公开(公告)号：US4954406A

公开(公告)日：1990-09-04

申请号：US265557

申请日：1988-11-01

申请人： Keiichi Endo ,  Yasushi Shinbo ,  Akira Kageyama ,  Yasuo Katsuya ,  Chihiro Kato ,  Masato Fukasawa ,  Makoto Sekine

发明人： Keiichi Endo ,  Yasushi Shinbo ,  Akira Kageyama ,  Yasuo Katsuya ,  Chihiro Kato ,  Masato Fukasawa ,  Makoto Sekine

IPC分类号： G03G5/14

CPC分类号： G03G5/142

摘要： In an electrophotographic plate, that having an undercoating layer with smooth surface when observed by using a scanning electron microscope and an electric conductivity of at least 2.times.10.sup.-14 .OMEGA..sup.-1 .multidot.cm.sup.-1 between an electroconductive substrate and a photosensitive layer is improved in electrophotographic properties which are hardly changed by changes of circumstances.

公开(公告)号：US5233089A

公开(公告)日：1993-08-03

申请号：US139795

申请日：1987-12-30

申请人： Yasuo Katsuya ,  Takayuki Akimoto ,  Yoshii Morishita ,  Yasushi Shinbo ,  Akira Kageyama ,  Shigeru Hayashida

发明人： Yasuo Katsuya ,  Takayuki Akimoto ,  Yoshii Morishita ,  Yasushi Shinbo ,  Akira Kageyama ,  Shigeru Hayashida

IPC分类号： C07C217/62 ,  C07D209/86 ,  C07D215/38 ,  C07D263/48 ,  G03G5/06

CPC分类号： G03G5/0637 ,  C07C217/62 ,  C07D209/86 ,  C07D215/38 ,  C07D263/48 ,  G03G5/0614 ,  G03G5/0618 ,  G03G5/0629 ,  G03G5/0631

摘要： A novel enamine derivative is effective as a charge transport material and can provide an electrophotographic plate excellent in sensitivity, photoresponse and durability.

摘要翻译： 新颖的烯胺衍生物作为电荷传输材料是有效的，并且可以提供灵敏度，光响应和耐久性优异的电子照相平板。

公开(公告)号：US5604063A

公开(公告)日：1997-02-18

申请号：US977182

申请日：1992-11-16

申请人： Keiichi Endo ,  Seiji Miyaoka ,  Kouji Ohkoshi ,  Susumu Kaneko ,  Yasuo Katsuya ,  Akira Kageyama ,  Yoshii Morishita

发明人： Keiichi Endo ,  Seiji Miyaoka ,  Kouji Ohkoshi ,  Susumu Kaneko ,  Yasuo Katsuya ,  Akira Kageyama ,  Yoshii Morishita

IPC分类号： G03G5/05 ,  G03G5/06 ,  G03G15/02

CPC分类号： G03G5/0668 ,  G03G5/0564 ,  G03G5/0616 ,  Y10S430/106

摘要： An electrophotographic member which can give printed images of high quality and is markedly high in photoresponsiveness can be provided without using halogen solvents by using a composition for charge transport layer which contains a polycarbonate resin having a recurring structural unit represented by the following formula (I) and, if necessary, a specific styryl compound, a specific hydrazone compound and the like: ##STR1## wherein R.sub.1 and R.sub.2 =alkyl, etc.R.sub.3 through R.sub.18 =H, alkyl, etc.k/m=1/1-10/1.

摘要翻译： 通过使用含有具有由下式（I）表示的重复结构单元的聚碳酸酯树脂的电荷输送层用组合物，可以不使用卤素溶剂来提供能够赋予高质量且显着高的光响应性的印刷图像的电子照相构件， 必要时，特定的苯乙烯基化合物，特定的腙化合物等：其中R 1和R 2 =烷基等，R 3至R 18 = H，烷基等，k / m = 1/1 -10/1。

公开(公告)号：US4734347A

公开(公告)日：1988-03-29

申请号：US916697

申请日：1986-10-08

申请人： Keiichi Endo ,  Akira Kageyama ,  Yasuo Katsuya ,  Yasuki Mori

发明人： Keiichi Endo ,  Akira Kageyama ,  Yasuo Katsuya ,  Yasuki Mori

IPC分类号： G03G5/14 ,  G03G5/147

CPC分类号： G03G5/1473 ,  G03G5/14726

摘要： An electrophotographic plate having a protective layer comprising a fluorine-containing copolymer having monomer units of a fluoroolefin, and an alkyl vinyl ether and/or cycloalkyl vinyl ether on an organic photoconductive layer formed on the electroconductive layer is excellent in electrophotographic properties and durability.

