摘要:
A manufacturing method for a solid-state image sensor, the method comprises the steps of: forming a charge storage region in a photoelectric converting unit by implanting a semiconductor substrate with ions of an impurity of a first conductivity type, using a first mask; heating the semiconductor substrate at a temperature of no less than 800° C. and no more than 1200° C. through RTA (Rapid Thermal Annealing); forming a surface region of the charge storage region by implanting the semiconductor substrate with ions of an impurity of a second conductivity type, using a second a mask; heating the semiconductor substrate at a temperature of no less than 800° C. and no more than 1200° C. through RTA (Rapid Thermal Annealing); and forming an antireflection film that covers the photoelectric converting unit at a temperature of less than 800° C., after the step of forming the surface region, in this order.
摘要:
A manufacturing method for a solid-state image sensor, the method comprises the steps of: forming a charge storage region in a photoelectric converting unit by implanting a semiconductor substrate with ions of an impurity of a first conductivity type, using a first mask; heating the semiconductor substrate at a temperature of no less than 800° C. and no more than 1200° C. through RTA (Rapid Thermal Annealing); forming a surface region of the charge storage region by implanting the semiconductor substrate with ions of an impurity of a second conductivity type, using a second a mask; heating the semiconductor substrate at a temperature of no less than 800° C. and no more than 1200° C. through RTA (Rapid Thermal Annealing); and forming an antireflection film that covers the photoelectric converting unit at a temperature of less than 800° C., after the step of forming the surface region, in this order.
摘要:
An image sensor has a plurality of pixels, each pixel including a photoelectric converter and a pixel circuit for processing signals from the photoelectric converter and outputting processed signals and a scanning circuit, disposed between the photoelectric converters, included in each of at least two adjacent pixels among a plurality of pixels aligned in a single direction. An edge pixel accommodates, in order from an edge of the image sensor toward an interior, a predetermined empty region, a photoelectric converter and a pixel circuit. There is at least one position at which two adjacent pixels, the first of the two pixels accommodating, in order, a pixel circuit, a photoelectric converter and predetermined empty region, the second accommodating, in order, a predetermined empty region, a photoelectric converter and a pixel circuit. The scanning circuit is disposed in the predetermined empty region between the two adjacent pixels.
摘要:
An image sensing apparatus provided with a plurality of image sensing elements each including a plurality of photoelectric conversion sections and an adding circuit adapted to add signals from the plurality of photoelectric conversion sections to obtain a one-pixel signal, wherein the adding circuit adds the signals obtained by the addition are arranged at equal intervals in an area extending over the plurality of image sensing elements.
摘要:
An image sensor comprises a pixel array, and a control unit which performs, in a first period, a control operation of an electric potential of a signal line to turn off a MOS transistor while the electric potential of a charge-voltage converter in a selected pixel is maintained at an electric potential of a selected state, and, in a second period subsequent to the first period, performs a control operation of the electric potential of the signal line to turn on the MOS transistor while the electric potential of the charge-voltage converter in the selected pixel is maintained at an electric potential of the selected state.
摘要:
An image sensing apparatus including an X-ray image sensing unit having a non-destructive read function, adapted to sense an oject image, and a subtractor adapted to sequentially output as a corrected value a difference between a plurality of frames sequentially read out non-destructively from the X-ray image sensing unit and a frame read out before the plurality of frames.
摘要:
An image sensor has a plurality of pixels, each pixel including a photoelectric converter and a pixel circuit for processing signals from the photoelectric converter and outputting processed signals and a scanning circuit, disposed between the photoelectric converters, included in each of at least two adjacent pixels among a plurality of pixels aligned in a single direction. An edge pixel accommodates, in order from an edge of the image sensor toward an interior, a predetermined empty region, a photoelectric converter and a pixel circuit. There is at least one position at which two adjacent pixels, the first of the two pixels accommodating, in order, a pixel circuit, a photoelectric converter and predetermined empty region, the second accommodating, in order, a predetermined empty region, a photoelectric converter and a pixel circuit. The scanning circuit is disposed in the predetermined empty region between the two adjacent pixels.
摘要:
When a phototimer unit is used for exposure control, a deterioration in a S/N ratio occurs, and optimal exposure cannot be performed due to a deviation from a proper image sensing position and the like. Therefore, there is provided a radiation image sensing apparatus comprising an X-ray image sensing panel which is capable of non-destructive reading and adapted to sense an object image by allowing radiation from an X-ray source to pass through an object, and a control circuit adapted to perform control to stop emission of radiation from the X-ray source on the basis of a signal obtained from the X-ray image sensing panel by non-destructive reading in the image sensing operation.
摘要:
A method for manufacturing a semiconductor apparatus for detecting radiation provided with phosphor comprises the steps of forming a phosphor layer integrally with a meshed partition plate having partitions per pixel of the semiconductor apparatus for detecting radiation, and of separating the phosphor per pixel by removing the phosphor on the partitioning portion of the partition plate by the irradiation of laser beam in the form of grooves together with the surface layer of the partitioning portions in order to make the phosphor thick to obtain a higher sensitivity, and also to make pixel pitches finer to enhance resolution, thus obtaining exact images without creating any cross talks between pixels.
摘要:
A large-area, compact and highly reliable radiation detector is produced by a process comprising the steps of laminating a phosphor sheet to a substrate having at least a photoelectric transducer, a driving element and a wiring matrix, and sealing the phosphor sheet and substrate thus laminated, by imparting a sealing medium to at least part of the peripheral portions of the phosphor sheet and the substrate, at least one of the steps being carried out in a vacuum chamber, to thereby bring the phosphor sheet into close contact with the substrate by atmospheric pressure.