公开(公告)号：US5480503A

公开(公告)日：1996-01-02

申请号：US175727

申请日：1993-12-30

申请人： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

发明人： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

IPC分类号： H01L21/48 ,  H01L21/68 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B32B31/04 ,  B32B31/12 ,  B32B31/26 ,  B32B31/28

CPC分类号： H01L21/568 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5385 ,  H05K3/20 ,  H05K3/4061 ,  H05K3/4617 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T156/1056 ,  Y10T156/1142 ,  Y10T29/49126 ,  Y10T29/49128

摘要： Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.

摘要翻译： 用于生产包括多层陶瓷亚层压板和复合材料的电路化滤纸的方法，该复合材料包括载有薄的陶瓷片材和薄的精细线图案化的导电金属层。 本发明包括在具有可消融脱模层的临时载体支撑件上可释放地支撑薄片，优选地在图案化的导电层之上，并且用导电金属浆料填充该通孔，从而支撑薄的薄片以防止翘曲和变形。 支撑的格子根据需要形成为单层，成对和堆叠，然后与临时支撑件分离使用。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US06277799B1

公开(公告)日：2001-08-21

申请号：US09344886

申请日：1999-06-25

申请人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

发明人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

IPC分类号： C11D172

CPC分类号： C11D11/0047 ,  C11D1/008 ,  C11D1/02 ,  C11D1/24 ,  C11D1/29 ,  C11D1/66 ,  C11D1/662 ,  C11D1/72 ,  C11D1/88 ,  C11D1/90 ,  C11D3/2086 ,  H05K3/1216 ,  H05K3/26

摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。

公开(公告)号：US06280527B1

公开(公告)日：2001-08-28

申请号：US09096841

申请日：1998-06-12

申请人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

发明人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC分类号： B08B308

CPC分类号： C23G1/14 ,  C11D7/06 ,  C11D7/3209 ,  C11D7/3218 ,  C11D11/0047 ,  C23G1/24 ,  G03F7/425 ,  H01L21/4864 ,  H05K1/092 ,  H05K3/1233 ,  H05K3/26 ,  H05K2203/0793 ,  H05K2203/122

摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。

公开(公告)号：US06955777B2

公开(公告)日：2005-10-18

申请号：US10338093

申请日：2003-01-07

申请人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

IPC分类号： B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

CPC分类号： B32B18/00 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01L3/502707 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。

公开(公告)号：US06351871B1

公开(公告)日：2002-03-05

申请号：US09335420

申请日：1999-06-17

申请人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

发明人： Krishna G. Sachdev ,  John T. Butler ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  James N. Humenik ,  John U. Knickerbocker ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  David E. Speed ,  Candace A. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC分类号： A47L2500

CPC分类号： C23G1/14 ,  C11D7/06 ,  C11D7/3209 ,  C11D7/3218 ,  C11D11/0047 ,  C23G1/24 ,  G03F7/425 ,  H01L21/4864 ,  H05K1/092 ,  H05K3/1233 ,  H05K3/26 ,  H05K2203/0793 ,  H05K2203/122

摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。

公开(公告)号：US5857883A

公开(公告)日：1999-01-12

申请号：US854284

申请日：1997-05-09

申请人： John U. Knickerbocker ,  James N. Humenik ,  Andrew R. Knox ,  Robert Rosenberg

发明人： John U. Knickerbocker ,  James N. Humenik ,  Andrew R. Knox ,  Robert Rosenberg

IPC分类号： H01J3/00 ,  H01F7/02 ,  H01F41/16 ,  H01J1/46 ,  H01J9/14 ,  H01J29/46 ,  H01J29/68 ,  H01J31/12 ,  H01J9/02

CPC分类号： H01F7/0278 ,  H01F41/16 ,  H01J29/68

摘要： The present invention relates generally to a new metal/ferrite laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of perforated holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及新的金属/铁氧体层压磁体及其工艺。 更具体地，本发明包括用于制造具有大量穿孔的大面积层压磁体的新方法，集成的金属板和用于电子和电子束控制的电极。 本发明还涉及一种磁矩阵和电子束源及其制造方法。

公开(公告)号：US5139852A

公开(公告)日：1992-08-18

申请号：US503492

申请日：1990-03-30

申请人： Arnold I. Baise ,  Ray M. Bryant ,  Jon A. Casey ,  Allen J. Dam ,  Werner E. Dunkel ,  James N. Humenik ,  Anthony Mastreani ,  Robert W. Nufer ,  Charles H. Perry ,  Salvatore J. Scilla

发明人： Arnold I. Baise ,  Ray M. Bryant ,  Jon A. Casey ,  Allen J. Dam ,  Werner E. Dunkel ,  James N. Humenik ,  Anthony Mastreani ,  Robert W. Nufer ,  Charles H. Perry ,  Salvatore J. Scilla

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： H01L23/5383 ,  C04B41/488 ,  C04B41/4961 ,  H01L21/4857 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。