公开(公告)号：US08581291B2

公开(公告)日：2013-11-12

申请号：US12556134

申请日：2009-09-09

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Takeshi Miyagi ,  Akihiko Happoya ,  Kazuhito Higuchi ,  Tomoyuki Kitani

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Takeshi Miyagi ,  Akihiko Happoya ,  Kazuhito Higuchi ,  Tomoyuki Kitani

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/44 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is an optical semiconductor device includes: a light-emitting layer having a first main surface, a second main surface opposed to the first main surface, a first electrode and a second electrode which are formed on the second main surface; a fluorescent layer provided on the first main surface; a light-transmissive layer provided on the fluorescent layer and made of a light-transmissive inorganic material; a first metal post provided on the first electrode; a second metal post provided on the second electrode; a sealing layer provided on the second main surface so as to seal in the first and second metal posts with one ends of the respective first and second metal posts exposed; a first metal layer provided on the exposed end of the first metal post; and a second metal layer provided on the exposed end of the second metal post.

摘要翻译： 本发明提供一种光半导体装置，具备：具有第一主面，与第一主面相对的第二主面的发光层，形成在第二主面上的第一电极和第二电极; 设置在所述第一主表面上的荧光层; 设置在荧光层上并由透光性无机材料制成的透光层; 设置在所述第一电极上的第一金属柱; 设置在所述第二电极上的第二金属柱; 密封层，设置在所述第二主表面上，以便密封在所述第一和第二金属柱中，所述第一和第二金属柱的一端暴露; 设置在第一金属柱的暴露端上的第一金属层; 以及设置在第二金属柱的暴露端上的第二金属层。

公开(公告)号：US08241937B2

公开(公告)日：2012-08-14

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08039857B2

公开(公告)日：2011-10-18

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08896761B2

公开(公告)日：2014-11-25

申请号：US13350598

申请日：2012-01-13

申请人： Akihiko Happoya ,  Gen Fukaya

发明人： Akihiko Happoya ,  Gen Fukaya

IPC分类号： H04N5/44 ,  H04N5/64 ,  H05K3/28 ,  H05K1/14 ,  H05K1/03 ,  H05K1/11 ,  G02F1/1345

CPC分类号： H04N5/64 ,  G02F1/13452 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/147 ,  H05K3/281 ,  H05K2203/063

摘要： According to one embodiment, a television receiver includes: a housing; a circuit board; a flexible printed wiring board comprising a base layer, a conductive layer, and a protective layer. The circuit board is installed in the housing. The flexible printed wiring board is configured to be electrically connected to the circuit board. The base layer includes a first surface and a second surface positioned on an opposite side of the first surface. The conductive layer is provided on at least one of the first surface and the second surface of the base layer. The protective layer is configured to cover the base layer and the conductive layer, and includes an outer edge portion positioned on an outside of a periphery portion of the base layer.

摘要翻译： 根据一个实施例，电视接收机包括：壳体; 电路板; 柔性印刷线路板，其包括基底层，导电层和保护层。 电路板安装在外壳中。 柔性印刷布线板被配置为电连接到电路板。 基层包括位于第一表面的相对侧上的第一表面和第二表面。 导电层设置在基层的第一表面和第二表面中的至少一个上。 保护层被构造成覆盖基底层和导电层，并且包括定位在基底层的周边部分的外侧上的外边缘部分。

公开(公告)号：US20130037834A1

公开(公告)日：2013-02-14

申请号：US13635993

申请日：2011-02-25

申请人： Akihiko Happoya ,  Masahiro Izumi ,  Tomohiro Sanpei

发明人： Akihiko Happoya ,  Masahiro Izumi ,  Tomohiro Sanpei

IPC分类号： H01L27/15

CPC分类号： H01L33/405 ,  F21K9/232 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/0097 ,  H05K3/242 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to an aspect of the invention, there is provided a light emitting element module substrate including: a laminated plate; and a metal layer. The laminated plate includes a base metal plate and an insulating layer provided on the base metal plate. The metal layer is provided on the insulating layer. The metal layer includes a mounting section on which a light emitting element is to be mounted, and a bonding section to which a wiring electrically connected to the light emitting element is to be bonded. The metal layer includes a silver layer which is an uppermost layer of at least one of the mounting section and the bonding section and is formed by electrolytic plating. The mounting section and the bonding section are electrically isolated from a periphery of the laminated plate.

