang ,  Qingchun He ,  Liqiang Xu ,  Fei Zong

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L22/12 ,  H01L22/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48456 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/78315 ,  H01L2224/789 ,  H01L2224/78901 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force.

摘要翻译： 引线接合机和使用引线接合机测试引线接合连接的方法。 该方法包括提供半导体组件，该半导体组件具有安装到衬底的半导体管芯，每个衬底具有接合焊盘。 该方法包括将导线接合到一个接合焊盘以形成第一引线接合。 然后将剪切力施加到第一线接合。 当传感器检测到在施加剪切力期间移动的第一线接合时，产生故障信号。

公开(公告)号：US20110241187A1

公开(公告)日：2011-10-06

申请号：US13018438

申请日：2011-02-01

申请人： Liping Guo ,  Qingchun He ,  Zhaojun Tian ,  Jie Yang

发明人： Liping Guo ,  Qingchun He ,  Zhaojun Tian ,  Jie Yang

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame having a recessed die bond area. The lead frame has top and bottom surfaces and a first lead frame thickness defined as the distance between the top and bottom surfaces. The lead frame has a die bond area surface located within a reduced die bond area. A second thickness is defined as the distance between the die bond area surface and the bottom surface. The second lead frame thickness is less than the first lead frame thickness such that a semiconductor die disposed and attached to the die bond area surface has a reduced overall package thickness. A side wall formed between the die bond area surface and the top surface contains the adhesive material used to attach the die, which reduces adhesive bleeding and prevents wire bonding contamination.

摘要翻译： 引线框架，具有凹陷的焊盘区域。 引线框架具有顶部和底部表面以及被定义为顶部和底部表面之间的距离的第一引线框架厚度。 引线框架具有位于减小的管芯接合区域内的管芯接合区域表面。 第二厚度被定义为管芯接合区域表面和底部表面之间的距离。 第二引线框架厚度小于第一引线框架厚度，使得设置并附接到管芯接合区域表面的半导体管芯具有减小的整体封装厚度。 形成在芯片接合区域表面和顶表面之间的侧壁包含用于附接模具的粘合材料，这降低了粘合剂渗出并防止引线接合污染。

公开(公告)号：US20110193207A1

公开(公告)日：2011-08-11

申请号：US13004031

申请日：2011-01-11

申请人： Zhaojun Tian ,  Qingchun He ,  Qiang Liu ,  Jie Yang ,  Shufeng Zhao

发明人： Zhaojun Tian ,  Qingchun He ,  Qiang Liu ,  Jie Yang ,  Shufeng Zhao

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599

摘要： A lead frame for providing electrical interconnection to a semiconductor die has a generally rectangular flag area having first and second major surfaces and four sides. The flag area is sized and shaped to receive a semiconductor die on one of the first and second major surfaces. A first row of leads is located adjacent to a first one of the four sides of the flag area and a second row of leads is located adjacent to a second one of the four sides of the flag area, where the second one of the four sides is adjacent to the first one of the four sides. The remaining two sides do not have any adjacent leads.

摘要翻译： 用于向半导体管芯提供电互连的引线框架具有大致矩形的标记区域，其具有第一和第二主表面和四个侧面。 标记区域的尺寸和形状被设计成在第一和第二主表面之一上接收半导体管芯。 第一排引线位于与标志区域的四个边中的第一个相邻的位置，并且第二排引线位于邻近标志区域的四个边的第二侧的位置，其中四个侧面中的第二个 毗邻四面的第一个。 剩下的两边没有任何相邻的导线。