摘要翻译： 具有保护层的电子照相板具有优异的电子照相特性和耐久性，所述保护层包含含氟烯烃单体单元的含氟共聚物和烷基乙烯基醚和/或环烷基乙烯基醚在形成于导电层上的有机光电导层上。

公开(公告)号：US5215842A

公开(公告)日：1993-06-01

申请号：US638544

申请日：1991-01-08

申请人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

发明人： Sukekazu Aratani ,  Shigeo Suzuki ,  Akira Hosoya ,  Katuo Sugawara ,  Toshiro Saito ,  Tsuneaki Kawanishi ,  Noriyuki Kinjo ,  Yasuo Katsuya ,  Akira Kageyama

IPC分类号： C07D215/12 ,  C07D233/64 ,  C07D235/04 ,  C07D263/32 ,  C07D263/56 ,  C07D277/28 ,  C07D277/66 ,  C07D277/84 ,  G03G5/06

CPC分类号： G03G5/0614 ,  C07D215/12 ,  C07D263/32 ,  C07D277/28 ,  G03G5/0631 ,  G03G5/0637 ,  G03G5/067

摘要： A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.

公开(公告)号：US07781896B2

公开(公告)日：2010-08-24

申请号：US12138637

申请日：2008-06-13

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US20100026683A1

公开(公告)日：2010-02-04

申请号：US11910184

申请日：2006-03-30

申请人： Fumiaki Araki ,  Akira Kageyama

发明人： Fumiaki Araki ,  Akira Kageyama

IPC分类号： G06T17/00

CPC分类号： G06T17/20 ,  G06T19/20 ,  G06T2219/2016

摘要： Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.

摘要翻译： 通过组合两个组件结构的网格构成的球形结构网格的网格结构化数据可以通过使用计算机图形技术进行显示。 坐标转换装置31将由球面坐标中的特定区域表示的第一和第二分量结构网格（分别称为N和E系统）的网格点坐标转换为计算机图形中使用的局部xyz坐标。 滤波器装置32分别获得N和E系统的第一和第二图形对象。 使用E系统旋转和N和E系统合成装置33，E系统的第二图形对象相对于第一局部xyz坐标系的x轴旋转90度，然后相对于 az轴，从而获得用于E系统的旋转的第二图形对象，然后合成两个图形对象。

公开(公告)号：US07078094B2

公开(公告)日：2006-07-18

申请号：US10891090

申请日：2004-07-15

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： B32B15/04 ,  H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US06404068B1

公开(公告)日：2002-06-11

申请号：US09763192

申请日：2001-02-20

申请人： Toshiaki Tanaka ,  Takafumi Dohdoh ,  Tsutomu Kitakatsu ,  Aizou Kaneda ,  Masaaki Yasuda ,  Takashi Kousaka ,  Akira Kageyama

发明人： Toshiaki Tanaka ,  Takafumi Dohdoh ,  Tsutomu Kitakatsu ,  Aizou Kaneda ,  Masaaki Yasuda ,  Takashi Kousaka ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/3128 ,  C08L63/00 ,  C08L71/00 ,  C08L71/126 ,  C08L77/00 ,  C08L77/06 ,  C08L83/10 ,  C09D177/00 ,  C09D177/06 ,  C09D179/08 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  C08L2666/02 ,  C08L2666/08 ,  C08L2666/04 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20753

摘要： A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.

摘要翻译： 作为必要成分（A）热塑性树脂，（B）环氧树脂，（C）偶联剂，（D）粉末状无机填料，（E）具有橡胶弹性的粉末和（F） 有机溶剂，当涂布并干燥时，得到空隙率为3体积％以上的涂膜，在40℃，90％RH下测定的水蒸气透过率为500g / m 2·24h， 减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜，其空隙率为3体积％以上，水分透过率为40℃，90％RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。