公开(公告)号：US07900533B2

公开(公告)日：2011-03-08

申请号：US12448052

申请日：2008-10-17

申请人： Kazuyuki Shiiba ,  Seiji Kuwahara ,  Nobufusa Kobayashi ,  Ichiro Kitaori ,  Toshihiro Fukumasu ,  Atsushi Yoshimura

发明人： Kazuyuki Shiiba ,  Seiji Kuwahara ,  Nobufusa Kobayashi ,  Ichiro Kitaori ,  Toshihiro Fukumasu ,  Atsushi Yoshimura

IPC分类号： B60K20/02

CPC分类号： F16H61/16 ,  F16H59/02 ,  F16H2059/0221 ,  F16H2059/0243 ,  F16H2061/161 ,  F16H2061/166 ,  Y10T74/20085 ,  Y10T477/692

摘要： A controller of an automatic transmission can be set to be in a first control mode and a second control mode for controlling a transmission gear ratio of the automatic transmission. The controller in the second control mode automatically changes the transmission gear ratio. The controller obtains an index value and upper limit speed of rotation speed of a transmission output shaft. The controller in the first control mode allows the transmission gear ratio to be changed when an operation member is operated to increase the transmission gear ratio and the index value is equal to or lower than the upper limit speed. The controller has a setting section that sets the upper limit speed. The setting section sets the upper limit speed based on vehicle acceleration when the controller is in the first control mode and the operation member is operated to increase the transmission gear ratio.

摘要翻译： 可以将自动变速器的控制器设定为控制自动变速器的变速比的第一控制模式和第二控制模式。 控制器在第二个控制模式下自动改变传动比。 控制器获得变速器输出轴的转速和转速上限值。 在第一控制模式下的控制器允许在操作操作构件时改变传动比，以增加传动比，并且指标值等于或低于上限速度。 控制器具有设置上限速度的设置部分。 设定部根据控制器处于第一控制模式时的车辆加速度来设定上限速度，并操作操作部件以增大传动比。

公开(公告)号：US20100004094A1

公开(公告)日：2010-01-07

申请号：US12448052

申请日：2008-10-17

申请人： Kazuyuki Shiiba ,  Seiji Kuwahara ,  Nobufusa Kobayashi ,  Ichiro Kitaori ,  Toshihiro Fukumasu ,  Atsushi Yoshimura

发明人： Kazuyuki Shiiba ,  Seiji Kuwahara ,  Nobufusa Kobayashi ,  Ichiro Kitaori ,  Toshihiro Fukumasu ,  Atsushi Yoshimura

IPC分类号： F16H59/48

CPC分类号： F16H61/16 ,  F16H59/02 ,  F16H2059/0221 ,  F16H2059/0243 ,  F16H2061/161 ,  F16H2061/166 ,  Y10T74/20085 ,  Y10T477/692

摘要： A controller (30) of an automatic transmission (13) can be set to be in a first control mode and a second control mode for controlling a transmission gear ratio (SR) of the automatic transmission (13). The controller (30) in the second control mode automatically changes the transmission gear ratio (SR). The controller (30) obtains an index value and upper limit speed (Lim) of rotation speed (Nout) of a transmission output shaft. The controller (30) in the first control mode allows the transmission gear ratio (SR) to be changed when an operation member (22) is operated to increase the transmission gear ratio (SR) and the index value is equal to or lower than the upper limit speed (Lim). The controller (30) has a setting section (S13) that sets the upper limit speed (Lim). The setting section (S13) sets the upper limit speed (Lim) based on vehicle acceleration (AR) when the controller (30) is in the first control mode and the operation member (22) is operated to increase the transmission gear ratio (SR).

摘要翻译： 可以将自动变速器（13）的控制器（30）设定为第一控制模式和用于控制自动变速器（13）的变速比（SR）的第二控制模式。 在第二控制模式中的控制器（30）自动改变传动比（SR）。 控制器（30）获得变速器输出轴的转速（Nout）的指标值和上限转速（Lim）。 在第一控制模式下的控制器（30）允许当操作操作构件（22）被操作以改变传动变速比（SR）以提高变速比（SR）并且指标值等于或低于 上限速度（Lim）。 控制器（30）具有设定上限速度（Lim）的设定部（S13）。 当控制器（30）处于第一控制模式时，设定部（S13）基于车辆加速度（AR）设定上限速度（Lim），并且操作操作部件（22）增大传动比（SR ）。

