公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5167913A

公开(公告)日：1992-12-01

申请号：US813244

申请日：1991-12-23

申请人： John Acocella ,  Philip L. Flaitz ,  Raj N. Master ,  Chandrasekhar Narayan ,  Sarah H. Knickerbocker ,  Paul H. Palmateer ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy

发明人： John Acocella ,  Philip L. Flaitz ,  Raj N. Master ,  Chandrasekhar Narayan ,  Sarah H. Knickerbocker ,  Paul H. Palmateer ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy

IPC分类号： H01L21/48 ,  H05K1/09 ,  H05K3/12 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/1291 ,  H01L21/4846 ,  H01L21/486 ,  H05K1/092 ,  H05K2203/1126 ,  H05K3/4629 ,  Y10T428/12528 ,  Y10T428/12611

摘要： A method of forming an adherent layer of metallurgy on a ceramic substrate which includes the steps of obtaining a ceramic material containing a polymeric binder and copper metallurgy patterns within the ceramic body. In one embodiment of the invention, the ceramic body also contains MgO.Thereafter, a surface layer of metallurgy is formed on the surface of the ceramic body. In one embodiment, the surface layer is nickel and in another embodiment, the surface layer is copper or gold.Then, the ceramic body undergoes a sintering cycle which includes the steps of pyrolysis, binder burnoff and, lastly, densification and, in some cases, crystallization. During densification and crystallization, there is a predetermined steam atmosphere which meets the following requirements: a partial pressure of oxygen less than that necessary to satisfy the equilibrium equation 4Cu+O.sub.2 =2Cu.sub.2 O; and a partial pressure of oxygen less than or equal to that necessary to satisfy the equilibrium equation 2Ni+O.sub.2 =2NiO for nickel in said surface metallurgy.

摘要翻译： 一种在陶瓷基板上形成冶金粘附层的方法，包括以下步骤：在陶瓷体内获得含有聚合物粘合剂和铜冶金图案的陶瓷材料。 在本发明的一个实施例中，陶瓷体还含有MgO。 此后，在陶瓷体的表面上形成表面冶金层。 在一个实施方案中，表面层是镍，在另一个实施方案中，表面层是铜或金。 然后，陶瓷体经历烧结循环，其包括热解，粘合剂燃烧的步骤，最后是致密化，在某些情况下，结晶。 在致密化和结晶过程中，有一个预定的蒸气气氛满足以下要求：氧气分压小于满足平衡方程式4Cu + O2 = 2Cu2O所需的氧分压; 以及小于或等于满足所述表面冶金中镍的平衡方程式2Ni + O2 = 2NiO所需的氧分压。

公开(公告)号：US5541005A

公开(公告)日：1996-07-30

申请号：US438825

申请日：1995-05-11

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/105

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US07666780B2

公开(公告)日：2010-02-23

申请号：US11954828

申请日：2007-12-12

申请人： Jerry A. Gorrell ,  Sarah H. Knickerbocker ,  Srinivasa S. N. Reddy

发明人： Jerry A. Gorrell ,  Sarah H. Knickerbocker ,  Srinivasa S. N. Reddy

IPC分类号： H01L21/44

CPC分类号： H05K3/3457 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2224/29099 ,  H01L2224/05599

摘要： A method is provided for the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and determines if any off-set resulted between the solder mold array and the wafer capture array during the transfer process. The amount of off-set enables the operator to adjust the transfer tool before solder transfer to compensate for the off-set caused by the transfer process and provides a more cost-effective and efficient solder transfer process. A solder reactive material surrounding the capture pads is used to determine where the solder reacts with the solder reactive material showing the off-set resulting from the transfer process. Copper is a preferred solder reactive material.

摘要翻译： 提供了一种用于在晶片或其他电子设备上制造互连焊料凸块的方法。 该方法对于众所周知的C4NP互连技术特别有用，并且确定在传输过程期间在焊料模具阵列和晶片捕获阵列之间是否产生偏移。 偏移量使操作员能够在焊接传输之前调整传送工具，以补偿由传送过程引起的偏移，并提供更具成本效益和更有效的焊接传输过程。 使用围绕捕获垫的焊料反应性材料来确定焊料与焊料反应性材料反应的位置，显示由转移过程导致的偏移。 铜是优选的焊料反应性材料。

公开(公告)号：US5139975A

公开(公告)日：1992-08-18

申请号：US757782

申请日：1991-09-11

申请人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda H. Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

发明人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda H. Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

IPC分类号： B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48

CPC分类号： C04B35/638 ,  B32B18/00 ,  C04B35/634 ,  H01L21/4857 ,  C04B2235/6562 ,  C04B2235/658 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/348 ,  C04B2237/363 ,  C04B2237/565 ,  Y10S428/901 ,  Y10T428/24322

摘要： There is disclosed a sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

摘要翻译： 公开了一种烧结装置，用于在烧结期间增强从多层陶瓷衬底层压板去除碳。 具有金属线和通孔的多层陶瓷基板层叠体设置有紧邻基板层叠体的可还原金属氧化物。 多层陶瓷基板层叠体包含聚合物粘合剂，其在加热时解聚成碳。 基板层压体在相对于可还原金属氧化物还原并相对于碳氧化的气氛中烧结。

