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公开(公告)号:US20050061659A1
公开(公告)日:2005-03-24
申请号:US10886716
申请日:2004-07-09
申请人: Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
发明人: Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
IPC分类号: C25D7/12 , C25D5/06 , C25D5/08 , C25D5/18 , C25D5/22 , C25D17/00 , C25D17/14 , C25D21/00 , C25D21/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/677 , H01L21/768
CPC分类号: H01L21/288 , C25D5/06 , C25D5/08 , C25D7/123 , C25D17/001 , H01L21/02068 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/2885 , H01L21/67028 , H01L21/6708 , H01L21/67109 , H01L21/6723 , H01L21/67751 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要: A plating apparatus is used for filling a fine interconnect pattern formed in a substrate with metal to form interconnects. The plating apparatus includes a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an electrode head disposed so as to be movable toward and away from the surface to be plated and having an anode and a porous member with water retentivity at upper and lower parts of the electrode head; a pressing mechanism for pressing the porous member against the surface, to be plated, of the substrate under a desired pressure; and a driving mechanism for making a relative motion between the porous member and the substrate while the porous member and the surface, to be plated, of the substrate are brought into contact with each other.
摘要翻译: 电镀装置用于用金属填充形成在衬底中的精细互连图案以形成互连。 电镀装置包括:阴极单元,具有密封部件,用于密封要被电镀的基板的周边部分和与基板接触的阴极电极,以向基板提供电流; 电极头,其设置成能够朝向和远离待镀表面移动,并且在电极头的上部和下部具有阳极和具有保水性的多孔构件; 用于在所需压力下将所述多孔构件按压在所述基板的要被电镀的表面上的按压机构; 以及用于在多孔构件和被电镀的表面彼此接触的同时在多孔构件和基底之间进行相对运动的驱动机构。