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    Method and system of releasing a MEMS structure
    2.
    发明授权
    Method and system of releasing a MEMS structure 有权
    释放MEMS结构的方法和系统

    公开(公告)号：US07250353B2

    公开(公告)日：2007-07-31

    申请号：US11094101

    申请日：2005-03-29

    申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr. ,  Martin Lim

    发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr. ,  Martin Lim

    IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/326

    CPC分类号： B81C1/00333

    摘要： A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.

    摘要翻译： 提供了MEM（微机电系统）结构。 在一个实施方式中，MEM结构包括：衬底晶片，其包括形成在衬底晶片的表面上的MEMs器件;以及覆盖形成在衬底晶片表面上的MEM器件的MEM盖结构。 所述MEM覆盖结构包括结合到第二晶片的第一晶片，其中只有所述MEM的覆盖结构的所述第一晶片被锯切穿过，而在所述MEM结构的切割期间，所述MEM的第二晶片不覆盖所述结构。

    MEMS device including an electrical interconnect through a substrate
    4.
    发明授权
    MEMS device including an electrical interconnect through a substrate 有权
    MEMS器件包括通过衬底的电互连

    公开(公告)号：US08384134B2

    公开(公告)日：2013-02-26

    申请号：US13455494

    申请日：2012-04-25

    申请人： Michael J. Daneman ,  Steven S. Nasiri ,  Martin Lim

    发明人： Michael J. Daneman ,  Steven S. Nasiri ,  Martin Lim

    IPC分类号： H01L27/148 ,  H01L29/84 ,  H01L21/00

    CPC分类号： A45D27/42 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L21/76898

    摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

    摘要翻译： 公开了MEMS器件。 MEMS器件包括MEMS衬底和具有前表面，后表面和一个或多个金属化层的CMOS衬底。 前表面接合到MEMS基板上。 MEMS器件包括在CMOS衬底的背面上的一个或多个导电特征以及一个或多个金属化层与一个或多个导电特征之间的电连接。

    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
    5.
    发明授权
    Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures 有权
    具有保持在各种压力下的多个密封腔的CMOS-MEMS集成器件的方法

    公开(公告)号：US09540230B2

    公开(公告)日：2017-01-10

    申请号：US13535180

    申请日：2012-06-27

    申请人： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

    发明人： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

    IPC分类号： H01L23/02 ,  H01L21/54 ,  H01L29/84 ,  B81B7/02 ,  B81C1/00

    CPC分类号： B81B7/02 ,  B81C1/0023 ,  B81C1/00293 ,  B81C2203/0145 ,  B81C2203/019

    摘要： A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

    摘要翻译： 微机电系统（MEMS）结构包括MEMS晶片。 MEMS晶片包括具有通过布置在手柄和器件晶片之间的电介质层与器件晶片结合的空腔的手柄晶片。 MEMS晶片还包括悬挂在处理晶片中的空腔上的器件晶片的可移动部分。 描述了四种方法以在单个基底上产生具有多个气体压力或组成的两个或更多个外壳，包括每个外壳包含可移动部分。 方法包括：A.形成二次密封外壳，B.在晶片接合期间创建多个环境外壳，C.创建和破坏内部气体储存器，以及D.形成并随后将受控的泄漏/泄漏密封到外壳中。

    Method and system of releasing a MEMS structure
    6.
    发明申请
    Method and system of releasing a MEMS structure 有权
    释放MEMS结构的方法和系统

    公开(公告)号：US20060228831A1

    公开(公告)日：2006-10-12

    申请号：US11094101

    申请日：2005-03-29

    申请人： Steven Nasiri ,  Anthony Flannery ,  Martin Lim

    发明人： Steven Nasiri ,  Anthony Flannery ,  Martin Lim

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00333

    摘要： A method and system for releasing MEMS cover-structure on a wafer is disclosed. It includes at least one MEMS wafer structure made up of two wafers, one protective cover, and one containing at least one MEMS feature that are bonded together by various standard wafer bonding means. Also, one wafer substrate with patterned aluminum features and input/output pads. The method and system comprise providing for a built in channels between the said first cover wafer, and second said MEMS wafer allowing for a saw blade to cut a channel into the cover wafer, while the MEMS wafer providing for protection against saw slurries to get over the contact pad area on the said substrate wafer. Providing a tab area over the at least one bond pad and the dicing of the tab area to remove at least a portion of tab area above the at least one bond pad. A method and system of using industry dicing techniques to release the MEMS cover-structure from the substrate is disclosed. Dicing is much more benign chemically and is compatible with a much greater range of materials. The cost of dicing and complexity of infrastructure required are much less than that required for DRIE. Also, unlike conventional methods, a dicing release does not require an additional masking step.