公开(公告)号：US4971738A

公开(公告)日：1990-11-20

申请号：US220192

申请日：1988-07-18

申请人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

发明人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

IPC分类号： C04B35/64 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48 ,  H05K3/46

CPC分类号： C04B35/6342 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  C04B35/645 ,  H01L21/4857 ,  C04B2235/6582 ,  C04B2235/6588 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/363 ,  C04B2237/68 ,  C04B2237/704

摘要： There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

公开(公告)号：US5053361A

公开(公告)日：1991-10-01

申请号：US523949

申请日：1990-05-16

申请人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

发明人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

IPC分类号： B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48

CPC分类号： B32B18/00 ,  C04B35/04 ,  C04B35/117 ,  C04B35/14 ,  C04B35/45 ,  C04B35/48 ,  C04B35/634 ,  C04B35/638 ,  C04B38/00 ,  H01L21/4857 ,  C04B2235/3217 ,  C04B2235/3281 ,  C04B2235/6562 ,  C04B2235/658 ,  C04B2235/6582 ,  C04B2235/6588 ,  C04B2235/9623 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/562 ,  C04B2237/565

摘要： There is disclosed a partially sintered setter tile for use in the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in a partially sintered setter tile in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate and partially sintered setter tile are sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

摘要翻译： 公开了一种用于在其烧结期间从多层陶瓷基板层压体去除碳的部分烧结的固定砖。 具有金属线和通孔的多层陶瓷基板层叠体在靠近基板层压体的部分烧结的安装器瓦中设置有可还原的金属氧化物。 多层陶瓷基板层叠体包含聚合物粘合剂，其在加热时解聚成碳。 在相对于可还原金属氧化物还原并且相对于碳氧化的气氛中，将基板层压体和部分烧结的固定器瓦片烧结。

公开(公告)号：US5173331A

公开(公告)日：1992-12-22

申请号：US744621

申请日：1991-08-12

申请人： Richard W. Adams, Jr. ,  David R. Clarke ,  Sarah H. Knickerbocker ,  Linda L. Rapp ,  Bernard Schwartz

发明人： Richard W. Adams, Jr. ,  David R. Clarke ,  Sarah H. Knickerbocker ,  Linda L. Rapp ,  Bernard Schwartz

IPC分类号： C03C10/00 ,  C03C10/08 ,  C03C14/00 ,  C04B35/195 ,  H01L21/48 ,  H05K1/03

CPC分类号： C04B35/195 ,  C03C10/0045 ,  C03C14/004 ,  H01L21/4807 ,  C03C2214/04 ,  C03C2214/20 ,  H05K1/0306

摘要： A ceramic material suitable for packaging of large scale integrated circuits is produced by the process of forming a mixture of a powdered glass ceramic material which is a glassy precursor to cordierite ceramic material, formed by the steps which are as follows:a. Mix tetragonal phase material selected from the group consisting of zirconia of hafnia powder containing a stabilizing oxide compound selected from the group consisting of MgO, CaO and Y.sub.2 O.sub.3 and a glass frit powder or frit of a glassy precursor of cordierite glass ceramic to yield a suspension of solids. Preferably, a binder is included.b. Disperse the suspended solids to yield a dispersion of the zirconia or hafnia with the stabilizing oxide compound and the glassy precursor.c. Densify the dispersion of zirconia or hafnia with the stabilizing oxide compound and the glassy precursor by a sintering heat treatment at a temperature of about 840.degree. C. to melt the glassy precursor into a viscous fluid at a temperature below the melting point of the zirconia or hafnia powder particles to yield a densified intermediate material with the zirconia or hafnia particles encapsulated in the molden glassy precursor.d. Crystallize the densified intermediate material into a polycrystalline composite by heating at 900.degree. C. to 950.degree. C.The process yields a ceramic material consisting of the tetragonal phase material encapsulated in crystalline cordierite glass ceramic material.

摘要翻译： 通过形成由以下步骤形成的堇青石陶瓷材料的玻璃状前体的玻璃陶瓷材料的混合物的制造方法，制造适合于大规模集成电路封装的陶瓷材料。 混合四方相材料，其选自含有选自MgO，CaO和Y 2 O 3的稳定化氧化物的铪粉末的氧化锆和堇青石玻璃陶瓷的玻璃状前体的玻璃料粉末或玻璃料，以产生 固体。 优选地，包括粘合剂。 b。 分散悬浮固体以产生氧化锆或铪的分散体与稳定化氧化物化合物和玻璃状前体。 C。 通过在约840℃的温度下进行烧结热处理，使稳定氧化物化合物和玻璃状前体的氧化锆或铪的分散体致密化，在低于氧化锆熔点的温度下将玻璃状前体熔化成粘性流体，或 铪粉末颗粒产生密实的中间体材料，其中氧化锆或铪颗粒包封在模塑玻璃状前体中。 d。 通过在900℃加热至950℃将致密化的中间体材料结晶成多晶复合材料。该方法产生由包封在结晶堇青石玻璃陶瓷材料中的四方相材料组成的陶瓷材料。