公开(公告)号：US20080061334A1

公开(公告)日：2008-03-13

申请号：US11896952

申请日：2007-09-07

申请人： Ju-Young Jung ,  Suk-Ho Joo ,  Jung-Hoon Park ,  Heung-Jin Joo ,  Hee-San Kim ,  Seung-Kuk Kang ,  Do-Yeon Choi

发明人： Ju-Young Jung ,  Suk-Ho Joo ,  Jung-Hoon Park ,  Heung-Jin Joo ,  Hee-San Kim ,  Seung-Kuk Kang ,  Do-Yeon Choi

IPC分类号： H01L29/94 ,  H01L21/02

CPC分类号： H01L27/11507 ,  H01L21/76849 ,  H01L21/7687 ,  H01L23/5226 ,  H01L27/11502 ,  H01L28/55 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor memory device and a method for forming the same. The method includes forming an insulating layer on a semiconductor substrate having a conductive region, forming a contact hole that exposes the conductive region by etching the insulating layer, forming a barrier metal layer that covers a sidewall and a bottom of the contact hole, and forming a contact plug in the contact hole by interposing the barrier metal layer therebetween. An etching process may be preformed that recesses the barrier metal layer and the contact plug in such a manner that a top surface of the contact plug protrudes upward beyond a top surface of the barrier metal layer. A capping plug may be formed covering the recessed barrier metal layer and the recessed contact plug. A capacitor may be formed on the capping plug.

摘要翻译： 一种半导体存储器件及其形成方法。 该方法包括在具有导电区域的半导体衬底上形成绝缘层，形成通过蚀刻绝缘层而暴露导电区域的接触孔，形成覆盖接触孔的侧壁和底部的阻挡金属层，以及形成 通过在其间插入阻挡金属层，在接触孔中形成接触塞。 可以进行蚀刻工艺，其以使得接触插头的顶表面向上突出超过阻挡金属层的顶表面的方式使阻挡金属层和接触插塞凹陷。 可以形成覆盖凹陷的阻挡金属层和凹入的接触插塞的封盖塞。 可以在封盖上形成电容器。