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公开(公告)号:US07690324B1
公开(公告)日:2010-04-06
申请号:US11200338
申请日:2005-08-09
申请人: Jingbin Feng , Steven T. Mayer , Daniel Mark Dinneen , Edmund B. Minshall , Christopher M. Bartlett , Eric G. Webb , R. Marshall Stowell , Mark T. Winslow , Avishai Kepten , Norman D. Kaplan , Richard K. Lyons , John B. Alexy
发明人: Jingbin Feng , Steven T. Mayer , Daniel Mark Dinneen , Edmund B. Minshall , Christopher M. Bartlett , Eric G. Webb , R. Marshall Stowell , Mark T. Winslow , Avishai Kepten , Norman D. Kaplan , Richard K. Lyons , John B. Alexy
IPC分类号: B05C11/02
CPC分类号: C23C18/1619 , H01L21/288 , H01L21/6715 , H01L21/76841
摘要: During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.
摘要翻译: 在衬底表面的流体处理期间,包含衬底晶片的载体/晶片组件封闭微孔容器的顶部。 载体/晶片组件和容器壁限定了用处理流体例如化学镀溶液填充的薄封闭处理体积。 薄流体处理体积通常具有在约100ml至500ml范围内的体积。 优选地,将容器加热并且将处理流体在被注入容器之前被预热。 优选地,薄封闭流体处理体积中的流体的化学组成,温度和其它性质是动态可变的。 冲洗屏和冲洗喷嘴位于容器上方。 漂洗位置的载体/晶片组件基本上封闭了冲洗屏蔽的顶部。
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公开(公告)号:US08257781B1
公开(公告)日:2012-09-04
申请号:US11201709
申请日:2005-08-11
申请人: Eric G. Webb , Steven T. Mayer , David Mark Dinneen , Edmund B. Minshall , Christopher M. Bartlett , R. Marshall Stowell , Mark T. Winslow , Avishai Kepten , Jingbin Feng , Norman D. Kaplan , Richard K. Lyons , John B. Alexy
发明人: Eric G. Webb , Steven T. Mayer , David Mark Dinneen , Edmund B. Minshall , Christopher M. Bartlett , R. Marshall Stowell , Mark T. Winslow , Avishai Kepten , Jingbin Feng , Norman D. Kaplan , Richard K. Lyons , John B. Alexy
IPC分类号: C23C14/00
CPC分类号: C23C18/1617 , C23C18/1632 , C23C18/1676 , C23C18/168 , C23C18/1682 , H01L21/288 , H01L21/6715 , H01L21/76841
摘要: A main reservoir holds cool reactant liquid. A reaction vessel for treating a substrate is connected to the main reservoir by a feed conduit. A heater is configured to heat reactant liquid in the feed conduit before the liquid enters the reaction vessel. Preferably, the heater is a microwave heater. A recycle conduit connects the reaction vessel with the main reservoir. Preferably, a recycle cooler cools reactant liquid in the recycle conduit before the liquid returns to the main reservoir. Preferably, an accumulation vessel is integrated in the feed conduit for accumulating, heating, conditioning and monitoring reactant liquid before it enters the reaction vessel. Preferably, a recycle accumulator vessel is integrated in the recycle conduit to accommodate reactant liquid as it empties out of the reaction vessel.
摘要翻译: 主要储存器容纳冷反应液体。 用于处理基板的反应容器通过进料导管连接到主容器。 加热器构造成在液体进入反应容器之前加热进料管道中的反应物液体。 优选地,加热器是微波加热器。 回收管道将反应容器与主储存器连接。 优选地,再循环冷却器在液体返回到主储存器之前冷却循环管道中的反应物液体。 优选地,积聚容器集成在进料管道中,用于在反应液进入反应容器之前积聚,加热,调节和监测反应液体。 优选地,再循环蓄能器容器集成在再循环管道中,以便当反应物液体从反应容器中排出时容纳反应液体。
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