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公开(公告)号：US20230314336A1
公开(公告)日：2023-10-05
申请号：US18128125
申请日：2023-03-29
Applicant: KLA Corporation
Inventor： Kuljit S. Virk , Minchuan Zhou , Indrasen Bhattacharya , Abdurrahman Sezginer
CPC classification number: G01N21/8851 , G06T7/001 , H01L22/12
Abstract: An inspection system may develop an inspection recipe by generating N inspection images of a preliminary sample with one or more optical inspection sub-systems associated with N different optical inspection modes, generating probabilities that each of the locations of the preliminary sample are in background or defect classes using a classifier with the inspection images from at least some combinations of a number M of the optical inspection modes, where M is greater than one and less than N and corresponds to a number of the optical inspection modes to include in the inspection recipe, and selecting one of the combinations of M of the optical inspection modes based on a metric describing a distinction between the background and defect classes. The inspection system may further identify defects on a test sample using M inspection images generated with the selected combination of M of the optical inspection modes.
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公开(公告)号：US20230316478A1
公开(公告)日：2023-10-05
申请号：US18128203
申请日：2023-03-29
Applicant: KLA Corporation
Inventor： Robert M. Danen , Sangbong Park , Dmitri Starodub , Abdurrahman Sezginer
CPC classification number: G06T5/50 , G06T7/001 , G06T5/002 , G06T2207/20224 , G06T2207/10024 , G06T2207/20081 , G06T2207/30148
Abstract: An inspection system may generate first-step images of multiple sample regions after a first process step and generate second-step images of the sample regions after a second process step, where the second process step modifies the sample in at least one of the sample regions. The system may further identify one of the sample regions as a test region and at least some of the remaining sample regions as comparison regions, where the second-step image of the test region is a test image and the second-step images of the comparison regions are comparison images. The system may further generate a multi-step difference image by subtracting a combination of at least one of the second-step comparison images and at least two of the first-step images from the test image. The system may further identify defects in the test region associated with the second process step based on the multi-step difference image.
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公开(公告)号：US11748872B2
公开(公告)日：2023-09-05
申请号：US17165826
申请日：2021-02-02
Applicant: KLA Corporation
Inventor： Hong Chen , Bjorn Brauer , Abdurrahman Sezginer , Sangbong Park , Ge Cong , Xiaochun Li
CPC classification number: G06T7/001 , G01N21/8806 , G01N21/8851 , G06T3/4007 , G01N2021/8861 , G01N2021/8887 , G06T2207/30148
Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.
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Patent Agency Ranking
公开(公告)号：US20220383470A1
公开(公告)日：2022-12-01
申请号：US17492321
申请日：2021-10-01
Applicant: KLA Corporation
Inventor： Abdurrahman Sezginer , Wei Zhao , Richard Wallingford , Grace Hsiu-Ling Chen , Xuzhao Liu , Ge Cong , Leon Yu , Kuljit Virk , Bosheng Zhang , Amrish Patel , Patrick McBride
Abstract: A system includes a processing unit communicatively coupled to a detector array of an optical wafer characterization system. The processing unit is configured to perform one or more steps of a method or process including the steps of acquiring one or more target images of a target location on a wafer from the detector array, applying a de-noising filter to at least the one or more target images, determining one or more difference images from one or more reference images and the one or more target images, and up-sampling the one or more difference images to generate one or more up-sampled images. One or more wafer defects are detectable in the one or more difference images or the up-sampled images.
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公开(公告)号：US20220067898A1
公开(公告)日：2022-03-03
申请号：US17165826
申请日：2021-02-02
Applicant: KLA Corporation
Inventor： Hong Chen , Bjorn Brauer , Abdurrahman Sezginer , Sangbong Park , Ge Cong , Xiaochun Li
Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.
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公开(公告)号：US11921052B2
公开(公告)日：2024-03-05
申请号：US18128203
申请日：2023-03-29
Applicant: KLA Corporation
Inventor： Robert M. Danen , Sangbong Park , Dmitri Starodub , Abdurrahman Sezginer
CPC classification number: G01N21/8851 , G06T5/002 , G06T5/50 , G06T7/001 , G01N2021/8887 , G06T2207/10024 , G06T2207/10152 , G06T2207/20081 , G06T2207/20224 , G06T2207/30148 , H01L22/12
Abstract: An inspection system may generate first-step images of multiple sample regions after a first process step and generate second-step images of the sample regions after a second process step, where the second process step modifies the sample in at least one of the sample regions. The system may further identify one of the sample regions as a test region and at least some of the remaining sample regions as comparison regions, where the second-step image of the test region is a test image and the second-step images of the comparison regions are comparison images. The system may further generate a multi-step difference image by subtracting a combination of at least one of the second-step comparison images and at least two of the first-step images from the test image. The system may further identify defects in the test region associated with the second process step based on the multi-step difference image.
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公开(公告)号：US20230351553A1
公开(公告)日：2023-11-02
申请号：US18128184
申请日：2023-03-29
Applicant: KLA Corporation
Inventor： Abdurrahman Sezginer , Patrick McBride , Indrasen Bhattacharya , Robert M. Danen
CPC classification number: G06T5/002 , G06T5/20 , G06T7/001 , G06V20/50 , G06T2207/20224 , G06T2207/30148
Abstract: An inspection system includes a controller including one or more processors configured to execute program instructions. The program instructions cause the one or more processors to receive at least a first portion of a first set of repeat swaths of a first scan path of a sample. The program instructions cause the one or more processors to generate an image by averaging the first portion of the first set of repeat swaths. Averaging the first portion of the first set of repeat swaths reduces a noise in the image. The program instructions cause the one or more processors to detect one or more defects in an inspection region of the sample using the image.
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公开(公告)号：US20210158223A1
公开(公告)日：2021-05-27
申请号：US17098256
申请日：2020-11-13
Applicant: KLA Corporation
Inventor： Abdurrahman Sezginer , Gordon Rouse , Manikandan Mariyappan
IPC: G06N20/10 , G01N21/956 , G01N21/95
Abstract: Context attributes for optical imaging of a patterned layer of a semiconductor die are calculated. Calculating the context attributes includes calculating convolutions of a pattern of the patterned layer with respective kernels of a plurality of kernels, wherein the plurality of kernels is orthogonal. Defects on the semiconductor die are found in accordance with the context attributes.
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