利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

59 条记录 (耗时 0.035 秒)

    Polishing pad
    1.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US08993648B2

    公开(公告)日：2015-03-31

    申请号：US12439154

    申请日：2007-08-16

    申请人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    发明人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    IPC分类号： C08G18/00 ,  B24B37/24 ,  B24D3/26 ,  C08G18/10 ,  C08G18/48 ,  C08G18/66 ,  C08G18/72

    CPC分类号： B24B37/24 ,  B24B29/00 ,  B24D3/26 ,  B24D3/32 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7831 ,  C08G18/3814 ,  C08G18/792

    摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

    摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。

    POLISHING PAD
    2.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20100015893A1

    公开(公告)日：2010-01-21

    申请号：US12439135

    申请日：2007-08-22

    申请人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    发明人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    IPC分类号： B24B1/00 ,  C08G18/10 ,  C08G18/82

    CPC分类号： B24B37/24 ,  B24D3/26 ,  C08G18/12 ,  C08G18/4238 ,  C08G18/4854 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7621 ,  C08J9/30 ,  C08J2375/04 ,  C08L83/00 ,  C08G18/3243

    摘要： An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt %).

    摘要翻译： 本发明的目的是提供一种具有优异的平坦化性能和耐磨性的抛光垫，并提供其制造方法。 本发明涉及一种抛光垫，其包括具有细小细胞的聚氨酯泡沫的抛光层，其中聚氨酯泡沫是（1）能够与4反应的异氰酸酯封端的预聚物（A）的反应的固化产物 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为100℃以上的非发泡聚氨酯，（2）异氰酸酯封端的预聚物（B），其能够与4， 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为40℃以下的非发泡聚氨酯，（3）4,4'-亚甲基双（邻氯苯胺），异氰酸酯 - 封端的预聚物（A）和（B）以50/50至90/10（重量％）的（A）/（B）比混合。

    POLISHING PAD
    4.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20110053377A1

    公开(公告)日：2011-03-03

    申请号：US12531005

    申请日：2008-03-12

    申请人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    发明人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    IPC分类号： H01L21/306 ,  B24D11/00

    CPC分类号： H01L21/30625 ,  B24B37/205

    摘要： An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

    摘要翻译： 本发明的目的是提供一种抛光垫，其防止由于从该工艺的早期阶段到最终阶段的透光率的降低导致终点检测误差，并且提供一种制造方法 具有抛光垫的半导体器件。 本发明涉及一种抛光垫，其包括：抛光层，包括抛光区域和透光区域，其中对所述透光区域的抛光侧表面进行表面粗糙度处理，并且所述光透射区域 使用前在600nm的波长下的透光率为40％〜60％。

    Polishing pad
    5.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US08303372B2

    公开(公告)日：2012-11-06

    申请号：US12439135

    申请日：2007-08-22

    申请人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    发明人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    IPC分类号： B24B1/00

    CPC分类号： B24B37/24 ,  B24D3/26 ,  C08G18/12 ,  C08G18/4238 ,  C08G18/4854 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7621 ,  C08J9/30 ,  C08J2375/04 ,  C08L83/00 ,  C08G18/3243

    摘要： A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.

    摘要翻译： 具有优异的平坦化性能和耐磨性的抛光垫包括包括具有细孔的聚氨酯泡沫的抛光层。 聚氨酯泡沫体是（1）异氰酸酯封端的预聚物（A）与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ的非发泡聚氨酯的反应的固化产物 峰温度为100℃以上，（2）能与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ峰的非发泡聚氨酯的异氰酸酯封端的预聚物（B） 温度为40℃以下，（3）4,4'-亚甲基双（邻氯苯胺）和异氰酸酯封端的预聚物（A）和（B）以（A）/（B）比 为50/50至90/10（重量％）。 如此制成的焊盘用于制造半导体器件。

    Polishing pad
    8.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US09018099B2

    公开(公告)日：2015-04-28

    申请号：US12531005

    申请日：2008-03-12

    申请人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    发明人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    IPC分类号： H01L21/306 ,  B44C1/22 ,  B24B37/20

    CPC分类号： H01L21/30625 ,  B24B37/205

    摘要： An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

    摘要翻译： 本发明的目的是提供一种抛光垫，其防止由于从该工艺的早期阶段到最终阶段的透光率降低导致终点检测误差，并且提供一种制造方法 具有抛光垫的半导体器件。 本发明涉及一种抛光垫，其包括：抛光层，包括抛光区域和透光区域，其中对所述透光区域的抛光侧表面进行表面粗糙度处理，并且所述光透射区域 使用前在600nm的波长下的透光率为40％〜60％。

    POLISHING PAD
    9.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20100003896A1

    公开(公告)日：2010-01-07

    申请号：US12439154

    申请日：2007-08-17

    申请人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    发明人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    IPC分类号： B24B1/00 ,  C08G18/28 ,  C09K3/14 ,  B24D11/00

    CPC分类号： B24B37/24 ,  B24B29/00 ,  B24D3/26 ,  B24D3/32 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7831 ,  C08G18/3814 ,  C08G18/792

    摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

    摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。