公开(公告)号：US20100107762A1

公开(公告)日：2010-05-06

申请号：US12610961

申请日：2009-11-02

申请人： Johannes CLASSEN ,  Arnd Kaelberer ,  Patrick Wellner ,  Dietrich Schubert ,  Lars Tebje

发明人： Johannes CLASSEN ,  Arnd Kaelberer ,  Patrick Wellner ,  Dietrich Schubert ,  Lars Tebje

IPC分类号： G01P15/13 ,  H05K3/00

CPC分类号： G01P15/0802 ,  G01P15/125 ,  G01P2015/0831 ,  Y10T29/49124

摘要： An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

摘要翻译： 描述了一种加速度传感器，其具有基底基板，相对于基底基板以固定方式设置的第一电极结构，具有第一电极区域的传感器元件和具有至少一个弹簧元件的弹簧装置。 通过弹簧元件，传感器元件联接到基底基板，使得由于作用在传感器元件上的加速度，传感器元件相对于基底基板偏转，从而改变第一电极结构与第一电极结构之间的距离 电极区域。 传感器元件和第一电极结构至少部分地位于另一个之上，并且由公共功能层形成。

公开(公告)号：US20140117475A1

公开(公告)日：2014-05-01

申请号：US14059202

申请日：2013-10-21

申请人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

发明人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

IPC分类号： B81B7/00

CPC分类号： B81C1/00246 ,  B81C1/0023 ,  B81C2203/075 ,  B81C2203/0771 ,  H01L2224/48463

摘要： A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

摘要翻译： 元件具有至少一个MEMS元件和至少一个由半导体材料制成的盖。 盖子除了作为空腔的终端的机械功能以及微机械结构的保护之外，还具有电功能。 元件的MEMS元件的微机械结构位于载体和盖之间的空腔中，并且包括至少一个结构元件，其可在空腔内偏离组件平面。 该帽包括至少一个在盖的整个厚度上延伸的部分，其与相邻的半导体材料电绝缘，使得其可以独立于帽的其余部分电接触。

公开(公告)号：US20130333469A1

公开(公告)日：2013-12-19

申请号：US13918556

申请日：2013-06-14

申请人： Johannes CLASSEN ,  Christoph GAUGER ,  Patrick WELLNER

发明人： Johannes CLASSEN ,  Christoph GAUGER ,  Patrick WELLNER

IPC分类号： G01C19/56

CPC分类号： G01C19/56 ,  G01C19/5719 ,  G01C19/574 ,  G01C19/5747

摘要： A method for operating and/or measuring a micromechanical device. The device has a first and second seismic mass which are movable by oscillation relative to a substrate; a first drive device for deflecting the first seismic mass and a second drive device for deflecting the second seismic mass, parallel to a drive direction in a first orientation; a third drive device for deflecting the first seismic mass, and a fourth drive device for deflecting the second seismic mass in parallel to the drive direction and according to a second orientation opposite from the first orientation; a first detection device for detecting drive motion of the first seismic mass; and a second detection device for detecting drive motion of the second seismic mass. A first and a second detection signal are generated by the first and second detection devices, the first detection signal being evaluated separately from the second detection signal.

摘要翻译： 一种用于操作和/或测量微机械装置的方法。 该装置具有第一和第二震动块，它们通过相对于基底振动而移动; 第一驱动装置，用于偏转第一抗震块;以及第二驱动装置，用于使第二抗震块平行于第一取向的驱动方向; 第三驱动装置，用于偏转所述第一抗震块;以及第四驱动装置，用于使所述第二抗震块平行于所述驱动方向并且根据与所述第一方向相反的第二方位偏转; 第一检测装置，用于检测第一抗震块的驱动运动; 以及用于检测第二地震块的驱动运动的第二检测装置。 第一和第二检测信号由第一和第二检测装置产生，第一检测信号与第二检测信号分开评估。

公开(公告)号：US20140110800A1

公开(公告)日：2014-04-24

申请号：US14058806

申请日：2013-10-21

申请人： Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

发明人： Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00015 ,  B81B3/0018 ,  B81B7/0058

摘要： A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

摘要翻译： 一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法，具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。 在多步骤各向异性蚀刻中，在平盖基板中制造盖结构，并且包括至少一个安装框架，该安装框架具有至少一个安装表面和止动结构，在盖内侧具有至少一个止动表面， 掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻，并且选择掩模层的布局以及蚀刻步骤的数量和持续时间，使得安装表面，止动表面和 帽内侧位于帽结构的不同表面水平处。

