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公开(公告)号:US06621055B2
公开(公告)日:2003-09-16
申请号:US10047500
申请日:2001-10-23
申请人: Joseph M. Weber , Sid J. Reyna , Jennifer C. Roof
发明人: Joseph M. Weber , Sid J. Reyna , Jennifer C. Roof
IPC分类号: H05B102
CPC分类号: H05B1/0294 , G05D23/1932 , H05B3/00 , H05B3/26 , H05B3/28 , H05B2203/003 , H05B2203/013 , H05B2203/017 , H05B2203/035 , H05K1/0212 , H05K1/167 , H05K3/4611 , H05K2201/10053 , H05K2201/10151 , H05K2203/1115 , H05K2203/165
摘要: A thermally controlled circuit board is provided. The circuit board includes a substrate, which carries a thermally controlled circuit. The thermally controlled circuit includes a heater, a logic unit and a thermostat. The heater includes planar resistive elements, which are embedded into the substrate. A power source is selectively coupled to the heater via control of the logic unit. The thermostat is programmed with a temperature set point, and outputs a control signal based on a measured temperature level relative to the temperature set point. The logic unit selectively couples the power source to the heater, based on the control signal output from the thermostat and selectively couples power to on-board components to control the temperature of the board and the components thereon to protect the components and insure reliable operation.