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公开(公告)号：US20230351553A1
公开(公告)日：2023-11-02
申请号：US18128184
申请日：2023-03-29
Applicant: KLA Corporation
Inventor： Abdurrahman Sezginer , Patrick McBride , Indrasen Bhattacharya , Robert M. Danen
CPC classification number: G06T5/002 , G06T5/20 , G06T7/001 , G06V20/50 , G06T2207/20224 , G06T2207/30148
Abstract: An inspection system includes a controller including one or more processors configured to execute program instructions. The program instructions cause the one or more processors to receive at least a first portion of a first set of repeat swaths of a first scan path of a sample. The program instructions cause the one or more processors to generate an image by averaging the first portion of the first set of repeat swaths. Averaging the first portion of the first set of repeat swaths reduces a noise in the image. The program instructions cause the one or more processors to detect one or more defects in an inspection region of the sample using the image.
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公开(公告)号：US20210366103A1
公开(公告)日：2021-11-25
申请号：US17128502
申请日：2020-12-21
Applicant: KLA Corporation
Inventor： Jing Zhang , Yujie Dong , Vishank Bhatia , Patrick McBride , Kris Bhaskar , Brian Duffy
Abstract: A system may be configured for joint defect discovery and optical mode selection. Defects are detected during a defect discovery step. The discovered defects are accumulated into a mode selection dataset. The mode selection dataset is used to perform mode selection to determine a mode combination. The mode combination may then be used to train the defect detection model. Additional defects may then be detected by the defect detection model. The additional defects may then be provided to the mode selection dataset, for further performing mode selection and training the defect detection model. One or more run-time modes may then be determined. The system may be configured for mode selection and defect detection at an image pixel level.
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公开(公告)号：US11769242B2
公开(公告)日：2023-09-26
申请号：US17128502
申请日：2020-12-21
Applicant: KLA Corporation
Inventor： Jing Zhang , Yujie Dong , Vishank Bhatia , Patrick McBride , Kris Bhaskar , Brian Duffy
CPC classification number: G06T7/0004 , G01N21/9501 , G06T2207/20081 , G06T2207/20084 , G06T2207/30148
Abstract: A system may be configured for joint defect discovery and optical mode selection. Defects are detected during a defect discovery step. The discovered defects are accumulated into a mode selection dataset. The mode selection dataset is used to perform mode selection to determine a mode combination. The mode combination may then be used to train the defect detection model. Additional defects may then be detected by the defect detection model. The additional defects may then be provided to the mode selection dataset, for further performing mode selection and training the defect detection model. One or more run-time modes may then be determined. The system may be configured for mode selection and defect detection at an image pixel level.
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公开(公告)号：US20220383470A1
公开(公告)日：2022-12-01
申请号：US17492321
申请日：2021-10-01
Applicant: KLA Corporation
Inventor： Abdurrahman Sezginer , Wei Zhao , Richard Wallingford , Grace Hsiu-Ling Chen , Xuzhao Liu , Ge Cong , Leon Yu , Kuljit Virk , Bosheng Zhang , Amrish Patel , Patrick McBride
Abstract: A system includes a processing unit communicatively coupled to a detector array of an optical wafer characterization system. The processing unit is configured to perform one or more steps of a method or process including the steps of acquiring one or more target images of a target location on a wafer from the detector array, applying a de-noising filter to at least the one or more target images, determining one or more difference images from one or more reference images and the one or more target images, and up-sampling the one or more difference images to generate one or more up-sampled images. One or more wafer defects are detectable in the one or more difference images or the up-sampled images.
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