Activated Silicon Precursors For Low Temperature Deposition
    4.
    发明申请
    Activated Silicon Precursors For Low Temperature Deposition 有权
    活性硅前体用于低温沉积

    公开(公告)号:US20130071580A1

    公开(公告)日:2013-03-21

    申请号:US13609551

    申请日:2012-09-11

    IPC分类号: C23C16/50

    摘要: Provided are processes for the low temperature deposition of silicon-containing films using activated SiH-containing precursors. The SiH-containing precursors may have reactive functionality such as halogen or cyano moieties. Described are processes in which halogenated or cyanated silanes are used to deposit SiN films. Plasma processing conditions can be used to adjust the carbon, hydrogen and/or nitrogen content of the films.

    摘要翻译: 提供了使用活化的含SiH的前体来低温沉积含硅膜的方法。 含SiH的前体可以具有反应性官能团,例如卤素或氰基部分。 描述了使用卤化或氰化硅烷沉积SiN膜的方法。 可以使用等离子体处理条件来调节膜的碳,氢和/或氮含量。

    CURING METHODS FOR SILICON DIOXIDE MULTI-LAYERS
    5.
    发明申请
    CURING METHODS FOR SILICON DIOXIDE MULTI-LAYERS 有权
    二氧化硅多层固化方法

    公开(公告)号:US20100255655A1

    公开(公告)日:2010-10-07

    申请号:US12817840

    申请日:2010-06-17

    IPC分类号: H01L21/762

    摘要: Methods of curing a silicon oxide layer on a substrate are provided. The methods may include the processes of providing a semiconductor processing chamber and a substrate and forming an silicon oxide layer filling a portion of a trench on the substrate, the silicon oxide layer including carbon species as a byproduct of formation. The methods also include introducing an acidic vapor into the semiconductor processing chamber, the acidic vapor reacting with the silicon oxide layer to remove the carbon species from the silicon oxide layer. The methods may further include depositing additional silicon oxide over the cured silicon oxide to fill the trench. The methods may also include removing the acidic vapor from the semiconductor processing chamber.

    摘要翻译: 提供了在基板上固化氧化硅层的方法。 所述方法可以包括提供半导体处理室和衬底并形成填充衬底上的沟槽的一部分的氧化硅层的过程,所述氧化硅层包括作为形成副产物的碳物质。 所述方法还包括将酸性蒸汽引入半导体处理室,酸性蒸气与氧化硅层反应以从氧化硅层除去碳物质。 所述方法还可以包括在固化的氧化硅上沉积额外的氧化硅以填充沟槽。 所述方法还可以包括从半导体处理室去除酸性蒸汽。

    BACK CONTACT SOLAR CELL MODULES
    6.
    发明申请
    BACK CONTACT SOLAR CELL MODULES 审中-公开
    返回联系太阳能电池模块

    公开(公告)号:US20100051085A1

    公开(公告)日:2010-03-04

    申请号:US12549291

    申请日:2009-08-27

    IPC分类号: H01L31/042 H01L31/18

    摘要: Embodiments of the invention contemplate the formation of a high efficiency solar cell using a novel processing sequence to form a solar cell device. Methods of forming the high efficiency solar cell may include the use of a prefabricated back plane that is bonded to the metalized solar cell device to form an interconnected solar cell module. Solar cells most likely to benefit from the invention including those having active regions comprising single or multicrystalline silicon with both positive and negative contacts on the rear side of the cell.

    摘要翻译: 本发明的实施例考虑使用新颖的处理顺序形成高效太阳能电池来形成太阳能电池装置。 形成高效率太阳能电池的方法可以包括使用结合到金属化太阳能电池器件的预制背板来形成互连的太阳能电池模块。 最有可能受益于本发明的太阳能电池,包括那些具有活性区域的太阳能电池,所述活性区域包括在电池背面具有正触点和负极的单晶硅或多晶硅。

    Solar Cell Contact Formation Process Using A Patterned Etchant Material
    7.
    发明申请
    Solar Cell Contact Formation Process Using A Patterned Etchant Material 有权
    使用图案化的蚀刻剂材料的太阳能电池触点形成过程

    公开(公告)号:US20090142880A1

    公开(公告)日:2009-06-04

    申请号:US12274023

    申请日:2008-11-19

    IPC分类号: H01L21/02 H01L31/18

    CPC分类号: H01L31/022425 Y02E10/50

    摘要: Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form the active region(s) and the metal contact structure of a solar cell device. In one embodiment, the methods include the use of various etching and patterning processes that are used to define point contacts through a blanket dielectric layer covering a surface of a solar cell substrate. The method generally includes depositing an etchant material that enables formation of a desired pattern in a dielectric layer through which electrical contacts to the solar cell device can be formed.

