WAFER BURN-IN SYSTEM WITH PROBE COOLING
    1.
    发明申请
    WAFER BURN-IN SYSTEM WITH PROBE COOLING 审中-公开
    具有探头冷却功能的WAFER BURN-IN系统

    公开(公告)号:US20090206856A1

    公开(公告)日:2009-08-20

    申请号:US12426719

    申请日:2009-04-20

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2877

    摘要: The present disclosure relates to a wafer burn-in system having a device cooling a probe card and thereby restraining heat accumulation in the probe card. The disclosed wafer burn-in system includes a probe station and a tester. The probe station includes a burn-in chamber, a probe head, and a wafer stage. The probe head has a probe card installed on the lower surface of the probe head. A cooling device restrains heat accumulation in the probe card, e.g., by generating airflow around the probe card. The wafer stage of the burn-in chamber fixes a wafer loaded on the upper surface of the wafer stage and elevates the wafer for contact with the probe card. The tester connects to the probe station through a general purpose interface bus (GPIB) to convey test signals to and from the probe head, and to control operation of the cooling device. The tester activates the cooling device, e.g., activates air blowers to generate airflow forcibly around the probe card and thereby restrain heat accumulation in the probe card during a burn-in process performed in the burn-in chamber.

    摘要翻译: 本公开涉及具有冷却探针卡的装置并由此抑制探针卡中的热积聚的晶片老化系统。 所公开的晶片老化系统包括探测台和测试仪。 探针台包括老化室,探针头和晶片台。 探头具有安装在探针头下表面上的探针卡。 冷却装置例如通过在探针卡周围产生气流来限制探针卡中的热积聚。 老化室的晶片台将装载在晶片台的上表面上的晶片固定,并提升晶片以与探针卡接触。 测试仪通过通用接口总线(GPIB)连接到探测站,以将测试信号传送到探头和从探头传出,并控制冷却装置的操作。 测试仪激活冷却装置,例如,激活鼓风机以强制地在探针卡周围产生气流,从而在老化室中进行的老化过程期间抑制探针卡中的热积聚。