    摘要翻译： 公开了一种用于在晶片上释放MEMS覆盖结构的方法和系统。 它包括由两个晶片组成的至少一个MEMS晶片结构，一个保护盖，以及包含通过各种标准晶片接合装置粘接在一起的至少一个MEMS特征的MEMS晶片结构。 而且，具有图案化铝特征的一个晶片衬底和输入/输出焊盘。 该方法和系统包括提供在所述第一覆盖晶片和第二所述MEMS晶片之间的内置通道，所述第二所述MEMS晶片允许锯片将通道切割入所述盖晶片，同时所述MEMS晶片提供保护以防止锯浆料过渡 所述衬底晶片上的接触焊盘区域。 在所述至少一个接合焊盘上提供突片区域，并且对所述突片区域进行切割以去除所述至少一个接合焊盘上方的突片区域的至少一部分。 公开了一种使用工业切割技术从基板释放MEMS覆盖结构的方法和系统。 切割化学性质更加良好，与更广泛的材料相容。 切割成本和所需基础设施的复杂性远低于DRIE要求的。 此外，与传统方法不同，切割释放不需要额外的掩模步骤。

    Micromachined apparatus and technique to align two dimensional fiber array
    8.
    发明授权
    Micromachined apparatus and technique to align two dimensional fiber array 失效
    微机械设备和技术对齐二维光纤阵列

    公开(公告)号：US06633708B1

    公开(公告)日：2003-10-14

    申请号：US09799965

    申请日：2001-03-06

    申请人： Martin Lim

    发明人： Martin Lim

    IPC分类号： G02B626

    CPC分类号： G02B6/4226

    摘要： Optical fibers are aligned in a jig of parallel apertured plates in which the fibers are inserted and positioned by the use of V-shaped or positioning ribbon actuators. The actuators are thermally actuated by a closed loop feedback system to center each individual fiber and its light output on an equivalent juxtaposed photodetector array. When the fiber is centered by this feedback technique it is permanently fixed in that position by potting, for example. The feedback control constitutes either a totally electrical system utilizing a processing unit or can be partially manually controlled by a human operator operating a joystick and viewing a meter or similar device which indicates an approach to a maximum output from a photodetector.

    摘要翻译： 光纤在平行孔板的夹具中排列，其中纤维通过使用V形或定位色带致动器插入和定位。 致动器由闭环反馈系统热启动，以将每个单独的光纤及其光输出集中在等效的并置的光电检测器阵列上。 当纤维由该反馈技术居中时，例如通过灌封将其永久固定在该位置。 反馈控制构成利用处理单元的完全电气系统，或者可以由操作操纵杆的人操作器部分手动控制，并且观察表示从光电检测器的最大输出的方法的仪表或类似装置。

    Bistable latching actuator for optical switching applications
    9.
    发明授权
    Bistable latching actuator for optical switching applications 失效
    用于光开关应用的双稳态闭锁执行器

    公开(公告)号：US06865313B2

    公开(公告)日：2005-03-08

    申请号：US10435511

    申请日：2003-05-09

    申请人： Minyao Mao ,  Martin Lim ,  Robert Ostrom

    发明人： Minyao Mao ,  Martin Lim ,  Robert Ostrom

    IPC分类号： G02B6/35

    CPC分类号： G02B6/358 ,  G02B6/3512 ,  G02B6/357

    摘要： Bistable latching actuator for use in optical fiber switching applications having a generally planar mechanism with an arm that carries a mirror for movement in a direction perpendicular to the plane of the mechanism, and a bistable mechanical latch for retaining the mirror in stable positions on opposite sides of the plane without contacting the arm. Movement between the two stable positions is initiated and damped with an electrostatic comb drive.

    摘要翻译： 用于光纤切换应用的双稳态闭锁致动器具有大致平面的机构，其具有臂，该臂具有在垂直于机构的平面的方向上运动的反射镜，以及用于将反射镜保持在相对侧的稳定位置的双稳态机械闩锁 不接触手臂。 启动两个稳定位置之间的运动并用静电梳驱动阻尼。

    Micromachined magnetic field sensors
    10.
    发明授权
    Micromachined magnetic field sensors 有权
    微加工磁场传感器

    公开(公告)号：US08395381B2

    公开(公告)日：2013-03-12

    申请号：US12833390

    申请日：2010-07-09

    申请人： Chiung C. Lo ,  Joseph Seeger ,  Martin Lim

    发明人： Chiung C. Lo ,  Joseph Seeger ,  Martin Lim

    IPC分类号： G01R33/02 ,  G01R33/09 ,  G01R33/07

    CPC分类号： G01R33/0011 ,  G01R33/07 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.

    摘要翻译： 公开了一种与电子器件集成的微加工磁场传感器。 磁场传感器利用霍尔效应感测机构实现3轴感测。 Z轴传感器可以在设备层或常规IC基板上制造，具有常规水平霍尔板的设计。 X和Y轴传感器构造在器件层上。 在一些实施例中，施加磁通集中器以增强磁场传感器的性能。 在一些实施例中，磁场传感器被放置在倾斜侧壁上以实现3轴磁感测系统。 在一些实施例中，结合了应力隔离结构以降低传感器偏移。 常规IC基板和器件层电连接以形成3轴磁感测系统。 磁场传感器也可以与以类似技术构造的运动传感器集成。