公开(公告)号：US09024424B2

公开(公告)日：2015-05-05

申请号：US13586914

申请日：2012-08-16

申请人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

发明人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L25/03 ,  H01L23/495

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

公开(公告)号：US20130062782A1

公开(公告)日：2013-03-14

申请号：US13600153

申请日：2012-08-30

申请人： Atsushi Yoshimura ,  Shoko Omizo

发明人： Atsushi Yoshimura ,  Shoko Omizo

IPC分类号： H01L23/48 ,  B32B38/18 ,  H01L21/50

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/67144 ,  H01L23/3121 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/75745 ,  H01L2224/758 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/181 ,  Y10T156/1744 ,  H01L2924/00014 ,  H01L2924/00012

摘要： After formation of an opening by exposing and development of the photosensitive surface protection film and adhesive layer which is formed on the circuit side of the semiconductor wafer, the semiconductor chips having a photosensitive surface protection film and adhesive layer thereon is fabricated by cutting individual chips from the semiconductor wafer. After the second semiconductor chip is placed over the first semiconductor chip up by the suction collet, the second semiconductor chip is bonded with the first semiconductor chip by the first surface protection film and adhesive layer. The suction side of the suction collet has lower adhesion to the second semiconductor chip than that between the now bonded semiconductor chips.

摘要翻译： 通过曝光和显影形成在半导体晶片的电路侧上的感光表面保护膜和粘合剂层形成开口后，通过将单独的芯片切割成具有感光表面保护膜和粘合剂层的半导体芯片， 半导体晶片。 在第二半导体芯片被吸入夹头放置在第一半导体芯片上之后，第二半导体芯片通过第一表面保护膜和粘合剂层与第一半导体芯片接合。 吸入夹头的吸入侧与现在粘接的半导体芯片之间的吸附侧具有比第二半导体芯片更低的粘附力。

公开(公告)号：US20120306103A1

公开(公告)日：2012-12-06

申请号：US13586914

申请日：2012-08-16

申请人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

发明人： Atsushi Yoshimura ,  Naoyuki Komuta ,  Hideo Numata

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。

公开(公告)号：US08039364B2

公开(公告)日：2011-10-18

申请号：US12662591

申请日：2010-04-23

申请人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

发明人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B28D5/022 ,  H01L21/67132 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752

摘要： An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive layer by using a first blade of which cutting depth reaches the adhesive layer. The adhesive layer is cut together with a part of the dicing tape by using a second blade of which cutting depth reaches the dicing tape and of which width is narrower than the first blade. A semiconductor element sectioned by cutting the semiconductor wafer with the adhesive layer is picked up from the dicing tape, and is adhered on another semiconductor element or a circuit board.

摘要翻译： 厚度超过25μm的粘合剂层和切割带层压在半导体晶片的后表面上。 通过使用切割深度到达粘合剂层的第一刀片将半导体晶片与粘合剂层的一部分一起切割。 通过使用切割深度到达切割带并且宽度比第一刀片窄的第二刀片将粘合剂层与切割带的一部分一起切割。 通过用粘合剂层切割半导体晶片而切割的半导体元件从切割带拾取，并且粘附在另一个半导体元件或电路板上。

公开(公告)号：US08002207B2

公开(公告)日：2011-08-23

申请号：US12093178

申请日：2007-03-27

申请人： Naoya Hashii ,  Keishi Nakano ,  Tsuyoshi Munezane ,  Atsushi Yoshimura ,  Manabu Miyaki

发明人： Naoya Hashii ,  Keishi Nakano ,  Tsuyoshi Munezane ,  Atsushi Yoshimura ,  Manabu Miyaki

IPC分类号： B05B1/00

CPC分类号： F02M61/1853 ,  F02M51/0682 ,  F02M2200/8084 ,  Y10S239/90

摘要： This invention serves to suppress the deterioration of oil tightness of a valve after welding without any change in the direction of fuel injection even with deformation of a convex portion after welding of an injection opening plate to a valve seat, as well as without any variation in the direction of fuel injection due to welding variation. In this invention, in a fuel injection valve which has a valve body for opening and closing a valve seat, and receives an operation signal from a control unit to operate the valve body so that fuel is injected from a plurality of injection holes formed in an injection hole plate welded through a welded portion to a downstream side of the valve seat while passing through a gap between the valve body and the valve seat, said injection hole plate is formed at its central portion with a convex portion which is substantially axisymmetric with respect to a valve seat axis and which has a circular-arc shaped cross section, and said welded portion is also substantially axisymmetric with respect to said valve seat axis. In addition, inlet portions of said injection holes are disposed in an injection hole arrangement surface diametrically outside of said convex portion and diametrically inside of a valve seat opening inner wall which is a minimum inside diameter of said valve seat, and said injection hole arrangement surface is coplanar with a surface having said welded portion.

