公开(公告)号：US20140070109A1

公开(公告)日：2014-03-13

申请号：US14115124

申请日：2012-04-06

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Alexander Schwarzman ,  Naor Wainer ,  Amir Livne

IPC分类号： G01T1/24

CPC分类号： G01T1/24 ,  G01T1/244

摘要： A detector array (110) includes a detector (112) configured to detect ionizing radiation and output a signal indicative of the detected radiation, wherein the detector at least includes a semiconductor element (118) and an illumination subsystem (120) configured to generate and transfer sub-band-gap illuminating radiation to selectively illuminate only a sub-portion of the semiconductor element in order to produce a spatially patterned illumination distribution inside the element.

摘要翻译： 检测器阵列（110）包括被配置为检测电离辐射并输出指示检测到的辐射的信号的检测器（112），其中所述检测器至少包括半导体元件（118）和照明子系统（120） 转移子带隙照明辐射以仅选择性地仅照射半导体元件的子部分，以便在元件内产生空间图案化的照明分布。

公开(公告)号：US09748300B2

公开(公告)日：2017-08-29

申请号：US14407325

申请日：2014-09-04

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Nicolaas Johannes Anthonius Van Veen ,  Rafael Goshen ,  David Yogev ,  Amir Livne

IPC分类号： H01L27/14 ,  H01L27/30 ,  H01L21/48 ,  H01L27/146 ,  H01L25/04 ,  H01L23/00

CPC分类号： H01L27/14634 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L25/042 ,  H01L25/043 ,  H01L27/14623 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469 ,  H01L2224/091 ,  H01L2224/09165 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16148 ,  H01L2224/16505 ,  H01L2224/16506 ,  H01L2224/171 ,  H01L2224/81047 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2225/06551 ,  H01L2924/0002 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/12043 ,  H01L2924/00

摘要： The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

公开(公告)号：US11099279B2

公开(公告)日：2021-08-24

申请号：US15756620

申请日：2016-09-15

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Roger Steadman Booker ,  Christoph Herrmann ,  Amir Livne

IPC分类号： G01T1/17 ,  G01T1/24

摘要： A detector signal is corrected by superimposing the detector signal with a correction signal. For providing a valid correction signal, a sampling pulse is periodically or randomly provided. The sampling pulse serves as the initiator for sampling a process signal. During the sampling, the process signal is observed. In case a pulse at the process signal is detected, the sampling is assumed as not being suitable to correct the detector signal, since the pulse affects the process signal. Otherwise, the process signal is further observed during a validation period to validate whether the sampled process value of the process signal has already been influenced by an upcoming pulse at the process signal. In case the sampling is assumed as valid, the sampled process value is used as a basis for providing the correction signal.

公开(公告)号：US09955930B2

公开(公告)日：2018-05-01

申请号：US15118911

申请日：2015-11-02

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Roger Steadman Booker ,  Amir Livne

IPC分类号： A61B6/03 ,  G01T1/24 ,  A61B6/00 ,  H01L27/146

CPC分类号： A61B6/4241 ,  A61B6/03 ,  A61B6/4208 ,  A61B6/4233 ,  G01T1/24 ,  G01T1/243 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14658

摘要： The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array (22) comprising a plurality of detectors (11, 11a-d), a sensor element (14) for converting said received radiation signals (74, 74′) into a plurality of corresponding electric signals, an interposer element (16, 16a-d) extending laterally between a first side (28) and a second side (30), and an integrated circuit element (18, 18a-d). The interposer element (16, 16a-d) comprises a front surface (24) facing said sensor element (14) and a back surface (26) parallel to said front surface (24), wherein a front contact arrangement (36) is provided on said front surface (24) for directing said electric signals to a back contact arrangement (40) provided on said back surface (26). The integrated circuit element faces said back surface (26) and is electrically connected to said back contact arrangement (40).