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公开(公告)号:US4914814A
公开(公告)日:1990-04-10
申请号:US347305
申请日:1989-05-04
CPC分类号: H05K3/3436 , H05K3/3478 , H01L2224/16225 , H05K2201/0379 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/043 , H05K2203/0557 , Y02P70/613 , Y10T29/49149
摘要: A low cost process for fabricating solder column interconnectons for an electronic package is described. The process includes the step of filling an array of pin holes in a pin mold with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads on one side of a chip carrier; heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connnections between the chip carrier and the circuit board. The process is suitable for mass production of reliable, high-density electrical interconnections between a chip carrier and a supporting circuit board.
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公开(公告)号:US5560934A
公开(公告)日:1996-10-01
申请号:US480403
申请日:1995-06-07
申请人: Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
发明人: Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
IPC分类号: C08G59/02 , C07D303/24 , C08G59/00 , C08G59/18 , C08G59/22 , C08G59/24 , C08G59/42 , C08G59/50 , C08L63/00 , H01L23/29 , H01L23/31 , C08G63/00
CPC分类号: C08G59/24 , C07D303/24 , C08G59/18 , C08G59/22 , H01L23/293 , H01L2924/0002 , Y10S428/901 , Y10T428/12528 , Y10T428/12569 , Y10T428/2985 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31525
摘要: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
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公开(公告)号:US5512613A
公开(公告)日:1996-04-30
申请号:US210879
申请日:1994-03-18
申请人: Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
发明人: Ali Afzali-Ardakani , Stephen L. Buchwalter , Jeffrey D. Gelorme , Laura L. Kosbar , Bert H. Newman , Frank L. Pompeo
IPC分类号: C08G59/02 , C07D303/24 , C08G59/00 , C08G59/18 , C08G59/22 , C08G59/24 , C08G59/42 , C08G59/50 , C08L63/00 , H01L23/29 , H01L23/31 , C08G63/00
CPC分类号: C08G59/24 , C07D303/24 , C08G59/18 , C08G59/22 , H01L23/293 , H01L2924/0002 , Y10S428/901 , Y10T428/12528 , Y10T428/12569 , Y10T428/2985 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31525
摘要: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
摘要翻译: 一种适用于包封电子芯片的可切割环氧树脂组合物,其包含含有环酐固化剂和胺促进剂的二环氧化物的固化反应产物。
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