公开(公告)号：US20130285165A1

公开(公告)日：2013-10-31

申请号：US13865825

申请日：2013-04-18

申请人： Johannes CLASSEN ,  Heribert WEBER

发明人： Johannes CLASSEN ,  Heribert WEBER

IPC分类号： B81B7/00 ,  B81C3/00

CPC分类号： B81B7/008 ,  B81C1/00238 ,  B81C1/00246 ,  B81C3/001 ,  B81C2203/0735 ,  B81C2203/0771 ,  B81C2203/0785 ,  H01L2924/1433

摘要： A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated.

摘要翻译： 提供了一种具有非常高的小型化的混合集成部件的制造方法，这些混合集成部件各自具有至少两个具有至少一个分配的ASIC元件的MEMS元件。 最初独立地创建两个MEMS / ASIC晶片堆叠，因为两个ASIC基板彼此独立地被处理; 将半导体衬底安装在两个ASIC衬底中的每一个的处理表面上，随后在两个半导体衬底中的每一个中形成微机械结构。 两个MEMS / ASIC晶片堆叠安装在MEMS之上。 只有随后的组件分离。

公开(公告)号：US20130299925A1

公开(公告)日：2013-11-14

申请号：US13890752

申请日：2013-05-09

申请人： Johannes CLASSEN ,  Mirko HATTASS ,  Daniel Christoph MEISEL

发明人： Johannes CLASSEN ,  Mirko HATTASS ,  Daniel Christoph MEISEL

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00134 ,  B81B3/0018 ,  B81B2201/025 ,  B81C1/00246 ,  B81C1/00333 ,  G01P15/0802

摘要： A micromechanical inertial sensor includes an ASIC element having a processed front side, an MEMS element having a micromechanical sensor structure, and a cap wafer mounted above the micromechanical sensor structure, which sensor structure includes a seismic mass and extends over the entire thickness of the MEMS substrate. The MEMS element is mounted on the processed front side of the ASIC element above a standoff structure and is electrically connected to the ASIC element via through-contacts in the MEMS substrate and in adjacent supports of the standoff structure. A blind hole is formed in the MEMS substrate in the area of the seismic mass, which blind hole is filled with the same electrically conductive material as the through-contacts, the conductive material having a greater density than the MEMS substrate.

摘要翻译： 微机械惯性传感器包括具有经处理的前侧的ASIC元件，具有微机械传感器结构的MEMS元件和安装在微机械传感器结构上方的盖晶片，该传感器结构包括地震块并在MEMS的整个厚度上延伸 基质。 MEMS元件安装在ASIC元件的经处理的前侧，位于支架结构之上，并通过MEMS基板中的通孔和隔离结构的相邻支撑件电连接到ASIC元件。 在地震质量区域中的MEMS衬底中形成盲孔，该盲孔填充有与穿透接触件相同的导电材料，导电材料具有比MEMS衬底更大的密度。

公开(公告)号：US20100122578A1

公开(公告)日：2010-05-20

申请号：US12613083

申请日：2009-11-05

申请人： Johannes CLASSEN

发明人： Johannes CLASSEN

IPC分类号： G01P15/125 ,  H01L21/30

CPC分类号： G01P15/125 ,  G01P15/0802 ,  G01P2015/0831

摘要： A micromechanical component for detecting an acceleration. The component includes a conductive layer having a first and a second electrode and a rotatable flywheel mass in the form of a rocker having a first and a second lever arm. The first lever arm is situated opposite the first electrode, and the second lever arm is situated opposite the second electrode. The first lever arm has a first hole structure having a number of first cut-outs, and the second lever arm has a second hole structure having a number of second cut-outs. The first and the second lever arm have different masses. The component is characterized by the fact that the outer dimensions of the first and second lever arms correspond, and the first hole structure of the first lever arm differs from the second hole structure of the second lever arm. Furthermore, a method for manufacturing such a micromechanical component is provided.