公开(公告)号：US09328425B2

公开(公告)日：2016-05-03

申请号：US13521347

申请日：2011-08-10

申请人： Qingchun He ,  Qi Zhou ,  Jian Li

发明人： Qingchun He ,  Qi Zhou ,  Jian Li

IPC分类号： C23G5/00 ,  C22F1/18 ,  C22C27/04

CPC分类号： C23G5/00 ,  C22C27/04 ,  C22F1/18

摘要： A device for cleaning the surface of a molybdenum wire at high temperature, comprises a wire pay-off mechanism, a first wire guiding wheel, a cleaning mechanism, a second wire guiding wheel, and a wire take-up mechanism; wherein the two ends of a furnace body of the cleaning mechanism are provided with an inlet hole and an outlet hole for the molybdenum wire. Electrodes connected to a power supply are provided at the inlet hole and in a central part inside the furnace body. An upper part of the furnace body is provided with a gas outlet and a lower part thereof is provided with a wet hydrogen inlet; a heating section is formed between the electrode located at the inlet hole and the electrode located in the central part, and a cooling section is formed between the electrode located in the central part and the outlet hole.

摘要翻译： 一种用于在高温下清洁钼丝表面的装置，包括线放线机构，第一线引导轮，清洁机构，第二线引导轮和引线机构; 其中清洁机构的炉体的两端设有用于钼丝的入口孔和出口孔。 连接到电源的电极设置在炉体的入口孔和中心部分。 炉体的上部设有气体出口，其下部设有湿氢入口; 在位于入口孔的电极和位于中心部分的电极之间形成加热部分，并且在位于中心部分的电极和出口孔之间形成冷却部分。

公开(公告)号：US08642395B2

公开(公告)日：2014-02-04

申请号：US12727258

申请日：2010-03-19

申请人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

发明人： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L33/62

CPC分类号： H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

摘要翻译： 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。

公开(公告)号：US08486540B2

公开(公告)日：2013-07-16

申请号：US13008914

申请日：2011-01-19

申请人： Ting Li ,  Qingchun He ,  Yongqiang Liu

发明人： Ting Li ,  Qingchun He ,  Yongqiang Liu

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L2924/0002 ,  Y10T428/12188 ,  Y10T428/12201 ,  Y10T428/12368 ,  H01L2924/00

摘要： A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block.

摘要翻译： 由导电材料制成的引线框架片一体地形成在其上。 间距构件也由片材形成。 间隔构件中的第一个靠近片材的第一纵向边缘，并且间隔构件中的第二个靠近片材的第二纵向边缘。 间隔构件从片材的下侧表面延伸，并且在使用中将下表面从诸如加热块的表面的平面支撑件间隔开。

公开(公告)号：US20120248590A1

公开(公告)日：2012-10-04

申请号：US13413652

申请日：2012-03-07

申请人： Peng LIU ,  Qingchun He ,  Ping Wu

发明人： Peng LIU ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49537 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers.

摘要翻译： 使用第一和第二引线框组装半导体封装。 第一引线框架包括管芯标记，并且第二引线框架包括引线指。 当第一和第二引线框架配合时，引线指环围绕管芯标记。 模具标记的侧表面被部分蚀刻以在模具标记上形成延伸的芯片附接表面，并且每个引线指的顶表面的部分也被部分地蚀刻以形成与蚀刻的侧表面互补的引线指表面 的旗帜。 半导体管芯附着到延伸管芯附接表面，并且半导体管芯的接合焊盘电连接到引线指。 封装材料覆盖管芯标记和引线指的管芯，电连接和顶表面。

公开(公告)号：US20160141230A1

公开(公告)日：2016-05-19

申请号：US14677964

申请日：2015-04-02

申请人： Peng Liu ,  Qingchun He ,  Ping Wu

发明人： Peng Liu ,  Qingchun He ,  Ping Wu

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/49551 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed.

摘要翻译： 一种半导体器件包括具有管芯支撑区域的引线框架和围绕模具支撑区域的多个内部和外部引线引线，以及安装在管芯支撑区域上并与引线电连接的引线的半导体管芯。 成型材料封装半导体管芯，接合线和引线，并且限定封装主体。 半导体器件还包括从引线垂直延伸到封装主体的顶表面的连接杆。 在执行模制过程之前，连接杆将内排引线连接到相应的外排引线。