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    Substrate Depositing System and Method
    5.
    发明申请
    Substrate Depositing System and Method 审中-公开
    基材沉积体系及方法

    公开(公告)号：US20120094025A1

    公开(公告)日：2012-04-19

    申请号：US13186944

    申请日：2011-07-20

    申请人： Sun-Ho Kim ,  Cheol-Lae Roh ,  Suk-Won Jung ,  Hyun Choi ,  Min-Gyu Seo

    发明人： Sun-Ho Kim ,  Cheol-Lae Roh ,  Suk-Won Jung ,  Hyun Choi ,  Min-Gyu Seo

    IPC分类号： B05D5/00 ,  B05C11/00 ,  B05C13/00

    CPC分类号： H01L51/56 ,  B05D1/02 ,  B05D1/32 ,  H01J37/32743 ,  H01J37/32788 ,  H01J37/32899 ,  H01L21/67173 ,  H01L21/67225

    摘要： A substrate depositing system comprises a substrate loading chamber for receiving a substrate, a substrate unloading chamber for withdrawing the substrate, at least one process chamber disposed between the substrate loading chamber and the substrate unloading chamber for processing the substrate, and a mask keeping chamber connected to one side of the process chamber(s). A substrate depositing method comprises inputting a substrate into a process chamber, transferring a mask to the process chamber from a mask keeping chamber connected to the process chamber, aligning the substrate and the mask, depositing a depositing material on the substrate while moving a deposition source in the process chamber, and withdrawing the substrate from the process chamber.

    摘要翻译： 衬底沉积系统包括用于接收衬底的衬底加载室，用于取出衬底的衬底卸载室，设置在衬底加载室和衬底卸载室之间的至少一个处理室，用于处理衬底;以及掩模保持室连接 到处理室的一侧。 衬底沉积方法包括将衬底输入到处理室中，将掩模从连接到处理室的掩模保持室转移到处理室，对准衬底和掩模，在衬底上沉积沉积材料，同时移动沉积源 在处理室中，并从处理室中取出基板。

    DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    显示基板及其制造方法

    公开(公告)号：US20110169000A1

    公开(公告)日：2011-07-14

    申请号：US12904507

    申请日：2010-10-14

    申请人： JUNG-SUK BANG ,  Byeong-Hoon Cho ,  Sung-Hoon Yang ,  Suk-Won Jung ,  Ki-Hun Jeong

    发明人： JUNG-SUK BANG ,  Byeong-Hoon Cho ,  Sung-Hoon Yang ,  Suk-Won Jung ,  Ki-Hun Jeong

    IPC分类号： H01L33/16 ,  H01L33/00

    CPC分类号： G02F1/136209 ,  G02F2001/13312 ,  G02F2203/11

    摘要： A display substrate includes a first light blocking pattern formed on a base substrate, a first switching element, a second light blocking pattern formed on the base substrate, and a first sensing element. The first light blocking pattern is configured to block visible light and transmit infrared light. The first switching element includes a first semiconductor pattern, a first source electrode, a first drain electrode, and a first gate electrode. The second light blocking pattern is configured to block the visible light and transmit the infrared light. The first sensing element is configured to detect the infrared light, and includes a second semiconductor pattern, a second source electrode, a second drain electrode, and a second gate electrode.

    摘要翻译： 显示基板包括形成在基底基板上的第一遮光图案，第一开关元件，形成在基底基板上的第二遮光图案和第一感测元件。 第一遮光图案被配置为阻挡可见光并透射红外光。 第一开关元件包括第一半导体图案，第一源极电极，第一漏极电极和第一栅极电极。 第二遮光图案被配置为阻挡可见光并透射红外光。 第一感测元件被配置为检测红外光，并且包括第二半导体图案，第二源电极，第二漏电极和第二栅电极。

    SPUTTERING SYSTEM
    9.
    发明申请
    SPUTTERING SYSTEM 失效
    喷射系统

    公开(公告)号：US20110168553A1

    公开(公告)日：2011-07-14

    申请号：US12825285

    申请日：2010-06-28

    申请人： Seung-Ho Choi ,  Suk-Won Jung ,  Young-Mook Choi ,  Hyun-Keun Song

    发明人： Seung-Ho Choi ,  Suk-Won Jung ,  Young-Mook Choi ,  Hyun-Keun Song

    IPC分类号： C23C14/35

    CPC分类号： C23C14/352 ,  H01J37/32449 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/345 ,  H01J37/347

    摘要： A sputtering system is disclosed. The sputtering system includes: a first sputter unit including: a first deposition material plate, a second deposition material plate, where the first and second deposition material plates face each other, and a first magnetic field generator disposed behind each of the first deposition material plate and the second deposition material plate, configured to generate a magnetic field, a second sputter unit including: a third deposition material plate, disposed next to the first deposition material plate, a fourth deposition material plate, disposed next to the second deposition plate, where the third and fourth deposition material plates face each other, and a second magnetic field generator disposed behind each of the third deposition material plate and the fourth deposition material plate, configured to generate a magnetic field, a first gas supply pipe disposed between the first and third deposition material plates, configured to discharge gas to the second and fourth deposition material plates, a second gas supply pipe disposed between the second fourth deposition material plates, configured to discharge gas to the first and third deposition material plates, a first substrate support unit, configured to support a first deposition substrate, oriented toward outer edges of the first and second deposition material plates, and a second substrate support unit, configured to support a second deposition substrate, oriented toward outer edges of the third and fourth deposition material plates.

    摘要翻译： 公开了溅射系统。 溅射系统包括：第一溅射单元，包括：第一沉积材料板，第二沉积材料板，其中第一和第二沉积材料板彼此面对;以及第一磁场发生器，其布置在每个第一沉积材料板的后面 和第二沉积材料板，被配置为产生磁场;第二溅射单元，包括：第三沉积材料板，设置在第一沉积材料板旁边;第四沉积材料板，设置在第二沉积板旁边，其中 所述第三和第四沉积材料板彼此面对;以及第二磁场发生器，设置在每个所述第三沉积材料板和所述第四沉积材料板的后面，被配置为产生磁场;第一气体供给管，设置在所述第一和第二沉积材料板之间， 第三沉积材料板，被配置为将气体排放到第二和第四沉积物 第二气体供给管，设置在第二第四沉积材料板之间，被配置为将气体排放到第一和第三沉积材料板;第一基板支撑单元，被配置为支撑第一沉积基板， 第一和第二沉积材料板和第二衬底支撑单元，其被配置为支撑朝向第三和第四沉积材料板的外边缘定向的第二沉积衬底。