摘要翻译： 根据本发明的一个方面，提供了一种发光元件模块基板，包括：层压板; 和金属层。 层压板包括基底金属板和设置在基底金属板上的绝缘层。 金属层设置在绝缘层上。 金属层包括安装有发光元件的安装部，以及与发光元件电连接的布线要被接合的接合部。 金属层包括作为安装部和接合部中的至少一个的最上层的银层，并且通过电解电镀形成。 安装部和接合部与层压板的周边电隔离。

公开(公告)号：US20050274542A1

公开(公告)日：2005-12-15

申请号：US11046739

申请日：2005-02-01

申请人： Akihiko Happoya

发明人： Akihiko Happoya

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4691 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0959 ,  H05K2201/09981 ,  Y10T29/49124

摘要： Disclosed is a wiring board including: a first insulating layer made of a flexible material; a second insulating layer stacked on a partial region of the first insulating layer; a first wiring layer disposed between the first insulating layer and the second insulating layer; and a second wiring layer disposed on the second insulating layer, wherein the first insulating layer is composed of two or more insulating layers and further has a third wiring layer in each interlayer of the two or more insulating layers, wherein an electric interlayer connection between the first wiring layer and the third wiring layer has a plating layer of a hollow cylindrical shape or a hollow truncated cone shape, and inside of the hollow is filled by a material of the second insulating layer being transformed and entering therein.

摘要翻译： 公开了一种布线板，包括：由柔性材料制成的第一绝缘层; 层叠在所述第一绝缘层的部分区域上的第二绝缘层; 布置在所述第一绝缘层和所述第二绝缘层之间的第一布线层; 以及设置在所述第二绝缘层上的第二布线层，其中所述第一绝缘层由两个或更多个绝缘层构成，并且在所述两个或更多个绝缘层的每个中间层中还具有第三布线层，其中， 第一布线层和第三布线层具有中空圆柱形状或中空截头圆锥​​形状的镀层，并且中空部的内部被第二绝缘层的材料填充，并被转换并进入其中。

公开(公告)号：US20130081568A1

公开(公告)日：2013-04-04

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05C5/02 ,  B05C13/02 ,  B05C11/00

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

公开(公告)号：US08035212B2

公开(公告)日：2011-10-11

申请号：US12621387

申请日：2009-11-18

申请人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

发明人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.

摘要翻译： 根据一个实施例，提供一种半导体芯片安装体，其在与半导体芯片的角部对应的接合部件的部分处具有增强的抗冲击性。 半导体芯片安装体包括电路板，其电路图案形成在其安装表面上，安装在电路板的电路图案上的半导体芯片和至少布置在电路板和半导体芯片之间的接合部件，以及 在半导体芯片的侧面上将半导体芯片固定在电路板上。 接合部件包含分散在热固性树脂中的热固性树脂和磁性粉末。 磁性粉末局部地设置在位于半导体芯片的角部的接合部件的部分中。

公开(公告)号：US20090188702A1

公开(公告)日：2009-07-30

申请号：US12334413

申请日：2008-12-12

申请人： Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

发明人： Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/281 ,  H05K3/4664 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

摘要： An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.

摘要翻译： 柔性印刷布线板的一个实施例包括：基底层，其包括一个表面和另一个表面，该一个表面被暴露; 形成在所述基底层的另一个表面上的信号层; 层叠在所述基底层上以覆盖所述信号层的覆盖层; 以及涂覆在覆盖层上以覆盖信号层的接地层，所述接地层包括其中混合金属粉末和金属纳米颗粒的导电浆料。

公开(公告)号：US20050279529A1

公开(公告)日：2005-12-22

申请号：US11054430

申请日：2005-02-10

申请人： Akihiko Happoya

发明人： Akihiko Happoya

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K1/147 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/10189 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y10T29/49126

摘要： Disclosed is a wiring board, comprising: a rigid substrate having a first surface and a second surface, wiring layers on the first surface and the second surface, and through hole's inner wall conductors electrically conducting the wiring layers on the first and the second surface, the wiring layer on the first surface including part mounting lands; a flexible substrate disposed to oppose the second surface of the rigid substrate and having connection lands on its surface which is opposite to the second surface of the rigid substrate, the connection lands being positioned to substantially agree with positions of the through hole's inner wall conductors of the rigid substrate; and a connecting member which electrically and mechanically connects the through hole's inner wall conductors and the connection lands, and a magnetic disc apparatus having the wiring board and a production method of the wiring board are disclosed.

摘要翻译： 公开了一种布线板，包括：具有第一表面和第二表面的刚性基板，在第一表面和第二表面上的布线层，以及导电第一和第二表面上的布线层的通孔内壁导体， 所述第一表面上的所述布线层包括部分安装台面; 柔性基板设置成与刚性基板的第二表面相对并且在其表面上具有与刚性基板的第二表面相对的连接平台，连接平台被定位成基本上与通孔的内壁导体的位置一致 刚性基材; 以及将通孔的内壁导体和连接台电连接并机械连接的连接部件，以及具有布线基板的磁盘装置和布线基板的制造方法。