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    Apparatus for removing a heatsink from an electronic module or package
    1.
    发明授权
    Apparatus for removing a heatsink from an electronic module or package 失效
    用于从电子模块或封装去除散热器的装置

    公开(公告)号：US5297618A

    公开(公告)日：1994-03-29

    申请号：US999260

    申请日：1992-12-31

    申请人： John R. Behun ,  Joseph A. Benenati

    发明人： John R. Behun ,  Joseph A. Benenati

    IPC分类号： H01L23/40 ,  F28F7/00

    CPC分类号： H01L23/4006 ,  H01L2023/4087 ,  H01L2224/16

    摘要： A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the heatsink directly over an edge of the module sealing cap. To remove the heatsink from the module, the screw is turned down to contact the cap. Continued turning causes a prying force between the cap and the module whereby the heatsink is peeled away and removed from the module. All forces are directed between the cap and the module thereby eliminating harmful stress from being transmitted through the solder ball connections and to a supporting circuit card.

    摘要翻译： 提供散热器，其可以通过环氧型粘合剂以热传递关系可拆卸地固定到电子模块或封装。 螺杆通过散热器的一端直接设置在模块密封盖的边缘上。 要从模块中卸下散热器，将螺钉向下转动以接触盖子。 继续转动导致盖和模块之间的撬动力，从而将散热器剥离并从模块中移除。 所有的力都被引导在盖和模块之间，从而消除了通过焊球连接和支撑电路卡传递的有害应力。

    Thermal enhancement approach using solder compositions in the liquid state
    2.
    发明授权
    Thermal enhancement approach using solder compositions in the liquid state 失效
    使用焊料组合物处于液态的热增强方法

    公开(公告)号：US06281573B1

    公开(公告)日：2001-08-28

    申请号：US09052296

    申请日：1998-03-31

    申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

    发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

    IPC分类号： H05K720

    CPC分类号： H01L23/3675 ,  H01L23/3736 ,  H01L23/4275 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00 ,  H01L2224/29099

    摘要： Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate.

    摘要翻译： 引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。 焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。 焊料组合物具有通过随着每个温度升高改变状态或相位而吸收和排除热能的性能，并且由与集成电路芯片的热循环相关的温度波动导致的下降。 通过电子模块盖提供从IC芯片到热交换器到周围空气的高热传导（低热阻）的路径，该电子模块盖被构造为具有形成或附接为单个结构的热交换器的盖，并且由 与基材相同的材料，或由具有相容的热膨胀系数的材料制成，以减轻热循环期间垂直位移的影响。 盖 - 热交换器盖被构造成柔性，并且与IC芯片和基板接触。

    Zero force heat sink
    3.
    发明授权
    Zero force heat sink 失效

    公开(公告)号：US5805430A

    公开(公告)日：1998-09-08

    申请号：US687103

    申请日：1996-07-22

    申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

    发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

    IPC分类号： H01L23/40 ,  H02B1/01 ,  H02B7/20

    CPC分类号： H01L23/4006 ,  H01L2224/16225 ,  H01L2924/09701

    摘要： A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or other suitable carrier on which the substrate is positioned. The heat sink extends through an aperture in the frame and is in heat transfer relationship with a surface of the substrate; however, it is mechanically decoupled from the substrate. The invention has particular application in thermally connecting large heat sinks to substrates that are surface mounted on the support using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. In order to provide intimate contact between the substrate and the heat sink, the heat sink must be depressed coaxially through the aperture of the frame against a surface of the substrate and then secured by, for example, gluing while in contact with the surface. However, this downward force imparted by the heat sink is quickly reduced via relaxation of the lead/tin or other metallic elements of the surface mount. A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matches the thermal expansion of the substrate. Thus the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

    Thermal enhancement approach using solder compositions in the liquid state
    7.
    发明授权
    Thermal enhancement approach using solder compositions in the liquid state 失效
    使用焊料组合物处于液态的热增强方法

    公开(公告)号：US06656770B2

    公开(公告)日：2003-12-02

    申请号：US09874826

    申请日：2001-06-05

    申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

    发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

    IPC分类号： H01L2144

    CPC分类号： H01L23/3675 ,  H01L23/3736 ,  H01L23/4275 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00 ,  H01L2224/29099

    摘要： Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. The electronic module cover is a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate in order to provide, in conjunction with the solder composition, a path of high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air.

    摘要翻译： 引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。 焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。 焊料组合物具有通过由于与集成电路芯片的热循环相关的温度波动而导致的每个温度升高和降低而改变状态或相位而吸收和排除热能的所需性质。电子模块盖是具有热量的盖 交换器形成或附接为单个结构，并且由与基底相同的材料制成，或由具有相容的热膨胀系数的材料制成，以减轻热循环期间垂直位移的影响。 盖 - 热交换器盖被构造成柔性，并且与IC芯片和基板接触以便与焊料组合物一起提供从IC芯片到高导热（低热阻）的路径 热交换器到周围空气。

    Zero force heat sink
    9.
    发明授权
    Zero force heat sink 失效
    零力散热器

    公开(公告)号：US06212070B1

    公开(公告)日：2001-04-03

    申请号：US09071897

    申请日：1998-05-05

    申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

    发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  James J. Dankelman ,  Horatio Quinones ,  Karl J. Puttlitz ,  Eric J. Kastberg

    IPC分类号： H05K720

    CPC分类号： H01L23/4006 ,  H01L2224/16225 ,  H01L2924/09701

    摘要： A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matched the thermal expansion of the substrate. Thus, the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

    摘要翻译： 与诸如集成芯片，芯片载体或其它电子封装的衬底的热传递关系的散热器。 散热器连接到框架，该框架连接到印刷电路板或其上放置基板的其它合适的支撑件。 延伸穿过框架中的孔的散热器耦合到衬底的表面。 散热器与基板机械分离。 大型散热器可以热连接到使用诸如陶瓷球或列网格阵列，塑料球或列网格阵列或焊球或列的技术安装的表面安装基板。 散热器同轴地穿过孔径连接到基板。 组装之后，铅/锡或其他金属表面贴装互连件松弛，使得基板并被框架和散热器完全支撑，使零或接近零的向下的力。 因为散热器在组装期间在孔内自由移动，所以散热器封装对于各种不同的衬底是有用的。 优选地，框架是板和多个螺柱。 选择板材以匹配下面的支撑件的热膨胀，并且螺柱材料与基板的热膨胀相匹配。 因此，框架结构允许将组件的膨胀和收缩与下面的衬底和支撑件相匹配。