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1.
公开(公告)号:US20110140270A1
公开(公告)日:2011-06-16
申请号:US13031945
申请日:2011-02-22
申请人: JUNICHI KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人: JUNICHI KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号: H01L23/498
CPC分类号: H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译: 根据本发明的半导体安装基板包括:基板; 安装在该基板上的半导体器件; 焊料凸块,其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件,其中,接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和 所述基板处于与所述角部对应的位置。
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2.
公开(公告)号:US20080093739A1
公开(公告)日:2008-04-24
申请号:US11873618
申请日:2007-10-17
申请人: Junichi KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人: Junichi KIMURA , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
CPC分类号: H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译: 根据本发明的半导体安装基板包括:基板; 安装在该基板上的半导体器件; 焊料凸块,其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件,其中,接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和 所述基板处于与所述角部对应的位置。
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3.
公开(公告)号:US08217515B2
公开(公告)日:2012-07-10
申请号:US13031945
申请日:2011-02-22
申请人: Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人: Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号: H01L23/34
CPC分类号: H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译: 根据本发明的半导体安装基板包括:基板; 安装在该基板上的半导体器件; 焊料凸块,其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件,其中,接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和 所述基板处于与所述角部对应的位置。
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4.
公开(公告)号:US07919359B2
公开(公告)日:2011-04-05
申请号:US11873618
申请日:2007-10-17
申请人: Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
发明人: Junichi Kimura , Hideki Niimi , Yuji Fuwa , Tsuyoshi Sakaue
IPC分类号: H01L23/52
CPC分类号: H01L21/563 , H01L23/3135 , H01L23/3142 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/023 , H05K3/305 , H05K2201/10522 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要: A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
摘要翻译: 根据本发明的半导体安装基板包括:基板; 安装在该基板上的半导体器件; 焊料凸块,其连接半导体器件和衬底; 填充在半导体器件和衬底之间的空间中的第一树脂; 以及安装在半导体装置的半导体装置的正面侧的电子部件,其中,接合强度增强树脂部至少设置在半导体装置的角部附近的侧面和 所述基板处于与所述角部对应的位置。
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