利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.016 秒)

    Electronic device
    1.
    发明授权
    Electronic device 有权

    公开(公告)号：US10991673B2

    公开(公告)日：2021-04-27

    申请号：US16591797

    申请日：2019-10-03

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Yoichiro Kurita

    IPC分类号： H01L25/065 ,  H01L23/498 ,  G11C5/04 ,  G06N3/04 ,  H01L25/10

    摘要： According to one embodiment, the interconnect layer includes a fourth conductive member and a fifth conductive member. The fourth conductive member is provided between the first region of the first chip and the third region of the second chip. The fourth conductive member connects the first conductive member of the first chip and the second conductive member of the second chip. The fifth conductive member is provided between the second region of the first chip and the fifth region of the third chip. The fifth conductive member connects the first conductive member of the first chip and the third conductive member of the third chip. The first chip is provided between the first terminal and the second terminal.

    Electronic device
    2.
    发明授权
    Electronic device 有权

    公开(公告)号：US10475767B2

    公开(公告)日：2019-11-12

    申请号：US16029194

    申请日：2018-07-06

    申请人： Kabushiki Kaisha Toshiba

    发明人： Yoichiro Kurita

    IPC分类号： H01L25/065 ,  G06N3/04

    摘要： According to one embodiment, the interconnect layer includes a fourth conductive member and a fifth conductive member. The fourth conductive member is provided between the first region of the first chip and the third region of the second chip. The fourth conductive member connects the first conductive member of the first chip and the second conductive member of the second chip. The fifth conductive member is provided between the second region of the first chip and the fifth region of the third chip. The fifth conductive member connects the first conductive member of the first chip and the third conductive member of the third chip. The first chip is provided between the first terminal and the second terminal.

    Semiconductor device and method for manufacturing same
    3.
    发明授权
    Semiconductor device and method for manufacturing same 有权

    公开(公告)号：US10396060B2

    公开(公告)日：2019-08-27

    申请号：US15904201

    申请日：2018-02-23

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Yoichiro Kurita ,  Hideto Furuyama ,  Hiroshi Uemura

    IPC分类号： H01L25/16 ,  H01L31/02 ,  H01L23/00 ,  H01L21/56 ,  H01L33/62 ,  G02B6/42

    摘要： According to one embodiment, a semiconductor device includes an interconnect layer, an electrical element, an optical element, and a resin portion. The resin portion includes a first partial region between the electrical element and the optical element. At least a portion of the optical element does not overlap the resin portion in a first direction. The first partial region has first and second resin portion surfaces. The second resin portion surface is opposite to the first resin portion surface and opposes the interconnect layer. The optical element has first and second optical element surfaces. The second optical element surface is opposite to the first optical element surface and opposes the interconnect layer. A distance along the first direction between the interconnect layer and the first resin portion surface is longer than a distance along the first direction between the interconnect layer and the first optical element surface.

    Electronic component module
    4.
    发明授权
    Electronic component module 有权

    公开(公告)号：US11239145B2

    公开(公告)日：2022-02-01

    申请号：US16808522

    申请日：2020-03-04

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Yoichiro Kurita ,  Hideto Furuyama

    IPC分类号： H01L23/52 ,  H01L23/498 ,  H01L23/00 ,  H01L23/32

    摘要： According to one embodiment, the electrode pads are provided at a surface of the substrate. The metal pad is provided at the surface of the substrate. The electronic component is mounted to the surface of the substrate. The electronic component includes a plurality of opposing electrodes. The opposing electrodes oppose the electrode pads in a direction toward the surface direction and are electrically connected to the electrode pads. The positioning component is fixed to the metal pad. A gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate is shorter than a minimum distance of the electrode pads.

    Method of manufacturing semiconductor device
    8.
    发明授权
    Method of manufacturing semiconductor device 有权

    公开(公告)号：US10032758B2

    公开(公告)日：2018-07-24

    申请号：US15257433

    申请日：2016-09-06

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Yoichiro Kurita ,  Hideto Furuyama ,  Hiroshi Uemura ,  Fumitaka Ishibashi

    IPC分类号： H01L25/16 ,  H01L23/00

    摘要： According to one embodiment, at first, a compound semiconductor layer is bonded to a position straddling a plurality of chip formation regions arranged on a substrate. One of the chip formation regions has a first size, and the compound semiconductor layer has a second size smaller than the first size. Thereafter, the compound semiconductor layer is processed to provide compound semiconductor elements on the chip formation regions. Then, the substrate is divided to correspond to the chip formation regions.

    Electronic device
    10.
    发明授权
    Electronic device 有权

    公开(公告)号：US11935846B2

    公开(公告)日：2024-03-19

    申请号：US18310094

    申请日：2023-05-01

    申请人： Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    发明人： Yoichiro Kurita ,  Takanobu Kamakura ,  Masayuki Sugiura ,  Yoshiaki Aizawa

    IPC分类号： H01L23/64 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

    CPC分类号： H01L23/645 ,  H01L23/3107 ,  H01L23/367 ,  H01L24/48 ,  H01L2224/48227

    摘要： An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.