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    PRECISION POSITION ALIGNMENT, CALIBRATION AND MEASUREMENT IN PRINTING AND MANUFACTURING SYSTEMS
    3.
    发明申请
    PRECISION POSITION ALIGNMENT, CALIBRATION AND MEASUREMENT IN PRINTING AND MANUFACTURING SYSTEMS 审中-公开

    公开(公告)号：US20180229497A1

    公开(公告)日：2018-08-16

    申请号：US15851419

    申请日：2017-12-21

    申请人： Kateeva, Inc.

    发明人： David C. Darrow ,  Christopher Buchner ,  Robert B. Lowrance ,  Kevin John Li

    IPC分类号： B41J2/045

    CPC分类号： B41J2/04505 ,  B41J2/04586 ,  B41J2/2135 ,  B41J11/0095 ,  B41J25/308

    摘要： This disclosure provides a high precision measurement system for rapid, accurate determination of height of a deposition source relative to a deposition target substrate. In one embodiment, each of two transport paths of an industrial printer mounts a camera and a high precision sensor. The cameras are used to achieve registration between split transport axes, and the positions of the high precision sensors are each precisely determined in terms of xy position. One of the high precision sensors is used to measure height of the deposition source, while another measures height of the target substrate. Relative z axis position between these sensors is identified to provide for precise z-coordinate identification of both source and target substrate. Disclosed embodiments permit dynamic, real-time, high precision height measurement to micron or submicron accuracy.

    Apparatus and Techniques for Electronic Device Encapsulation
    4.
    发明申请
    Apparatus and Techniques for Electronic Device Encapsulation 有权
    电子设备封装的装置和技术

    公开(公告)号：US20150259786A1

    公开(公告)日：2015-09-17

    申请号：US14727602

    申请日：2015-06-01

    申请人： Kateeva, Inc.

    发明人： Alexander Sou-Kang Ko ,  Justin Mauck ,  Eliyahu Vronsky ,  Conor F. Madigan ,  Eugene Rabinovich ,  Nahid Harjee ,  Christopher Buchner ,  Gregory Lewis

    IPC分类号： C23C14/28

    CPC分类号： B05B15/60 ,  B05C13/00 ,  B05C15/00 ,  B05D5/00 ,  B41J2/01 ,  B41J3/407 ,  B41J11/0015 ,  B41J11/002 ,  H01L21/67115 ,  H01L21/6715 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/6776 ,  H01L21/67784 ,  H01L51/00 ,  H01L51/0005 ,  H01L51/5253 ,  H01L51/56

    摘要： Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.

    摘要翻译： 用于制造发光器件（例如有机发光二极管（OLED））器件的装置和技术可以包括使用具有受控环境的一个或多个模块。 受控环境可以保持在大气压或大气压以上的压力。 这些模块可以被布置成提供各种处理区域并且便于打印或以其他方式沉积OLED器件（例如OLED器件的有机封装层（OEL））的一个或多个图案化的有机层。 在一个示例中，可以至少部分地使用气垫来提供对基底的均匀支撑，例如在包括OEL制造工艺的一个或多个印刷，保持或固化操作期间。 在另一个实例中，可以使用诸如由多孔介质提供的分布式真空区域来提供对基底的均匀支撑。

    Apparatus and Techniques for Electronic Device Encapsulation
    8.
    发明申请
    Apparatus and Techniques for Electronic Device Encapsulation 审中-公开

    公开(公告)号：US20170232462A1

    公开(公告)日：2017-08-17

    申请号：US15421190

    申请日：2017-01-31

    申请人： Kateeva, Inc.

    发明人： Alexander Sou-Kang Ko ,  Justin Mauck ,  Eliyahu Vronsky ,  Conor F. Madigan ,  Eugene Rabinovich ,  Nahid Harjee ,  Christopher Buchner ,  Gregory Lewis

    IPC分类号： B05B15/06 ,  H01L51/56 ,  H01L51/52 ,  B41J2/01

    摘要： Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.

    SUBSTRATE PREPARATION CHAMBER WITH SUBSTRATE POSITIONING FEATURES
    10.
    发明申请
    SUBSTRATE PREPARATION CHAMBER WITH SUBSTRATE POSITIONING FEATURES 有权

    公开(公告)号：US20230046459A1

    公开(公告)日：2023-02-16

    申请号：US17817767

    申请日：2022-08-05

    申请人： Kateeva, Inc.

    发明人： Karl Andrew Nordhoff ,  Alexander Sou-Kang Ko ,  Christopher Buchner

    IPC分类号： B41J13/00 ,  B41J13/10 ,  B41J29/00

    摘要： A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure.