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公开(公告)号:US07176388B2
公开(公告)日:2007-02-13
申请号:US10991401
申请日:2004-11-19
申请人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
发明人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
IPC分类号: H05K5/00
CPC分类号: H05K3/3415 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L2924/0002 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K2201/10909 , H05K2203/044 , H05K2203/047 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
摘要翻译: 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中,还包括焊接引线端子到包括焊接区域和电镀通孔的印刷电路板上的焊锡层, 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触,从而向焊盘和通孔提供焊料。
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公开(公告)号:US20050067189A1
公开(公告)日:2005-03-31
申请号:US10991401
申请日:2004-11-19
申请人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
发明人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
IPC分类号: B23K35/26 , B23K1/08 , B23K1/20 , B23K3/06 , B23K35/36 , B23K35/363 , B23K101/42 , C22C13/00 , H05K3/34 , H05K1/18 , H01L23/488 , H01L23/495
CPC分类号: H05K3/3415 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L2924/0002 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K2201/10909 , H05K2203/044 , H05K2203/047 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
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公开(公告)号:US06902102B2
公开(公告)日:2005-06-07
申请号:US10339643
申请日:2003-01-10
申请人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
发明人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
IPC分类号: B23K35/26 , B23K1/08 , B23K1/20 , B23K3/06 , B23K35/36 , B23K35/363 , B23K101/42 , C22C13/00 , H05K3/34
CPC分类号: H05K3/3415 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L2924/0002 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K2201/10909 , H05K2203/044 , H05K2203/047 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
摘要翻译: 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中,还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上,焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触,从而向焊盘和通孔提供焊料。
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公开(公告)号:US20070107214A1
公开(公告)日:2007-05-17
申请号:US11633517
申请日:2006-12-05
申请人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
发明人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
CPC分类号: H05K3/3415 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L2924/0002 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K2201/10909 , H05K2203/044 , H05K2203/047 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
摘要翻译: 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中,还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上,焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触,从而向焊盘和通孔提供焊料。
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公开(公告)号:US07490403B2
公开(公告)日:2009-02-17
申请号:US11633517
申请日:2006-12-05
申请人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
发明人: Kazuhiko Tanabe , Hiroaki Terada , Masahiro Sugiura , Tetsuharu Mizutani , Keiichiro Imamura , Takashi Tanaka
CPC分类号: H05K3/3415 , B23K1/085 , B23K1/20 , B23K3/0653 , B23K35/262 , B23K35/3613 , B23K35/3618 , H01L2924/0002 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K2201/10909 , H05K2203/044 , H05K2203/047 , H05K2203/1572 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
摘要翻译: 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中,还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上,焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触,从而向焊盘和通孔提供焊料。
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公开(公告)号:US08506692B2
公开(公告)日:2013-08-13
申请号:US13118653
申请日:2011-05-31
申请人: Masahiro Sugiura
发明人: Masahiro Sugiura
CPC分类号: F02M25/0836 , G05D16/2013 , Y10T137/7837 , Y10T137/86936 , Y10T137/86944 , Y10T137/86984
摘要: A valve includes a valve housing defining therein a fluid passage composed of a first passage and a second passage, a first valve member configured to open and close the fluid passage, a first biasing member pressing the first valve member in a first valve-closing direction along a flow direction from the first passage to the second passage, a second valve member configured to open and close the fluid passage, a second biasing member pressing the second valve member in a second valve-closing direction along the flow direction from the first passage to the second passage, an electromagnetic driving member having an pressing member opening the first valve member and the second valve member in stages, a third valve member configured to open and close the fluid passage, and a third biasing member pressing the third valve member in a third valve-closing direction along a flow direction from the second passage to the first passage. The third valve member is configured to open the fluid passage when internal pressure of the first passage is higher than internal pressure of the second passage by a predetermined value.
摘要翻译: 阀包括阀壳体,其中限定有由第一通道和第二通道组成的流体通道,构造成打开和关闭流体通道的第一阀构件;第一偏压构件,其按第一阀门关闭方向按压第一阀构件 沿着从所述第一通道到所述第二通道的流动方向,构造成打开和关闭所述流体通道的第二阀构件;第二偏压构件,沿着所述流动方向从所述第一通道按第二阀门关闭方向按压所述第二阀构件; 在第二通道中,具有分段地打开第一阀构件和第二阀构件的按压构件的电磁驱动构件,构造成打开和关闭流体通道的第三阀构件,以及将第三阀构件按压在第三阀构件中的第三施力构件 沿着从第二通道到第一通道的流动方向的第三阀关闭方向。 第三阀构件构造成当第一通道的内部压力高于第二通道的内部压力达预定值时打开流体通道。
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公开(公告)号:US08506691B2
公开(公告)日:2013-08-13
申请号:US13178703
申请日:2011-07-08
申请人: Shigeki Yamada , Masahiro Sugiura
发明人: Shigeki Yamada , Masahiro Sugiura
IPC分类号: F02M25/08
CPC分类号: F28D20/023 , F02M25/0854 , Y02E60/145
摘要: A shaped heat storage material has a shaped body composed of a binder and heat storage capsules containing a heat storage material therein. And, the shaped body has at least one of a projection, a depressed portion and a hollow structure defining a hollow space therein.
