Apparatus for aligning mask and wafer used in semiconductor circuit
element fabrication
    1.
    发明授权
    Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication 失效
    用于对准半导体电路元件制造中使用的掩模和晶片的装置

    公开(公告)号:US4636626A

    公开(公告)日:1987-01-13

    申请号:US570189

    申请日:1984-01-12

    CPC classification number: G03F9/7023

    Abstract: An alignment apparatus for aligning a semiconductor wafer with an optical mask containing a circuit pattern to be exposed onto the wafer in the fabrication of semiconductor devices by a proximity exposure apparatus. The alignment apparatus includes light beam radiating means for radiating a first and second light beams which are imaged at positions separated by a given gap in a direction substantially perpendicular to two flat sheets, first and second detecting means for respectively detecting the imaging condition of the first and second light beams at the flat sheets, means for relatively moving the light beam radiating means and the flat sheets, and means for discriminating the order of generation of signals from the first and second detecting means, whereby the value of each gap between the selected areas of the two flat sheets at a plurality of places is detected with a high degree of accuracy without changing the gap between the flat sheets thereby making it possible to correct the parallelism, inclination, etc., of the flat sheets.

    Abstract translation: 一种对准装置,用于通过接近曝光装置将半导体晶片与包含要在半导体器件制造中暴露于晶片上的电路图案的光学掩模对准。 对准装置包括光束照射装置,用于辐射第一和第二光束,该第一和第二光束在基本上垂直于两个平板的方向上以给定间隙分开的位置成像;第一和第二检测装置,用于分别检测第一和第二光束的成像条件 并且平板处的第二光束,用于使光束辐射装置和平板相对移动的装置,以及用于鉴别来自第一和第二检测装置的信号的产生顺序的装置,由此所选择的每个间隙之间的值 在不改变平板之间的间隙的情况下以高精度检测多个位置处的两个平板的区域,从而可以校正平板的平行度,倾斜度等。

    Small gap measuring apparatus
    2.
    发明授权
    Small gap measuring apparatus 失效
    小间隙测量仪

    公开(公告)号:US4685805A

    公开(公告)日:1987-08-11

    申请号:US706970

    申请日:1985-03-01

    CPC classification number: G03F9/7065 G03F9/7026

    Abstract: An apparatus for optically measuring the very small gap between a reference plane and a substrate parallel to the reference plane. A beam of energy converging on the reference plane is reflected by the substrate and a spot of reflected beam is formed on a detecting plane at a different position. An array of detecting elements for detecting the size of the spot on the detecting plane is adjusted in position in such a manner that the center of the spot coincides with the center of any one of the detecting elements, thereby preventing any error of the in-focus detecting position due to the deviation between the center of the spot and the center of the detecting element.

    Abstract translation: 一种用于光学测量参考平面与平行于参考平面的基板之间的非常小间隙的装置。 会聚在参考平面上的能量束被衬底反射,并且在不同位置的检测平面上形成反射光束点。 用于检测检测平面上的斑点尺寸的检测元件的阵列被调整到位置,使得斑点的中心与任何一个检测元件的中心一致,从而防止任何误差, 由于点的中心与检测元件的中心之间的偏差导致的焦点检测位置。

    Apparatus for the attitude control of plate-form body
    3.
    发明授权
    Apparatus for the attitude control of plate-form body 失效
    板形体姿态控制装置

    公开(公告)号:US4537501A

    公开(公告)日:1985-08-27

    申请号:US581049

    申请日:1984-02-17

    CPC classification number: G03F7/70691

    Abstract: An apparatus for the attitude control of a plate-form body such as mask or wafer comprises a supporting table, a first movable stage placed on the table and a second movable stage placed on the first stage. The second movable stage is provided means for holding the plate-form body on a reference plane containing the origin of the coordinates defined by two orthogonal coordinate axes. Between the supporting table and the first movable stage there is disposed first driving means. The first driving means is disposed for displacing the first movable stage at at least two positions opposed to each other relative to one of the coordinate axes. The displacement is produced in the direction substantially normal to a segment passing through the origin of the coordinates and forming a determined angle with the reference plane. The displacement of the first stage relative to the table in the direction substantially normal to the above direction is inhibited by first limiting means. Similarly second driving means is disposed between the first and second movable stages for producing the displacement of the second stage at at least two positions opposed to each other relative to the other coordinate axis. The displacement produced by second driving means is in the direction substantially normal to a segment passing through the origin of the coordinates and forming a determined angle with the reference plane. Second limiting means is provided to inhibit the displacement of the second movable stage in the direction substantially normal to the above direction of displacement by the second driving means.

    Abstract translation: 用于诸如掩模或晶片的板状体的姿态控制的装置包括支撑台,放置在桌子上的第一可移动台和放置在第一台上的第二可移动台。 第二可移动台被提供用于将板状体保持在包含由两个正交坐标轴限定的坐标的原点的参考平面上。 在支撑台和第一可移动台之间设置有第一驱动装置。 第一驱动装置被设置用于相对于一个坐标轴彼此相对的至少两个位置移动第一可移动台。 位移沿基本上垂直于穿过坐标原点的段产生,并与参考平面形成确定的角度。 通过第一限制装置禁止第一级相对于桌子在基本上垂直于上述方向的方向上的位移。 类似地,第二驱动装置设置在第一和第二可移动平台之间,用于在相对于另一个坐标轴彼此相对的至少两个位置产生第二平台的位移。 由第二驱动装置产生的位移在与通过坐标原点的段基本上垂直的方向上,并与参考平面形成确定的角度。 第二限制装置被设置为通过第二驱动装置来抑制第二可移动台在基本上垂直于上述移位方向的方向上的位移。