摘要翻译： 用于检测加速度的微机械部件。 该组件包括具有第一和第二电极的导电层和具有第一和第二杠杆臂的摇臂形式的可旋转飞轮块。 第一杠杆臂位于与第一电极相对的位置，第二杠杆臂与第二电极相对。 第一杠杆臂具有具有多个第一切口的第一孔结构，并且第二杠杆臂具有具有多个第二切口的第二孔结构。 第一和第二杠杆臂具有不同的质量。 该部件的特征在于第一和第二杠杆臂的外部尺寸对应，第一杠杆臂的第一孔结构与第二杠杆臂的第二孔结构不同。 此外，提供了一种用于制造这种微机械部件的方法。

公开(公告)号：US20130307096A1

公开(公告)日：2013-11-21

申请号：US13891796

申请日：2013-05-10

申请人： Johannes CLASSEN ,  Jens FREY

发明人： Johannes CLASSEN ,  Jens FREY

IPC分类号： B81B7/00

CPC分类号： B81B7/008 ,  B81C1/0023 ,  B81C1/00238 ,  B81C2203/0792

摘要： A hybrid integrated component including an MEMS element and an ASIC element is refined to improve the capacitive signal detection or activation. The MEMS element is implemented in a layered structure on a semiconductor substrate. The layered structure of the MEMS element includes at least one printed conductor level and at least one functional layer, in which the micromechanical structure of the MEMS element having at least one deflectable structural element is implemented. The ASIC element is mounted face down on the layered structure and functions as a cap for the micromechanical structure. The deflectable structural element of the MEMS element is equipped with at least one electrode of a capacitor system. At least one stationary counter electrode of the capacitor system is implemented in the printed conductor level of the MEMS element, and the ASIC element includes at least one further counter electrode of the capacitor system.

摘要翻译： 改进了包括MEMS元件和ASIC元件的混合集成元件以改善电容信号检测或激活。 MEMS元件以半导体衬底上的分层结构实现。 MEMS元件的分层结构包括至少一个印刷导体水平和至少一个功能层，其中具有至少一个可偏转结构元件的MEMS元件的微机械结构被实现。 ASIC元件面朝下地安装在分层结构上，并且用作微机械结构的盖。 MEMS元件的可偏转结构元件配备有电容器系统的至少一个电极。 电容器系统的至少一个固定对电极在MEMS元件的印刷导体电平中实现，并且ASIC元件包括电容器系统的至少一个另外的对置电极。

公开(公告)号：US20130299928A1

公开(公告)日：2013-11-14

申请号：US13890363

申请日：2013-05-09

申请人： Johannes CLASSEN ,  Heribert WEBER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

发明人： Johannes CLASSEN ,  Heribert WEBER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0075 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00238 ,  B81C1/00674 ,  B81C2203/0109 ,  H01L2224/16225 ,  H01L2924/19105

摘要： A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.

摘要翻译： 混合集成部件包括具有经处理的前侧的ASIC元件，具有在第一MEMS基板的整个厚度上延伸的微机械结构的第一MEMS元件和安装在第一MEMS元件的微机械结构上的第一盖晶片。 第一MEMS元件的微机械结构的至少一个结构元件是可偏转的，并且第一MEMS元件安装在ASIC元件的经处理的正面上，使得在微机械结构和ASIC元件之间存在间隙。 第二个MEMS元件安装在ASIC元件的后侧。 第二MEMS元件的微机械结构在第二MEMS基板的整个厚度上延伸，并且包括至少一个可偏转的结构元件。

公开(公告)号：US20100175473A1

公开(公告)日：2010-07-15

申请号：US12614176

申请日：2009-11-06

申请人： Johannes CLASSEN

发明人： Johannes CLASSEN

IPC分类号： G01P15/10

CPC分类号： G01P15/125 ,  G01P2015/0831

摘要： A sensor system having a substrate, that has a main plane of extension, and a seismic mass, the seismic mass being developed movably about a torsional axis that is parallel to the main plane of extension; and the seismic mass having an asymmetrical mass distribution with respect to the torsional axis; and furthermore an area of the seismic mass facing the substrate is developed symmetrically with respect to the torsional axis.

摘要翻译： 一种具有基板的传感器系统，具有主平面延伸部和地震块，所述震动块围绕平行于所述主平面延伸的扭转轴可移动地发展; 并且相对于扭转轴具有不对称质量分布的地震质量; 此外，面对基板的地震块的面积相对于扭转轴线对称地展开。