摘要翻译: 成形的储热材料具有由粘合剂构成的成形体和在其中容纳蓄热材料的储热胶囊。 并且,成形体具有在其中限定中空空间的突起,凹陷部分和中空结构中的至少一个。
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公开(公告)号:US07953185B2
公开(公告)日:2011-05-31
申请号:US11802986
申请日:2007-05-29
申请人: Masahiro Sugiura
发明人: Masahiro Sugiura
IPC分类号: H04L27/06
CPC分类号: H04L7/0066 , H04L7/0331 , H04L25/4904
摘要: A vehicle communication system has a receiving unit on a vehicle side for inputting a demodulated analog signal to determination units based on a received radio signal from a key unit. Then, one of the two determination units outputs a high-check signal that takes a high value when the analog signal is greater than a high threshold and the other determination unit outputs a low-check signal that takes a low value when the analog signal is smaller than a low threshold. Then, a sync. signal generator successively defines a determination period based on the high and low check signals. Then, a binary level of the analog signal is determined by a level determination unit based on the check signals, along with an estimation and a correction of an indefinite signal when the signal level cannot be determined based on a coding rule and the determination by the determination units.
摘要翻译: 车辆通信系统具有车辆侧的接收单元,用于基于从键单元接收的无线电信号,将解调的模拟信号输入到确定单元。 然后,两个确定单元中的一个确定单元输出当模拟信号大于高阈值时取高值的高检查信号,而另一个确定单元输出当模拟信号为低值时取低值的低检查信号 小于低阈值。 然后,同步。 信号发生器基于高和低检查信号连续地定义确定周期。 然后,当基于校验信号的电平确定单元确定模拟信号的二进制电平时,以及当不能基于编码规则确定信号电平时的不确定信号的估计和校正,以及由 决定单位。
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公开(公告)号:US20090285437A1
公开(公告)日:2009-11-19
申请号:US12437399
申请日:2009-05-07
IPC分类号: H04R25/00
CPC分类号: H04R25/652 , H04R1/1016 , H04R1/1041 , H04R25/656 , H04R2225/61 , H04R2460/09
摘要: An external inserting meatus of user is closed with an insert earphone device in use so that it is hard that external sound penetrates into the external inserting meatus; not only an internal sound propagation path but also an external sound propagation path are formed in an inserting body of the earphone device, and an active diaphragm is provided in the inserting body so as to make the external sound propagation path closed therewith and block the external auditory meatus from the external sound; the active diaphragm is formed from electroactive polymer layer sandwiched between electrodes, and the active diaphragm is deformed in the presence of voltage so as permit the user easily to control it.
摘要翻译: 使用插入式耳机装置关闭用户的外部插入口,使得外部声音难以渗透到外部插入口中; 在耳机装置的插入体中不仅形成内部声音传播路径,而且形成外部声音传播路径,并且在插入体中设置有源隔膜,以使外部声音传播路径闭合,并阻止外部声音传播路径 来自外部声音的听觉口腔; 活性隔膜由夹在电极之间的电活性聚合物层形成,并且有源隔膜在存在电压的情况下变形,从而允许用户容易地控制它。
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公开(公告)号:US20080072552A1
公开(公告)日:2008-03-27
申请号:US11856872
申请日:2007-09-18
IPC分类号: B01D46/00
CPC分类号: B01D46/103 , B01D46/521
摘要: A dust filter of an evaporated fuel treatment device is taught that preferably include a filtration member for filtering air introduced to an atmosphere introduction path, and a casing receiving the filtration member therein. The dust filter being disposed on the atmosphere introduction path of the evaporated fuel treatment device. The filtration member has an arcuate shape in cross section, and wherein the filtration member is arranged and structured such that air flows in a radial direction thereof, so as to be filtered.
摘要翻译: 蒸发燃料处理装置的防尘过滤器被教导,其优选包括用于过滤引入大气引入路径的空气的过滤构件和在其中容纳过滤构件的壳体。 防尘过滤器设置在蒸发燃料处理装置的大气引入路径上。 过滤构件具有弓形的横截面,并且其中过滤构件被布置和构造成使得空气沿其径向方向流动以便被过滤。
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