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公开(公告)号：US6032683A
公开(公告)日：2000-03-07
申请号：US258970
申请日：1999-02-26
申请人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B3/02 , B41F35/00 , G03F1/82 , G03F7/12 , G03F7/42 , H01L21/00 , H05K3/12 , H05K3/26 , B08B3/00
CPC分类号： H01L21/67028 , B08B3/02 , B41F35/005 , G03F1/82 , G03F7/425 , B41P2235/26 , B41P2235/50 , G03F7/12 , H05K3/1216 , H05K3/26
摘要： A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.
摘要翻译： 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。
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公开(公告)号：US5916374A
公开(公告)日：1999-06-29
申请号：US21046
申请日：1998-02-09
申请人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Jon A. Casey , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , John U. Knickerbocker , David C. Long , Daniel S. Mackin , Glenn A. Pomerantz , Krishna G. Sachdev , David E. Speed , Candace A. Sullivan , Robert J. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B3/02 , B41F35/00 , G03F1/82 , G03F7/12 , G03F7/42 , H01L21/00 , H05K3/12 , H05K3/26 , B08B3/04
CPC分类号： H01L21/67028 , B08B3/02 , B41F35/005 , G03F1/82 , G03F7/425 , B41P2235/26 , B41P2235/50 , G03F7/12 , H05K3/1216 , H05K3/26
摘要： A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.
摘要翻译： 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。
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公开(公告)号：US06351871B1
公开(公告)日：2002-03-05
申请号：US09335420
申请日：1999-06-17
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： A47L2500
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。
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公开(公告)号：US06280527B1
公开(公告)日：2001-08-28
申请号：US09096841
申请日：1998-06-12
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B308
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译： 本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。 本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。 更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法 陶瓷（MLC）基板。
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5.发明授权
公开(公告)号：US5888308A
公开(公告)日：1999-03-30
申请号：US808926
申请日：1997-02-28
IPC分类号： B41F35/00 , B41N3/06 , C04B41/53 , C11D1/22 , C11D1/72 , C11D1/74 , C11D1/831 , C11D3/02 , C11D3/08 , C11D3/10 , C11D7/06 , C11D11/00 , H05K3/12 , H05K3/26 , B08B3/12 , C23G1/14
CPC分类号： C11D3/044 , B41N3/06 , C04B41/53 , C11D1/831 , C11D11/0041 , C11D3/08 , C11D3/10 , C11D1/22 , C11D1/72 , C11D1/74 , H05K3/1216 , H05K3/26
摘要： This invention relates to the use of water-based cleaning solutions and their use as environmentally safe replacements of chlorinated hydrocarbon solvents to remove metal-polymer composite paste residue from screening masks and ancillary equipment, such as, used for screening a conductive metal pattern on a ceramic green sheet in the manufacture of multi-layer ceramic products.
摘要翻译： 本发明涉及水性清洁溶液的使用及其作为氯化烃溶剂的环境安全替代物的用途，以从筛选掩模和辅助设备中除去金属 - 聚合物复合糊料残余物，例如用于筛选导电金属图案 陶瓷生片在多层陶瓷制品的制造中。
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公开(公告)号：US06277799B1
公开(公告)日：2001-08-21
申请号：US09344886
申请日：1999-06-25
IPC分类号： C11D172
CPC分类号： C11D11/0047 , C11D1/008 , C11D1/02 , C11D1/24 , C11D1/29 , C11D1/66 , C11D1/662 , C11D1/72 , C11D1/88 , C11D1/90 , C11D3/2086 , H05K3/1216 , H05K3/26
摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.
摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。
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公开(公告)号：US06525009B2
公开(公告)日：2003-02-25
申请号：US09731621
申请日：2000-12-07
IPC分类号： C11D172
CPC分类号： C11D7/3209 , C11D1/72 , C11D3/3719 , C11D3/3765 , C11D7/06 , C11D7/12 , C11D7/14 , C11D7/3218 , C11D11/0047 , C11D11/007 , H05K1/092 , H05K3/1216 , H05K3/26
摘要： An aqueous alkaline cleaning composition for efficient removal of Mo, Cu, W, or Cu/Ni-based conductive paste residue from screening masks, associated screening equipment and the like by using alkali metal salt and/or tetramethyl ammonium salt of polyacrylic acid, acrylic acid-methacrylic acid co-polymer, polyaspartic acid, polylactic acid, poly(acrylic acid-co-maleic anhydride), poly(maleic acid), with excess alkali for pH adjustment in the range of about 11.5-13.5, and a surfactant which may be a medium foam, low foam or no-foam surfactant, and is preferably an amphoteric and/or non-ionic and/or ionic surfactant.
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公开(公告)号：US5938856A
公开(公告)日：1999-08-17
申请号：US876141
申请日：1997-06-13
CPC分类号： C11D11/0047 , C11D7/5022 , H01L21/4864 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12044 , H01L2924/15311 , H05K3/26
摘要： This invention relates to the use of non-halogenated and non-aromatic cleaning solvents as environmentally safe replacement of perchloroethylene and xylene to remove rosin flux residue formed on electronic circuit device materials during solder interconnection process for assembly of electronic components.
摘要翻译： 本发明涉及非卤化和非芳香族清洁溶剂作为环境安全替代全氯乙烯和二甲苯以去除在电子部件组装的焊接互连过程期间在电子电路装置材料上形成的松香助焊剂残渣。
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9.发明授权公开(公告)号：US06742530B2
公开(公告)日：2004-06-01
申请号：US10294236
申请日：2002-11-14
IPC分类号： B08B308
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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10.发明授权公开(公告)号：US06569252B1
公开(公告)日：2003-05-27
申请号：US09609283
申请日：2000-06-30
IPC分类号： C23G502
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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