摘要:
The present invention relates to a composition comprising Notoginseng radix extract for preventing and treating arthritis as an effective ingredient. Notoginseng radix extract of the present invention inhibits release of tumor necrosis factor-alpha (TNF-α) and is the death of activated T-cells only, so that it can be effectively used for the production of a medicine for preventing and treating arthritis and health food as well.
摘要:
The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant were connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. And, the organic metal compound of the present embodiments has the structure having the connection of the compounds for host and the compounds for dopant, so that its solubility can be remarkably increased owing to the increased molecular weight. Thus, a wet process such as spin coating can be applied for the preparation of the device.
摘要:
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package
摘要:
A chip scale package includes a patterned circuit layer attached to the active surface of a semiconductor chip through an anisotropic conductive adhesive layer such that contact pads on a lower surface of the patterned circuit layer are electrically coupled to corresponding bonding pads on the semiconductor chip. The patterned circuit layer has a plurality of openings formed therein at locations corresponding to the contact pads such that each of the contact pads has a portion exposed from an upper surface of the patterned circuit layer through the corresponding opening. A plurality of metal bumps are respectively disposed in the openings and mounted to the exposed portions of the contact pads for making external electrical connection. The present invention further provides a method for manufacturing the chip scale package at the wafer-level.
摘要:
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.
摘要:
The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which the compounds for host and the compounds for dopant are connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. The organic metal compound of the present embodiments can be effectively used as a coloring material of photoluminescence device since it has low molecular level emitting property. Moreover, the photoluminescence device prepared by using the organic metal compound of the present embodiments has enhanced emitting efficiency, brightness, color purity and lifetime.