    Mask feed method and apparatus for exposure replicate systems
    4.
    发明授权
    Mask feed method and apparatus for exposure replicate systems 失效
    用于曝光复制系统的掩模进给方法和装置

    公开(公告)号:US4598242A

    公开(公告)日:1986-07-01

    申请号:US627449

    申请日:1984-07-03

    CPC classification number: G03F7/707 G03F7/70741 G03F7/70866

    Abstract: A mask feed method and apparatus for deeding and setting with a high degree of positional accuracy a circuit pattern printing mask in a proximity exposure replicate system for printing integrated circuit patterns on a semiconductor wafer. Arranged on the same stage but separated from a wafer chuck is a mask station on which a mask is set a position different from the exposure position and fed to a mask holder at the exposure position for mask feeding purposes. The mask station is provided with its own displacing means for aligning purposes.Thus, the required movements for mask feeding and alignment purposes are effected by a wafer transfer mechanism.

    Abstract translation: 用于在半导体晶片上印刷集成电路图案的接近曝光复制系统中的电路图案印刷掩模以高位置精度进行定位和设置的掩模馈送方法和装置。 排列在同一台上但与晶片卡盘分离的是掩模台,其上将掩模设置在与曝光位置不同的位置,并且在掩模馈送目的的曝光位置处被馈送到掩模支架。 掩模站设置有用于对准目的的其自身的移位装置。 因此,用于掩模进给和对准目的的所需运动由晶片传送机构实现。

    Method of and apparatus for measuring pattern positions
    5.
    发明授权
    Method of and apparatus for measuring pattern positions 失效
    测量图案位置的方法和装置

    公开(公告)号:US5539521A

    公开(公告)日:1996-07-23

    申请号:US524464

    申请日:1995-09-07

    CPC classification number: G03F7/70691 G01B11/306

    Abstract: A pattern position measuring method of measuring two-dimensional positions of a hyperfine pattern formed on the surface of a substrate. This method comprises a pattern position measuring step of measuring the positions of the pattern in a first flexural configuration produced in a supported state where the measured substrate is supported in a first plurality of positions of the measured substrate on a stage, a flexural configuration detecting step of detecting the first flexural configuration of the surface of the measured substrate, and a correcting step of correcting the pattern positions in the first flexural configuration that are measured by the pattern position measuring step to pattern positions in a second flexural configuration on the basis of the pattern positions in the first flexural configuration that are measured by the pattern position measuring step, the first flexural configuration detected by the flexural configuration detecting step and the previously stored second flexural configuration of the surface of the measured substrate which is produced when the measured substrate is supported in a second plurality of positions different from the first plurality of positions.

    Abstract translation: 测量形成在基板表面上的超精细图案的二维位置的图案位置测量方法。 该方法包括图案位置测量步骤,该图案位置测量步骤测量在支撑状态下产生的第一弯曲构造中的图案的位置,其中所测量的基板被支撑在被测基板的台的第一多个位置中,弯曲构造检测步骤 检测所测量的基板的表面的第一弯曲构造;以及校正步骤,用于校正通过图案位置测量步骤测量的第一弯曲构造中的图案位置,以基于第二弯曲构造来对第二弯曲构造中的图案位置进行 通过图案位置测量步骤测量的第一弯曲构造中的图案位置,由弯曲构造检测步骤检测到的第一弯曲构造以及当测量的衬底是所测量的衬底时所测量的衬底的表面的先前存储的第二弯曲构造 支持在第二个pl 不同于第一组多个职位的职位。

    Method of and apparatus for measuring pattern positions
    6.
    发明授权
    Method of and apparatus for measuring pattern positions 失效
    测量图案位置的方法和装置

    公开(公告)号:US5459577A

    公开(公告)日:1995-10-17

    申请号:US310987

    申请日:1994-09-23

    CPC classification number: G03F7/70691 G01B11/306

    Abstract: A pattern position measuring method measures two-dimensional positions of a hyperfine pattern formed on the surface of a substrate. This method comprises a pattern position measuring step of measuring the positions of the pattern in a first flexural configuration produced in a supported state where the measured substrate is supported in first a plurality of positions of the measured substrate on a stage, a flexural configuration detecting step of detecting the first flexural configuration of the surface of the measured substrate, and a correcting step of correcting the pattern positions in the first flexural configuration that are measured by the pattern position measuring step to pattern positions in a second flexural configuration on the basis of the pattern positions in the first flexural configuration that are measured by the pattern position measuring step, the first flexural configuration detected by the flexural configuration detecting step and the previously stored second flexural configuration of the surface of the measured substrate which is produced when the measured substrate is supported in a second plurality of positions different from the first plurality of positions.

    Abstract translation: 图案位置测量方法测量形成在基底表面上的超精细图案的二维位置。 该方法包括图案位置测量步骤,该图案位置测量步骤首先测量在支撑状态下产生的第一弯曲构造中的图案的位置,其中所测量的基底首先被支撑在测量的基底的多个位置,弯曲构造检测步骤 检测所测量的基板的表面的第一弯曲构造;以及校正步骤,用于校正通过图案位置测量步骤测量的第一弯曲构造中的图案位置,以基于第二弯曲构造来对第二弯曲构造中的图案位置进行 通过图案位置测量步骤测量的第一弯曲构造中的图案位置,由弯曲构造检测步骤检测到的第一弯曲构造和当测量的基底是测量的基底时产生的测量的基底的表面的先前存储的第二弯曲构造 支持在第二个pl 不同于第一组多个职位的职位。

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