    摘要翻译: 本发明的实施例考虑使用新的方法形成高效太阳能电池来形成太阳能电池器件的有源区和金属接触结构。 在一个实施例中,所述方法包括使用各种蚀刻和图案化工艺,所述蚀刻和图案化工艺用于通过覆盖太阳能电池基板的表面的覆盖介电层限定点接触。 该方法通常包括沉积能够在可以形成与太阳能电池器件的电接触的电介质层中形成所需图案的蚀刻剂材料。

    Crystalline Solar Cell Metallization Methods
    8.
    发明申请
    Crystalline Solar Cell Metallization Methods 审中-公开
    结晶太阳能电池金属化方法

    公开(公告)号:US20090139568A1

    公开(公告)日:2009-06-04

    申请号:US12273975

    申请日:2008-11-19

    IPC分类号: H01L31/00 H01L21/02 H01L31/18

    CPC分类号: H01L31/022425 Y02E10/50

    摘要: Embodiments of the invention contemplate formation of a low cost solar cell using novel methods and apparatus to form a metal contact structure. The method generally uses a conductive contact layer that enables formation of a good electrical contact to the solar cell device. In one case, the contact layer is a nickel containing layer. Various deposition techniques may be used to form the metal contact structure.

    摘要翻译: 本发明的实施例考虑使用新颖的方法和装置形成金属接触结构来形成低成本太阳能电池。 该方法通常使用能够形成与太阳能电池器件良好的电接触的导电接触层。 在一种情况下,接触层是含镍层。 可以使用各种沉积技术来形成金属接触结构。

    Raman spectroscopy as integrated chemical metrology
    9.
    发明授权
    Raman spectroscopy as integrated chemical metrology 失效
    拉曼光谱作为综合化学计量学

    公开(公告)号:US07542132B2

    公开(公告)日:2009-06-02

    申请号:US11830202

    申请日:2007-07-30

    IPC分类号: G01J3/44 G01N21/65

    CPC分类号: G01N21/65

    摘要: A method for measuring the concentration of the metal solution and reducing agent solution within the electroless plating solution is disclosed. Raman spectroscopy is used to measure the concentration of each solution within the electroless plating solution after they have been mixed together. By measuring the concentration of each solution prior to providing the solution to a plating cell, the concentration of the individual solutions can be adjusted so that the targeted concentration of each solution is achieved. Additionally, each solution can be individually analyzed using Raman spectroscopy prior to mixing with the other solutions. Based upon the Raman spectroscopy measurements of the individual solutions prior to mixing, the individual components that make up each solution can be adjusted prior to mixing so that the targeted component concentration can be achieved.

    摘要翻译: 公开了一种用于测量化学镀溶液中的金属溶液和还原剂溶液的浓度的方法。 拉曼光谱法用于测量化学镀溶液混合在一起后每种溶液的浓度。 通过在将溶液提供给电镀池之前测量每种溶液的浓度,可以调节各溶液的浓度,从而实现每种溶液的目标浓度。 此外,每个溶液可以在与其他溶液混合之前使用拉曼光谱单独分析。 基于混合前单个溶液的拉曼光谱测量,可以在混合之前调整组成每种溶液的各个组分,从而可以实现目标组分浓度。

    Measurement techniques for controlling aspects of a electroless deposition process
    10.
    发明授权
    Measurement techniques for controlling aspects of a electroless deposition process 有权
    用于控制无电沉积工艺方面的测量技术

    公开(公告)号:US07465358B2

    公开(公告)日:2008-12-16

    申请号:US10794592

    申请日:2004-03-05

    IPC分类号: B05C11/00

    摘要: Embodiments of the invention generally provide a fluid processing chamber, sensors and a controller and method for using the same. The fluid processing chamber includes an inlet region, a processing region and an outlet region. The inlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid at the inlet to the processing region. The outlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid leaving the processing region of the chamber. In one embodiment the processing region contains one or more sensors and an external controller to monitor the characteristics of the processing fluid in the processing region. The sensors may include, for example, an ORP probe, a temperature sensor, a conductivity sensor, a dissolved hydrogen sensor, a dissolved oxygen sensor, and a pH sensor. The fluid processing chamber is generally useful for all process steps done to deposit an electroless deposited film on a substrate including, for example, all pre-clean process steps (substrate preparation steps), all electroless activation process steps, all electroless deposition steps, and all post electroless deposition cleaning steps.

    摘要翻译: 本发明的实施例通常提供流体处理室,传感器以及使用该流体处理室的控制器和方法。 流体处理室包括入口区域,处理区域和出口区域。 入口区域通常包含一个或多个传感器和外部控制器,以监控处理区域入口处的处理流体的特性。 出口区域通常包含一个或多个传感器和外部控制器,以监测离开室的处理区域的处理流体的特性。 在一个实施例中,处理区域包含一个或多个传感器和外部控制器,用于监视处理区域中处理流体的特性。 传感器可以包括例如ORP探针,温度传感器,电导率传感器,溶解氢传感器,溶解氧传感器和pH传感器。 流体处理室通常可用于在基底上沉积无电沉积膜的所有工艺步骤,包括例如所有预清洁工艺步骤(衬底制备步骤),所有无电解激活工艺步骤,所有无电沉积步骤和 所有后期无电沉积清洗步骤。