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公开(公告)号:US07005046B2
公开(公告)日:2006-02-28
申请号:US10217872
申请日:2002-08-13
申请人: Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
发明人: Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
IPC分类号: C25D17/00
CPC分类号: C25D21/14 , C25D7/123 , C25D17/001 , C25D21/18
摘要: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
摘要翻译: 提供了一种系统,其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。
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公开(公告)号:US06454927B1
公开(公告)日:2002-09-24
申请号:US09603791
申请日:2000-06-26
申请人: Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
发明人: Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
IPC分类号: C25B1500
CPC分类号: C25D21/14 , C25D7/123 , C25D17/001 , C25D21/18
摘要: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
摘要翻译: 提供了一种系统,其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。
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公开(公告)号:US06299753B1
公开(公告)日:2001-10-09
申请号:US09387941
申请日:1999-09-01
申请人: Sandy S. Chao , Mark Lloyd
发明人: Sandy S. Chao , Mark Lloyd
IPC分类号: C25D712
摘要: The present invention generally provides a fluid delivery system with particular application to electroplating. Two or more reservoirs are fluidly connected to one or more processing chambers by fluid delivery lines. A gas source is coupled to the reservoirs to selectively pressurize the reservoirs and cause fluid flow therefrom to the processing chambers through the fluid delivery lines. The fluid levels in the reservoirs and the processing chambers are controlled to facilitate avity-assisted flow of fluid from the processing chambers to the reservoirs via the fluid delivery line when the fluid levels in the processing chambers are higher than the fluid levels in the reservoirs. In operation, the reservoirs are alternately filled and emptied with a fluid circulated between the reservoirs and the processing chambers. Alternately filling and emptying the reservoirs relative to one another at constant rates maintains the fluid level and flow rate in the processing chamber substantially constant.
摘要翻译: 本发明通常提供一种特别适用于电镀的流体输送系统。 两个或多个储存器通过流体输送管线流体地连接到一个或多个处理室。 气体源耦合到储存器以选择性地对储存器加压并且使流体从其通过流体输送管线流到处理室。 控制储存器和处理室中的流体液位,以便当处理室中的流体水平高于储存器中的液体水平时,通过流体输送管线促进流体从处理室流向储存器。 在操作中,储存器被交替地填充和排出在储存器和处理室之间循环的流体。 储存器相对于彼此以恒定的速率交替地填充和排空使得处理室中的流体水平和流速基本上恒定。
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