摘要:
A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.
摘要:
A semiconductor package may include a package substrate, a first semiconductor chip and a second semiconductor chip. The first semiconductor chip may be arranged on the package substrate. The first semiconductor chip may have a plug electrically connected to the package substrate and at least one insulating hole arranged around the plug. The second semiconductor chip may be arranged on the first semiconductor chip. The second semiconductor chip may be electrically connected to the plug. Thus, the insulating hole and the insulating member may ensure an electrical isolation between the plug and the first semiconductor chip, and between the plugs.
摘要:
A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads.
摘要:
A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.
摘要:
A stack package may include a substrate having first and second faces opposite each other and an opening formed therein. The first semiconductor chip may be mounted on the first face of the substrate and include a through electrode in the middle region of the first semiconductor chip that is exposed through the opening. The second semiconductor chip may be stacked on the first semiconductor chip and electrically connected to the first semiconductor chip by the through electrode of the first semiconductor chip. The circuit pattern may be formed on the second face of the substrate and include a bonding pad arranged adjacent to the opening and electrically connected to the through electrode of the first semiconductor chip through the opening, an outer connection pad spaced apart from the bonding pad and a connection wiring extending from the opening to the outer connection pad via the bonding pad.
摘要:
Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of rows of first bonding pads arranged on a base substrate in a first direction, and a first central plating line formed between the rows of first bonding pads to commonly connect with the rows of first bonding pads; forming an electroplating layer on the first bonding pads; and exposing the base substrate by removing the first central plating line.
摘要:
A test apparatus may include a test socket having socket pins with a standard configuration. An intermediate connection board may be interposed between the test socket and a package that has solder balls with a non-standard configuration. The intermediate connection board may have contact balls and contact pads. The contact balls may be arranged in a configuration that is compatible with the standard socket pin configuration, and the contact pads may be arranged in a configuration that is compatible with the non-standard solder ball configuration.
摘要:
Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the semiconductor chips include an internal circuit formed on a semiconductor substrate. A chip pad is disposed on the semiconductor substrate. The chip pad is electrically connected to the internal circuit through an internal interconnection. A passivation layer is provided over the chip pad. A redistributed metal interconnection is provided on the passivation layer. The redistributed metal interconnection directly connects the internal interconnection to the chip pad through a via-hole and a chip pad opening, which penetrate at least the passivation layer. Methods of fabricating the semiconductor chip are also provided.
摘要:
A test apparatus may include a test socket having socket pins with a standard configuration. An intermediate connection board may be interposed between the test socket and a package that has solder balls with a non-standard configuration. The intermediate connection board may have contact balls and contact pads. The contact balls may be arranged in a configuration that is compatible with the standard socket pin configuration, and the contact pads may be arranged in a configuration that is compatible with the non-standard solder ball configuration.
摘要:
Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the semiconductor chips include an internal circuit formed on a semiconductor substrate. A chip pad is disposed on the semiconductor substrate. The chip pad is electrically connected to the internal circuit through an internal interconnection. A passivation layer is provided over the chip pad. A redistributed metal interconnection is provided on the passivation layer. The redistributed metal interconnection directly connects the internal interconnection to the chip pad through a via-hole and a chip pad opening, which penetrate at least the passivation layer. Methods of fabricating the semiconductor chip are also provided.