摘要翻译： 本发明用于抑制即使在将注射开口板焊接到阀座上的凸部的变形之后，也不会发生任何变化，可以抑制焊接后的阀的油封性的劣化，同时燃料喷射方向没有任何变化 由于焊接变化导致燃油喷射的方向。 在本发明中，在具有用于打开和关闭阀座的阀体的燃料喷射阀中，并接收来自控制单元的操作信号以操作阀体，使得从形成在阀座中的多个喷射孔喷射燃料 喷射孔板在通过阀体和阀座之间的间隙的同时通过焊接部分焊接到阀座的下游侧，所述喷射孔板在其中心部分处形成有凸部，其基本上相对于轴对称 到阀座轴线并且具有圆弧形横截面，并且所述焊接部分也相对于所述阀座轴线基本上是轴对称的。 此外，所述喷射孔的入口部分设置在所述凸部的径向外侧的喷射孔配置表面中，并且直径位于所述阀座的最小内径的阀座开口内壁的内侧，并且所述喷射孔装置表面 与具有所述焊接部分的表面共面。

公开(公告)号：US20100207252A1

公开(公告)日：2010-08-19

申请号：US12662591

申请日：2010-04-23

申请人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

发明人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

IPC分类号： H01L21/78 ,  H01L23/00

CPC分类号： H01L21/78 ,  B28D5/022 ,  H01L21/67132 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752

摘要： An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive layer by using a first blade of which cutting depth reaches the adhesive layer. The adhesive layer is cut together with a part of the dicing tape by using a second blade of which cutting depth reaches the dicing tape and of which width is narrower than the first blade. A semiconductor element sectioned by cutting the semiconductor wafer with the adhesive layer is picked up from the dicing tape, and is adhered on another semiconductor element or a circuit board.

摘要翻译： 厚度超过25μm的粘合剂层和切割带层压在半导体晶片的后表面上。 通过使用切割深度到达粘合剂层的第一刀片将半导体晶片与粘合剂层的一部分一起切割。 通过使用切割深度到达切割带并且宽度比第一刀片窄的第二刀片将粘合剂层与切割带的一部分一起切割。 通过用粘合剂层切割半导体晶片而切割的半导体元件从切割带拾取，并且粘附在另一个半导体元件或电路板上。

公开(公告)号：US07736999B2

公开(公告)日：2010-06-15

申请号：US11715961

申请日：2007-03-09

申请人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

发明人： Atsushi Yoshimura ,  Tadanobu Okubo ,  Shigetaka Onishi

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B28D5/022 ,  H01L21/67132 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752

摘要： An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive layer by using a first blade of which cutting depth reaches the adhesive layer. The adhesive layer is cut together with a part of the dicing tape by using a second blade of which cutting depth reaches the dicing tape and of which width is narrower than the first blade. A semiconductor element sectioned by cutting the semiconductor wafer with the adhesive layer is picked up from the dicing tape, and is adhered on another semiconductor element or a circuit board.

公开(公告)号：US20050205981A1

公开(公告)日：2005-09-22

申请号：US11081596

申请日：2005-03-17

申请人： Atsushi Yoshimura ,  Tadanobu Ookubo ,  Yoshiaki Sugizaki ,  Susumu Harada

发明人： Atsushi Yoshimura ,  Tadanobu Ookubo ,  Yoshiaki Sugizaki ,  Susumu Harada

IPC分类号： H01L21/58 ,  H01L23/02 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/0652 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48992 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A stacked electronic part comprises a first electronic part which is adhered onto a circuit board via a first adhesive layer and a second electronic part which is adhered onto the first electronic part via a second adhesive layer. An insulating resin having a filling viscosity of 1 Pa·s or more and less than 1000 Pa·s or a photo-setting insulating resin is filled in the spaces below first bonding wires which are connected to the first electronic part. Thus, the occurrence of bubbles resulting from the resin non-filled portions below the wires can be prevented. Besides, the first electronic part and the second electronic part are adhered via an insulating resin layer having an adhering viscosity of 1 kPa·s or more and 100 kPa·s or less. Therefore, the occurrence of an insulation failure, a short circuit or the like resulting from a contact between the bonding wires of the lower electronic part and the upper electronic part can be prevented.

摘要翻译： 层叠的电子部件包括经由第一粘合层粘附到电路板上的第一电子部件和经由第二粘合剂层粘附到第一电子部件上的第二电子部件。 填充粘度为1Pa·s以上且小于1000Pa.s的绝缘树脂或光固化绝缘树脂填充在与第一电子部件连接的第一接合线下方的空间中。 因此，可以防止由导线下方的树脂未填充部分产生的气泡的发生。 此外，第一电子部件和第二电子部件通过粘附粘度为1kPa.s以上且100kPa·s以下的绝缘树脂层粘合。 因此，能够防止由下部电子部件的接合线与上部电子部件的接触而导致的绝缘破坏，短路等的发生。